Author : Carl L. Yaws
Publisher : Elsevier
Page : 412 pages
File Size : 28,43 MB
Release : 1995-04-19
Category : Science
ISBN : 0080533345
This reference provides engineers with values for thermal conductivity as a function of temperature for the major organic compounds.
Author : Terry M. Tritt
Publisher : Springer Science & Business Media
Page : 306 pages
File Size : 49,88 MB
Release : 2006-10-03
Category : Science
ISBN : 038726017X
It has been almost thirty years since the publication of a book that is entirely dedicated to the theory, description, characterization and measurement of the thermal conductivity of solids. The recent discovery of new materials which possess more complex crystal structures and thus more complicated phonon scattering mechanisms have brought innovative challenges to the theory and experimental understanding of these new materials. With the development of new and novel solid materials and new measurement techniques, this book will serve as a current and extensive resource to the next generation researchers in the field of thermal conductivity. This book is a valuable resource for research groups and special topics courses (8-10 students), for 1st or 2nd year graduate level courses in Thermal Properties of Solids, special topics courses in Thermal Conductivity, Superconductors and Magnetic Materials, and to researchers in Thermoelectrics, Thermal Barrier Materials and Solid State Physics.
Author : Yves Jannot
Publisher : John Wiley & Sons
Page : 342 pages
File Size : 38,24 MB
Release : 2018-03-07
Category : Technology & Engineering
ISBN : 1786302551
This book presents the main methods used for thermal properties measurement. It aims to be accessible to all those, specialists in heat transfer or not, who need to measure the thermal properties of a material. The objective is to allow them to choose the measurement method the best adapted to the material to be characterized, and to pass on them all the theoretical and practical information allowing implementation with the maximum of precision.
Author : Myer Kutz
Publisher : John Wiley & Sons
Page : 1072 pages
File Size : 32,99 MB
Release : 2015-12-01
Category : Technology & Engineering
ISBN : 111845328X
A multidisciplinary reference of engineering measurementtools, techniques, and applications—Volume 2 "When you can measure what you are speaking about, and expressit in numbers, you know something about it; but when you cannotmeasure it, when you cannot express it in numbers, your knowledgeis of a meager and unsatisfactory kind; it may be the beginning ofknowledge, but you have scarcely in your thoughts advanced to thestage of science." — Lord Kelvin Measurement falls at the heart of any engineering discipline andjob function. Whether engineers are attempting to staterequirements quantitatively and demonstrate compliance; to trackprogress and predict results; or to analyze costs and benefits,they must use the right tools and techniques to produce meaningful,useful data. The Handbook of Measurement in Science and Engineering isthe most comprehensive, up-to-date reference set on engineeringmeasurements—beyond anything on the market today. Encyclopedicin scope, Volume 2 spans several disciplines—MaterialsProperties and Testing, Instrumentation, and MeasurementStandards—and covers: Viscosity Measurement Corrosion Monitoring Thermal Conductivity of Engineering Materials Optical Methods for the Measurement of ThermalConductivity Properties of Metals and Alloys Electrical Properties of Polymers Testing of Metallic Materials Testing and Instrumental Analysis for Plastics Processing Analytical Tools for Estimation of ParticulateCompositeMaterial Properties Input and Output Characteristics Measurement Standards and Accuracy Tribology Measurements Surface Properties Measurement Plastics Testing Mechanical Properties of Polymers Nondestructive Inspection Ceramics Testing Instrument Statics Signal Processing Bridge Transducers Units and Standards Measurement Uncertainty Data Acquisition and Display Systems Vital for engineers, scientists, and technical managers inindustry and government, Handbook of Measurement in Science andEngineering will also prove ideal for members of majorengineering associations and academics and researchers atuniversities and laboratories.
Author : David W. Hahn
Publisher : John Wiley & Sons
Page : 754 pages
File Size : 32,14 MB
Release : 2012-08-20
Category : Science
ISBN : 1118330110
HEAT CONDUCTION Mechanical Engineering THE LONG-AWAITED REVISION OF THE BESTSELLER ON HEAT CONDUCTION Heat Conduction, Third Edition is an update of the classic text on heat conduction, replacing some of the coverage of numerical methods with content on micro- and nanoscale heat transfer. With an emphasis on the mathematics and underlying physics, this new edition has considerable depth and analytical rigor, providing a systematic framework for each solution scheme with attention to boundary conditions and energy conservation. Chapter coverage includes: Heat conduction fundamentals Orthogonal functions, boundary value problems, and the Fourier Series The separation of variables in the rectangular coordinate system The separation of variables in the cylindrical coordinate system The separation of variables in the spherical coordinate system Solution of the heat equation for semi-infinite and infinite domains The use of Duhamel’s theorem The use of Green’s function for solution of heat conduction The use of the Laplace transform One-dimensional composite medium Moving heat source problems Phase-change problems Approximate analytic methods Integral-transform technique Heat conduction in anisotropic solids Introduction to microscale heat conduction In addition, new capstone examples are included in this edition and extensive problems, cases, and examples have been thoroughly updated. A solutions manual is also available. Heat Conduction is appropriate reading for students in mainstream courses of conduction heat transfer, students in mechanical engineering, and engineers in research and design functions throughout industry.
Author : Subhash L. Shinde
Publisher : Springer Science & Business Media
Page : 285 pages
File Size : 21,65 MB
Release : 2006-01-31
Category : Science
ISBN : 0387251006
The main objective of this book is to cover the basic understanding of thermal conduction mechanisms in various high thermal conductivity materials including diamond, cubic boron nitride, and also the latest material like carbon nanotubes. The book is intended as a good reference book for scientists and engineers involved in addressing thermal management issues in a broad spectrum of industries. Leading researchers from industry and academic institutions who are well known in their areas of expertise have contributed a chapter in the field of their interest.
Author : Y. S. Touloukian
Publisher : Springer
Page : 1812 pages
File Size : 28,14 MB
Release : 1977
Category : Science
ISBN :
that about 100 journals are required to yield fifty In 1957, the Thermophysical Properties Research percent. But that other fifty percent! It is scattered Center (TPRC) of Purdue University, under the leadership of its founder, Professor Y. S. Touloukian, through more than 3500 journals and other docu began to develop a coordinated experimental, ments, often items not readily identifiable or ob tainable. Over 85,000 references are now in the theoretical, and literature review program covering a set of properties of great importance to science and files. technology. Over the years, this program has grown Thus, the man who wants to use existing data, rather than make new measurements himself, faces steadily, producing bibliographies, data compila a long and costly task if he wants to assure himself tions and recommendations, experimental measure ments, and other output. The series of volumes for that he has found all the relevant results. More often which these remarks constitute a foreword is one of than not, a search for data stops after one or two results are found-or after the searcher decides he these many important products. These volumes are a monumental accomplishment in themselves, re has spent enough time looking. Now with the quiring for their production the combined knowledge appearance of these volumes, the scientist or engineer and skills of dozens of dedicated specialists. The who needs these kinds of data can consider himself very fortunate.
Author : Laszlo Kiss
Publisher : DEStech Publications, Inc
Page : 343 pages
File Size : 16,48 MB
Release : 2013-05-02
Category : Science
ISBN : 1605950556
New volume in the ITCC/ITES book series on thermal conductivity. Papers include applications related to thermophysical properties measurement methods, equipment, processes, theory, and new developments.
Author : Sohel Murshed
Publisher : Nova Science Publishers
Page : 0 pages
File Size : 23,21 MB
Release : 2021
Category : Science
ISBN : 9781685071967
"Thermal conductivity is one of the main properties of any materials as it plays a key role for their use in a wide range of essential applications. This book covers fundamentals of thermal conductivity, its measurements, mechanisms, and modeling for different important materials from multiphase systems and ceramic materials to emerging fluids like ionic liquids and suspensions of nanoparticles known as nanofluids. Despite being a popular topic under rapid evolution, knowledge on thermal conductivity of nanofluids is far from being mature. Besides discussion on various mechanisms and modeling, this book presents experimental findings related to the impact of various parameters on the thermal conductivity of these new fluids. It includes thermal conductivity of ionanocolloids which is a new type of nanofluids. The book is aimed to serve as a guide to research, education, and industries in the fields of heat transfer and exchange, cooling, and other thermal management"--
Author : Advanced Thermal Solutions
Publisher : Advanced Thermal Solutions
Page : 206 pages
File Size : 30,80 MB
Release : 2008
Category : Science
ISBN : 0984627901
The complete editorial contents of Qpedia Thermal eMagazine, Volume 2, Issues 1 - 12 features in-depth, technical articles on the most critical topics in the thermal management of electronics.
