Wireless World


Book Description





Book Description



















Components and Sub-Assemblies


Book Description

Please note this is a Short Discount publication. Access both contact and company information on all 4950 European manufacturers, distributors and agents for 550 electronics components and sub–assembly product classifications throughout West and East Europe in one comprehensive Volume. Applications: • Sourcing of specific product types through local distributors or manufacturers • Location of new regional channels of distribution or identification of new European business partners • Competitor tracking • Sales lead generation Entries include: • Key names executives • Full address, telephone and fax details • Size indications including number of employees • Products • Manufacturers represented and agency status







Extreme Environment Electronics


Book Description

Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.