Fabrication and Characterization of Thin Film Pressure Sensors Using Novel Materials


Book Description

Thin-film pressure sensors have received widespread attention in recent times due to its ease of manufacture, characterization, and fatigue strength. Commercial fabrication of these sensors is inexpensive and compatible with the current manufacturing technologies. It has been found that the sensitivity of the flexible pressure sensor depends on the sensing pressure, the microstructural dispersion of nanoparticles, and the compatibility of the binder and the nanoparticles. The binder/particle dispersion should be such that it facilitates the formation of a greater number of conduction paths with a slight change in sensing pressure. The objective of this thesis includes the fabrication and characterization of a thin-film pressure sensor using different novel materials. The first material to be investigated was ZnO. ZnO thin-film materials that have received a great deal of attention due to its unique properties of being a semiconductor with wide bandgap and piezoelectric effect. The sensor characteristic of ZnO was compared with barium-titanate (BaTiO3) Gallium arsenic (GaAs) and Polyvinylidene fluoride (PVDF). The second material to be investigated was aluminum-doped zinc oxide (AZO). AZO has attracted a great deal of attention in many applications because of its nontoxicity, abundancy, and lower cost than other materials such as indium tin oxide (ITO). The AZO films were deposited on polyethylene (PE) substrates by a radiofrequency (rf) magnetron sputtering method. The piezoresistive sensor was tested for different pressures in vacuum and gage pressure conditions. The response characteristics indicated that resistance increased with the bending of the AZO layer in both compressive and tensile operation modes. The sensor characteristics exhibited that the AZO piezoresistive sensor can be used to measure ambient pressure quantitatively. This investigation indicated that AZO can be used as an alternative material for the fabrication of pressure sensors. Lastly, the materials that were investigated are carbon black/ Poly (vinylidene fluoride) (CB/PVDF), graphene/PMMA, and graphene/PVDF composites. The conductive CB/PVDF material was prepared by the wet-cast method and deposited into a flexible polyethylene (PE) substrate, while the graphene composites were prepared by the solvent cast method. The surface morphology, crystal structure, and material properties were studied using SEM and X-ray diffraction methods. Sensitivity, response time, and recovery time were analyzed by testing the sample in the deferent pressure range and vibration modes. The repeatability and reproducibility characteristics of the sensor were studied and found that the sensor exhibits excellent characteristics. The sensors were subjected to different loading/unloading pressures. The resistance of the sensor remained stable indicating that the sensor had a high degree of reproducibility.




MEMS Pressure Sensors: Fabrication and Process Optimization


Book Description

MEMS Pressure Sensors: Fabrication and Process Optimization - describs the step by step fabrication process sequence along with flow chart for fabrication of micro pressure sensors taking into account various aspects of fabrication and designing of the pressure sensors as well as fabrication process optimization. A complete experimental detail before and after each step of fabrication of the sensor has also been discussed. This leads to the uniqueness of the book. MEMS Pressure Sensors: Fabrication and Process Optimization will greatly benefit undergraduate and postgraduate students of MEMS and NEMS courses. Process engineers and technologists in the microelectronics industry including MEMS-based sensors manufacturers.







Printed Flexible Sensors


Book Description

This book presents recent advances in the design, fabrication and implementation of flexible printed sensors. It explores a range of materials for developing the electrode and substrate parts of the sensors, on the basis of their electrical and mechanical characteristics. The sensors were processed using laser cutting and 3D printing techniques, and the sensors developed were employed in a number of healthcare, environmental and industrial applications, including: monitoring of physiological movements, respiration, salinity and nitrate measurement, and tactile sensing. The type of sensor selected for each application depended on its dimensions, robustness and sensitivity. The sensors fabricated were also embedded in an IoT-based system, allowing them to be integrated into real-time applications.




Fabrication and Characterization of Compound Semiconductor Sensors for Pressure, Gas, Chemical, and Biomaterial Sensing


Book Description

For biomaterials detection, the gate region was chemically modified with aminopropyl silane. As streptavidin was introduced to the biotin-functionalized gate region, the drain-source current showed a clear decrease of 4 [mu]A, which shows interaction between antibody and antigen. A Schottky diode was fabricated on a ZnO thin film and showed higher sensitivity to hydrogen (5 ppm). A single ZnO nanorod FET-based sensor was also demonstrated. Conductivity of the single nanorod sensor decreased linearly when the pH value of the solution varied from 2 to 12. The measured sensitivity was 8.5 nS/pH in the dark and 20 nS/pH under UV (365 nm) illumination, showing tremendous potential for sensing applications.













A Refresher Guide to Thin Film Technology


Book Description

Thin films have significantly impacted the present modern era of technology and are considered the backbone of advanced applications in various fields, such as optical devices, environmental applications, telecommunications devices, energy storage, photovoltaic solar cells, integrated circuits, and others. The critical issue for all applications of thin films depends on their morphology and stability. The morphology of thin films strongly depends on the deposition techniques. Hence due to its multidisciplinary nature, a background in thin film technology requires skills such as chemistry, physics, electrical engineering, and materials science and engineering