Advanced Electrical and Electronics Materials


Book Description

This comprehensive and unique book is intended to cover the vast and fast-growing field of electrical and electronic materials and their engineering in accordance with modern developments. Basic and pre-requisite information has been included for easy transition to more complex topics. Latest developments in various fields of materials and their sciences/engineering, processing and applications have been included. Latest topics like PLZT, vacuum as insulator, fiber-optics, high temperature superconductors, smart materials, ferromagnetic semiconductors etc. are covered. Illustrations and examples encompass different engineering disciplines such as robotics, electrical, mechanical, electronics, instrumentation and control, computer, and their inter-disciplinary branches. A variety of materials ranging from iridium to garnets, microelectronics, micro alloys to memory devices, left-handed materials, advanced and futuristic materials are described in detail.




Reliability and Failure of Electronic Materials and Devices


Book Description

Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites




Flexible Electronics


Book Description

This excellent volume covers a range of materials used for flexible electronics, including semiconductors, dielectrics, and metals. The functional integration of these different materials is treated as well. Fundamental issues for both organic and inorganic materials systems are included. A corresponding overview of technological applications, based on each materials system, is presented to give both the non-specialist and the researcher in the field relevant information on the status of the flexible electronics area.







Organic Electronics


Book Description

In the near future, organic semiconductors may be used in a variety of products, including flat-screen TVs, e-book readers, and third-generation organic photovoltaics applications, to name just a few. While organic electronics has received increased attention in scientific journals, those working in this burgeoning field require more in-depth cover










Flexible and Wearable Electronics for Smart Clothing


Book Description

Provides the state-of-the-art on wearable technology for smart clothing The book gives a coherent overview of recent development on flexible electronics for smart clothing with emphasis on wearability and durability of the materials and devices. It offers detailed information on the basic functional components of the flexible and wearable electronics including sensing, systems-on-a-chip, interacting, and energy, as well as the integrating and connecting of electronics into textile form. It also provides insights into the compatibility and integration of functional materials, electronics, and the clothing technology. Flexible and Wearable Electronics for Smart Clothing offers comprehensive coverage of the technology in four parts. The first part discusses wearable organic nano-sensors, stimuli-responsive electronic skins, and flexible thermoelectrics and thermoelectric textiles. The next part examines textile triboelectric nanogenerators for energy harvesting, flexible and wearable solar cells and supercapacitors, and flexible and wearable lithium-ion batteries. Thermal and humid management for next-generation textiles, functionalization of fiber materials for washable smart wearable textiles, and flexible microfluidics for wearable electronics are covered in the next section. The last part introduces readers to piezoelectric materials and devices based flexible bio-integrated electronics, printed electronics for smart clothes, and the materials and processes for stretchable and wearable e-textile devices. -Presents the most recent developments in wearable technology such as wearable nanosensors, logic circuit, artificial intelligence, energy harvesting, and wireless communication -Covers the flexible and wearable electronics as essential functional components for smart clothing from sensing, systems-on-a-chip, interacting, energy to the integrating and connecting of electronics -Of high interest to a large and interdisciplinary target group, including materials scientists, textile chemists, and electronic engineers in academia and industry Flexible and Wearable Electronics for Smart Clothing will appeal to materials scientists, textile industry professionals, textile engineers, electronics engineers, and sensor developers.




Materials and Reliability Handbook for Semiconductor Optical and Electron Devices


Book Description

Materials and Reliability Handbook for Semiconductor Optical and Electron Devices provides comprehensive coverage of reliability procedures and approaches for electron and photonic devices. These include lasers and high speed electronics used in cell phones, satellites, data transmission systems and displays. Lifetime predictions for compound semiconductor devices are notoriously inaccurate due to the absence of standard protocols. Manufacturers have relied on extrapolation back to room temperature of accelerated testing at elevated temperature. This technique fails for scaled, high current density devices. Device failure is driven by electric field or current mechanisms or low activation energy processes that are masked by other mechanisms at high temperature. The Handbook addresses reliability engineering for III-V devices, including materials and electrical characterization, reliability testing, and electronic characterization. These are used to develop new simulation technologies for device operation and reliability, which allow accurate prediction of reliability as well as the design specifically for improved reliability. The Handbook emphasizes physical mechanisms rather than an electrical definition of reliability. Accelerated aging is useful only if the failure mechanism is known. The Handbook also focuses on voltage and current acceleration stress mechanisms.