Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®


Book Description

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.




Assembly and Reliability of Lead-Free Solder Joints


Book Description

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.




Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®


Book Description

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.




Solid State Lighting Reliability Part 2


Book Description

In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, Solid State Lighting Reliability Part 2, we invited the experts from industry and academia to present the latest developments and findings in the LED system reliability arena. Topics in this book cover the early failures and critical steps in LED manufacturing; advances in reliability testing and standards; quality of colour and colour stability; degradation of optical materials and the associated chromaticity maintenance; characterization of thermal interfaces; LED solder joint testing and prediction; common failure modes in LED drivers; root causes for lumen depreciation; corrosion sensitivity of LED packages; reliability management for automotive LEDs, and lightning effects on LEDs. This book is a continuation of Solid State Lighting Reliability: Components to Systems (published in 2013), which covers reliability aspects ranging from the LED to the total luminaire or system of luminaires. Together, these two books are a full set of reference books for Solid State Lighting reliability from the performance of the (sub-) components to the total system, regardless its complexity.







Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture


Book Description

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. - Discusses how the reliability of packaging components is a prime concern to electronics manufacturers - Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques - Includes program files and macros for additional study




ANSYS Tutorial


Book Description

The eight lessons in this book introduce the reader to effective finite element problem solving by demonstrating the use of the comprehensive ANSYS FEM Release 14 software in a series of step-by-step tutorials. The tutorials are suitable for either professional or student use. The lessons discuss linear static response for problems involving truss, plane stress, plane strain, axisymmetric, solid, beam, and plate structural elements. Example problems in heat transfer, thermal stress, mesh creation and transferring models from CAD solid modelers to ANSYS are also included. The tutorials progress from simple to complex. Each lesson can be mastered in a short period of time, and lessons 1 through 7 should all be completed to obtain a thorough understanding of basic ANSYS structural analysis. The concise treatment includes examples of truss, beam and shell elements completely updated for use with ANSYS APDL 14.




ANSYS Workbench Tutorial Release 14


Book Description

The exercises in ANSYS Workbench Tutorial Release 14 introduce you to effective engineering problem solving through the use of this powerful modeling, simulation and optimization software suite. Topics that are covered include solid modeling, stress analysis, conduction/convection heat transfer, thermal stress, vibration, elastic buckling and geometric/material nonlinearities. It is designed for practicing and student engineers alike and is suitable for use with an organized course of instruction or for self-study. The compact presentation includes just over 100 end-of-chapter problems covering all aspects of the tutorials.




ANSYS Tutorial Release 13


Book Description

The eight lessons in this book introduce the reader to effective finite element problem solving by demonstrating the use of the comprehensive ANSYS FEM Release 13 software in a series of step-by-step tutorials. The tutorials are suitable for either professional or student use. The lessons discuss linear static response for problems involving truss, plane stress, plane strain, axisymmetric, solid, beam, and plate structural elements. Example problems in heat transfer, thermal stress, mesh creation and transferring models from CAD solid modelers to ANSYS are also included. The tutorials progress from simple to complex. Each lesson can be mastered in a short period of time, and Lessons 1 through 7 should all be completed to obtain a thorough understanding of basic ANSYS structural analysis.




ANSYS Tutorial Release 12.1


Book Description

The nine lessons in this book introduce the reader to effective finite element problem solving by demonstrating the use of the comprehensive ANSYS FEM Release 12.1 software in a series of step-by-step tutorials. The tutorials are suitable for either professional or student use. The lessons discuss linear static response for problems involving truss, plane stress, plane strain, axisymmetric, solid, beam, and plate structural elements. Example problems in heat transfer, thermal stress, mesh creation and transferring models from CAD solid modelers to ANSYS are also included. The tutorials progress from simple to complex. Each lesson can be mastered in a short period of time, and Lessons 1 through 7 should all be completed to obtain a thorough understanding of basic ANSYS structural analysis.