A Study of Integrated Semiconductor Thin-Film Sensors on Sio2/Si Substrate


Book Description

This dissertation, "A study of integrated semiconductor thin-film sensors on sio2/si substrate" by Bin, Li, 李斌, was obtained from The University of Hong Kong (Pokfulam, Hong Kong) and is being sold pursuant to Creative Commons: Attribution 3.0 Hong Kong License. The content of this dissertation has not been altered in any way. We have altered the formatting in order to facilitate the ease of printing and reading of the dissertation. All rights not granted by the above license are retained by the author. Abstract: Abstract of thesis entitled A STUDY OF INTERGATED SEMICONDUCTOR THIN-FILM SENSORS ON SiO /Si SUBSTRATE submitted by Bin Li for the degree of Doctor of Philosophy at the University of Hong Kong in April 2001 With the development of the information technology, the need for miniaturized, intelligent and programmable sensors is rapidly increasing. To meet this trend, developing thin-film sensors on silicon substrate is of great importance. In this thesis, two areas are focused on. One is spreading-resistance temperature (SRT) sensor on silicon on insulator (SOI), while the other is the multi-function thin-film microsensor on SiO /Si substrate. Based on the principle of minority-carrier exclusion effect, SRT sensor on bulk Si is intensively studied. Optimizations of structural parameters and processing conditions on thermal characteristics of SRT sensors are carried out. With appropriately small electrode and high substrate doping, bulk SRT sensor can function at temperatures up to 400 C at a low current of 2 mA. ii SRT sensor on SOI is then investigated with emphasis on its resistance versus temperature (R-T), low-temperature and AC characteristics. Moreover, the effect of Si- film thickness on the maximum operating temperature (T ) is simulated and verified by max experiment results. When the silicon film is sufficiently thin, i.e. 0.1 μm, T can be max significantly raised up to 550 C, even at a very low bias current of 1 μA. Measurements under low-temperature or AC condition reveal that SRT sensor behaves like a conventional resistor. A new microsensor consisting of a thin-film resistor and a metal-insulator- semiconductor (MIS) capacitor is developed by depositing perovskite-type thin film on SiO /Si substrate. SrNb Ti O, Ba La TiO and Ba La Nb Ti O chosen as the 2 x 1-x 3 1-x x 3 1-x x y 1-y 3 sensing film present reasonable multi-function sensitivities to light, heat and humidity. Differences in the sensing properties of the films are related to their chemical compositions and grain boundaries. It is hoped that by varying the chemical composition, processing conditions of the film, better performance could be obtained. Finally, the effects of device structure on the sensitivities of perovskite thin-film microsensors are discussed. A new physical model is proposed for humidity-sensitive MIS capacitor with a metal-perovskite-SiO -Si structure. Based on this model, it is deduced that higher sensitivity of thinner film is due to higher porosity of the film. However, thinner film results in lower sensitivity to illumination due to poorer absorption, iii while the film thickness only has minor effects on the thermal sensitivity. The effects of SiO thickness are studied and experimental results demonstrate that an optimal value of 250 A gives rise to good multi-function sensitivities. The dependence of electrical properties of photoresistor on device dimension is investigated. Devices with smaller electrode spacings show reasonably linear I-V characteristics. Moreover, heat treatment in O for an optimal time can increase the photo sensitivity by suppressing dark current. In conclusion, SOI SRT sensors and perovskite-oxide thin-film microsensors are promising candidates for integrated sensor applications.




Micronic Integrated Sensors


Book Description

Progress in material research, recent developments in growth techniques, as well as in processing technology and modelling, have had a great impact on sensors. The contributions in this volume will be of interest to all those who wish to keep abreast of recent developments in the interdisciplinary field of sensor research.




Semiconductor Wafer Bonding


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Radiation Imaging Detectors Using SOI Technology


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Silicon-on-Insulator (SOI) technology is widely used in high-performance and low-power semiconductor devices. The SOI wafers have two layers of active silicon (Si), and normally the bottom Si layer is a mere physical structure. The idea of making intelligent pixel detectors by using the bottom Si layer as sensors for X-ray, infrared light, high-energy particles, neutrons, etc. emerged from very early days of the SOI technology. However, there have been several difficult issues with fabricating such detectors and they have not become very popular until recently. This book offers a comprehensive overview of the basic concepts and research issues of SOI radiation image detectors. It introduces basic issues to implement the SOI detector and presents how to solve these issues. It also reveals fundamental techniques, improvement of radiation tolerance, applications, and examples of the detectors. Since the SOI detector has both a thick sensing region and CMOS transistors in a monolithic die, many ideas have emerged to utilize this technology. This book is a good introduction for people who want to develop or use SOI detectors.




Sensors: Fundamentals and general aspects


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"Sensors is the first self-contained series to deal with the whole area of sensors. It describes general aspects, technical and physical fundamentals, construction, function, applications and developments of the various types of sensors. Consisting of nine volumes altogether, with eight dedicated to various topics and the ninth as cumulative index, each volume offers in-depth information in one particular field within sensor technology. The entire set is an indispensable reference work for both specialists and newcomers, researchers and developers working in this interdisciplinary field that ranges from research to commercial application." -- Publisher's website.







Leading-edge Semiconductor Research


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This book includes within its scope studies of the structural, electrical, optical and acoustical properties of bulk, low-dimensional and amorphous semiconductors; computational semiconductor physics; interface properties, including the physics and chemistry of heterojunctions, metal-semiconductor and insulator-semiconductor junctions; all multi-layered structures involving semiconductor components. Dopant incorporation. Growth and preparation of materials, including both epitaxial (e.g. molecular beam and chemical vapour methods) and bulk techniques; in situ monitoring of epitaxial growth processes, also included are appropriate aspects of surface science such as the influence of growth kinetics and chemical processing on layer and device properties. The physics of semiconductor electronic and optoelectronic devices are examined , including theoretical modelling and experimental demonstration; all aspects of the technology of semiconductor device and circuit fabrication. Relevant areas of 'molecular electronics' and semiconductor structures incorporating Langmuir-Blodgett films; resists, lithography and metallisation where they are concerned with the definition of small geometry structure. The structural, electrical and optical characterisation of materials and device structures are also included. The scope encompasses materials and device reliability: reliability evaluation of technologies; failure analysis and advanced analysis techniques such as SEM, E-beam, optical emission microscopy, acoustic microscopy techniques; liquid crystal techniques; noise measurement, reliability prediction and simulation; reliability indicators; failure mechanisms, including charge migration, trapping, oxide breakdown, hot carrier effects, electro-migration, stress migration; package- related failure mechanisms; effects of operational and environmental stresses on reliability.







Encyclopedia of Optical and Photonic Engineering (Print) - Five Volume Set


Book Description

The first edition of the Encyclopedia of Optical and Photonic Engineering provided a valuable reference concerning devices or systems that generate, transmit, measure, or detect light, and to a lesser degree, the basic interaction of light and matter. This Second Edition not only reflects the changes in optical and photonic engineering that have occurred since the first edition was published, but also: Boasts a wealth of new material, expanding the encyclopedia’s length by 25 percent Contains extensive updates, with significant revisions made throughout the text Features contributions from engineers and scientists leading the fields of optics and photonics today With the addition of a second editor, the Encyclopedia of Optical and Photonic Engineering, Second Edition offers a balanced and up-to-date look at the fundamentals of a diverse portfolio of technologies and discoveries in areas ranging from x-ray optics to photon entanglement and beyond. This edition’s release corresponds nicely with the United Nations General Assembly’s declaration of 2015 as the International Year of Light, working in tandem to raise awareness about light’s important role in the modern world. Also Available Online This Taylor & Francis encyclopedia is also available through online subscription, offering a variety of extra benefits for researchers, students, and librarians, including: Citation tracking and alerts Active reference linking Saved searches and marked lists HTML and PDF format options Contact Taylor and Francis for more information or to inquire about subscription options and print/online combination packages. US: (Tel) 1.888.318.2367; (E-mail) [email protected] International: (Tel) +44 (0) 20 7017 6062; (E-mail) [email protected]