Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Distribution


Book Description

This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.




Compact Models and Measurement Techniques for High-Speed Interconnects


Book Description

Compact Models and Measurement Techniques for High-Speed Interconnects provides detailed analysis of issues related to high-speed interconnects from the perspective of modeling approaches and measurement techniques. Particular focus is laid on the unified approach (variational method combined with the transverse transmission line technique) to develop efficient compact models for planar interconnects. This book will give a qualitative summary of the various reported modeling techniques and approaches and will help researchers and graduate students with deeper insights into interconnect models in particular and interconnect in general. Time domain and frequency domain measurement techniques and simulation methodology are also explained in this book.




Development of Modeling, Simulation and Measurement Methodologies for Signal Integrity Analysis of High-Speed Packaging Interconnects


Book Description

As chip complexity and speed continue to increase, the packaging interconnects increasingly affect the performance of the electrical systems. Signal integrity analysis becomes exceedingly complex and important. The primary goal of this research is in-depth understanding of the signal integrity issue in high-speed chips and electronic systems, and development of modeling, simulation, and measurement methodologies for accurate and efficient characterization or prediction of the electrical characteristics of these on-chip and on-substrate packaging interconnects. The research is focused on three parts. First, a new broadband measurement method is proposed to determine the complex material properties of the dielectric materials in"as-packaged"environments, and to extract the frequency dependant RLGC parameters of the packaging interconnects. Second, a broadband CPW to microstrip via-less transition is developed to facilitate on-wafer measurement of microstrip based packaging structures. Third, microstrip lines over gridded ground plane are studied. Methodologies are proposed to efficiently simulate these structures in the frequency domain and time domain. SPICE compatible lumped-element models are developed. The methodologies and the lumped element models are verified by frequency domain and time domain measurement.




Interconnect Analysis and Synthesis


Book Description

State-of-the-art methods and current perspectives on interconnect The irrepressible march toward smaller and faster integrated circuits has made interconnect a hot topic for semiconductor research. The effects of wire size, topology construction, and network design on system performance and reliability have all been thoroughly investigated in recent years. Interconnect Analysis and Synthesis provides CAD researchers and engineers with powerful, state-of-the-art tools for the analysis, design, and optimization of interconnect. It brings together a wealth of information previously scattered throughout the literature, explaining in depth available analysis techniques and presenting a range of CAD algorithms for synthesizing and optimizing interconnect. Along with examples and results from the semiconductor industry and 150 illustrations, this practical work features: Models for interconnect as well as devices and the impact of scaling trends Modern analysis techniques, from matrix reduction and moment matching to transmission-line analysis An overview of the effects of inductance on on-chip interconnect Flexible CAD algorithms that can be generalized for different needs, from buffer insertion to wire sizing to routing topology Emphasis on realistic problem formulations, addressing key design tradeoffs such as those between area and performance







Science Abstracts


Book Description




IEE Proceedings


Book Description

Indexes IEE proceedings parts A through I







Foundations for Microstrip Circuit Design


Book Description

Building on the success of the previous three editions, Foundations for Microstrip Circuit Design offers extensive new, updated and revised material based upon the latest research. Strongly design-oriented, this fourth edition provides the reader with a fundamental understanding of this fast expanding field making it a definitive source for professional engineers and researchers and an indispensable reference for senior students in electronic engineering. Topics new to this edition: microwave substrates, multilayer transmission line structures, modern EM tools and techniques, microstrip and planar transmision line design, transmission line theory, substrates for planar transmission lines, Vias, wirebonds, 3D integrated interposer structures, computer-aided design, microstrip and power-dependent effects, circuit models, microwave network analysis, microstrip passive elements, and slotline design fundamentals.