Author : Yoshihiko Imanaka
Publisher : Springer Science & Business Media
Page : 252 pages
File Size : 26,39 MB
Release : 2006-05-28
Category : Technology & Engineering
ISBN : 0387233148
The only book to concentrate solely on low temperature cofired ceramics, an attractive technology for electronic components and substrates that are compact, light, and offer high-speed and functionality for portable electronic devices.
Author : Duixian Liu
Publisher : John Wiley & Sons
Page : 416 pages
File Size : 17,84 MB
Release : 2020-03-31
Category : Technology & Engineering
ISBN : 1119556635
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Author : Mailadil T. Sebastian
Publisher : John Wiley & Sons
Page : 1000 pages
File Size : 24,88 MB
Release : 2017-03-02
Category : Technology & Engineering
ISBN : 1119208556
The recent rapid progress in wireless telecommunication, including the Internet of Things, 5th generation wireless systems, satellite broadcasting, and intelligent transport systems has increased the need for low-loss dielectric materials and modern fabrication techniques. These materials have excellent electrical, dielectric, and thermal properties and have enormous potential, especially in wireless communication, flexible electronics, and printed electronics. Microwave Materials and Applications discusses the methods commonly employed for measuring microwave dielectric properties, the various attempts reported to solve problems of materials chemistry and crystal structure, doping, substitution, and composite formation, highlighting the processing techniques, morphology influences, and applications of microwave materials whilst summarizing many of the recent technical research accomplishments in the area of microwave dielectrics and applications Chapters examine: Oxide ceramics for dielectric resonators and substrates HTCC, LTCC and ULTCC tapes for substrates Polymer ceramic composites for printed circuit boards Elastomer-ceramic composites for flexible electronics Dielectric inks EMI shielding materials Microwave ferrites A comprehensive Appendix presents the fundamental properties for more than 4000 low-loss dielectric ceramics, their composition, crystal structure, and their microwave dielectric properties. Microwave Materials and Applications presents a comprehensive view of all aspects of microwave materials and applications, making it useful for scientists, industrialists, engineers, and students working on current and emerging applications of wireless communications and consumer electronics.
Author : Ralf Riedel
Publisher : John Wiley & Sons
Page : 555 pages
File Size : 46,74 MB
Release : 2011-12-12
Category : Technology & Engineering
ISBN : 3527311572
Although ceramics have been known to mankind literally for millennia, research has never ceased. Apart from the classic uses as a bulk material in pottery, construction, and decoration, the latter half of the twentieth century saw an explosive growth of application fields, such as electrical and thermal insulators, wear-resistant bearings, surface coatings, lightweight armour, or aerospace materials. In addition to plain, hard solids, modern ceramics come in many new guises such as fabrics, ultrathin films, microstructures and hybrid composites. Built on the solid foundations laid down by the 20-volume series Materials Science and Technology, Ceramics Science and Technology picks out this exciting material class and illuminates it from all sides. Materials scientists, engineers, chemists, biochemists, physicists and medical researchers alike will find this work a treasure trove for a wide range of ceramics knowledge from theory and fundamentals to practical approaches and problem solutions.
Author : Mahmoud Rasras
Publisher : MDPI
Page : 252 pages
File Size : 18,37 MB
Release : 2019-05-27
Category : Technology & Engineering
ISBN : 3038974145
Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc. This Special Issue on "MEMS Accelerometers" seeks to highlight research papers, short communications, and review articles that focus on: Novel designs, fabrication platforms, characterization, optimization, and modeling of MEMS accelerometers. Alternative transduction techniques with special emphasis on opto-mechanical sensing. Novel applications employing MEMS accelerometers for consumer electronics, industries, medicine, entertainment, navigation, etc. Multi-physics design tools and methodologies, including MEMS-electronics co-design. Novel accelerometer technologies and 9DoF IMU integration. Multi-accelerometer platforms and their data fusion.
Author : Maria Prudenziati
Publisher : Elsevier
Page : 609 pages
File Size : 50,80 MB
Release : 2012-08-30
Category : Technology & Engineering
ISBN : 0857096214
Whilst printed films are currently used in varied devices across a wide range of fields, research into their development and properties is increasingly uncovering even greater potential. Printed films provides comprehensive coverage of the most significant recent developments in printed films and their applications.Materials and properties of printed films are the focus of part one, beginning with a review of the concepts, technologies and materials involved in their production and use. Printed films as electrical components and silicon metallization for solar cells are discussed, as are conduction mechanisms in printed film resistors, and thick films in packaging and microelectronics. Part two goes on to review the varied applications of printed films in devices. Printed resistive sensors are considered, as is the role of printed films in capacitive, piezoelectric and pyroelectric sensors, mechanical micro-systems and gas sensors. The applications of printed films in biosensors, actuators, heater elements, varistors and polymer solar cells are then explored, followed by a review of screen printing for the fabrication of solid oxide fuel cells and laser printed micro- and meso-scale power generating devices.With its distinguished editors and international team of expert contributors, Printed films is a key text for anyone working in such fields as microelectronics, fuel cell and sensor technology in both industry and academia. - Provides a comprehensive analysis of the most significant recent developments in printed films and their applications - Reviews the concepts, properties, technologies and materials involved in the production and use of printed films - Analyses the varied applications of printed films in devices, including printed restrictive sensors for physical quantities and printed thick film mechanical micro-systems (MEMS), among others
Author : Burcu Ertug
Publisher : BoD – Books on Demand
Page : 354 pages
File Size : 30,41 MB
Release : 2013-02-06
Category : Technology & Engineering
ISBN : 953510974X
Sintering is one of the final stages of ceramics fabrication and is used to increase the strength of the compacted material. In the Sintering of Ceramics section, the fabrication of electronic ceramics and glass-ceramics were presented. Especially dielectric properties were focused on. In other chapters, sintering behaviour of ceramic tiles and nano-alumina were investigated. Apart from oxides, the sintering of non-oxide ceramics was examined. Sintering the metals in a controlled atmosphere furnace aims to bond the particles together metallurgically. In the Sintering of Metals section, two sections dealt with copper containing structures. The sintering of titanium alloys is another topic focused in this section. The chapter on lead and zinc covers the sintering in the field of extractive metallurgy. Finally two more chapter focus on the basics of sintering,i.e viscous flow and spark plasma sintering.
Author : Vesna Crnojević-Bengin
Publisher : Cambridge University Press
Page : 331 pages
File Size : 45,73 MB
Release : 2015-06-11
Category : Technology & Engineering
ISBN : 1107081971
The first of its kind, this comprehensive work details the theory and practical design of new multi-band filters.
Author : Sergey Yurish
Publisher : Lulu.com
Page : 560 pages
File Size : 21,30 MB
Release : 2014-07-14
Category : Technology & Engineering
ISBN : 846164154X
Sensors and Biosensors, MEMS Technologies and its Applications (Book Series: Advances in Sensors: Reviews, Vol. 2) - 18 chapters with sensor related state-of-the-art reviews and descriptions of the latest achievements written by experts from academia and industry from 12 countries: China, India, Iran, Malaysia, Poland, Singapore, Spain, Taiwan, Thailand, UK, Ukraine and USA. This volume is divided into three main parts: physical sensors, biosensors, nanoparticles, MEMS technologies and applications. With this unique combination of information in each volume, the Advances in Sensors: Reviews Book Series will be of value for scientists and engineers in industry and at universities, to sensors developers, distributors, and users. Like the 1st volume of this Book Series, the 2nd volume also has been organized by topics of high interest.
Author : Narottam P. Bansal
Publisher : John Wiley & Sons
Page : 598 pages
File Size : 27,28 MB
Release : 2012-04-17
Category : Technology & Engineering
ISBN : 0470553448
Examines the latest processing and fabrication methods There is increasing interest in the application of advanced ceramic materials in diverse areas such as transportation, energy, environmental protection and remediation, communications, health, and aerospace. This book guides readers through a broad selection of key processing techniques for ceramics and their composites, enabling them to manufacture ceramic products and components with the properties needed for various industrial applications. With chapters contributed by internationally recognized experts in the field of ceramics, the book includes traditional fabrication routes as well as new and emerging approaches in order to meet the increasing demand for more reliable ceramic materials. Ceramics and Composites Processing Methods is divided into three sections: * Densification, covering the fundamentals and practice of sintering, pulsed electric current sintering, and viscous phase silicate processing * Chemical Methods, examining colloidal methods, sol-gel, gel casting, polymer processing, chemical vapor deposition, chemical vapor infiltration, reactive melt infiltration, and combustion synthesis * Physical Methods, including directional solidification, solid free-form fabrication, microwave processing, electrophoretic deposition, and plasma spraying Each chapter focuses on a particular processing method or approach. Collectively, these chapters offer readers comprehensive, state-of-the-science information on the many approaches, techniques, and methods for the processing and fabrication of advanced ceramics and ceramic composites. With its coverage of the latest processing methods, Ceramics and Composites Processing Methods is recommended for researchers and students in ceramics, materials science, structural materials, biomedical engineering, and nanotechnology.
