Morphological Evolution of Electrodeposits and Electrochemical Processing in ULSI Fabrication and Electrodeposition of and on Semiconductors IV


Book Description

Papers in this volume are from the 199th ECS Meeting, held in Washington, DC, Spring 2001. Morphology evolution encompasses electrochemical processing in ULSI fabrication, shape evolution, growth habit, and microstructure of electrodeposits. The most prominent example at present is the electrochemical deposition of copper for ULSI interconnects. Many other electrochemical processes at various stages of emergence and development hold promise for the electronics industry and beyond.







Magnetic Materials Processes and Devices 11


Book Description

The Eleventh International Symposium on Magnetic Materials, Processes and Devices was held on Monday and Tuesday, October 11 and 12, 2010 as part of the 218th Meeting of Electrochemical Society in Las Vegas, Nevada. This international Symposium included presentations by 59 authors and co-authors from Canada, Germany, Italy, Japan, Korea, Norway and the United States.




Magnetic Materials, Processes, and Devices 10


Book Description

This issue of ECS Transactions brings together the work of electrochemists, physicists, engineers, and device designers working in the area of magnetic thin-film technology. Topics include electrochemical and electroless plating systems, etching, process chemistry, tool design, process control, film nucleation and growth, structure of deposits, stress, physics and micromagnetics of films, thermal and magnetic annealing. Applications include the fabrication of data recording systems, sensors, microelectrochemical systems (MEMS) and other magnetic devices.




Magnetic Materials, Processes, and Devices 9


Book Description

This issue documents the state of the field in magnetic thin film processing using electrochemical methods including film nucleation and growth, structure of deposits, stress and micromagnetics of films, thermal and magnetic annealing, electrochemical and electroless plating systems, etching, process chemistry, tool design, and process control.




Advances in Electrochemical Science and Engineering


Book Description

Like its predecessors, volume three of this meanwhile well-established series covers selected topics from electrochemical science and its applications. The authors have been carefully selected among the leaders in the respective fields. Their authoritative and comprehensive contributions represent the latest state-of-the-art. Special attention is paid to recent developments, which are critically and thoroughly discussed. Each contribution of the present volume continues the high standards of this series. This new series has been warmly welcomed by scientists world-wide, which is reflected by the following review of the second volume: 'All the contributions in this volume are well up to the standard of this excellent series and will be of great value to electrochemists... The editors again deserve to be congratulated on this fine collection of reviews.' Journal of Electroanalytical Chemistry and Interfacial Chemistry