Author : David Fisher
Publisher :
Page : 180 pages
File Size : 31,75 MB
Release : 2018-01-15
Category : Technology & Engineering
ISBN : 9781945291487
All you want to know about negative thermal expansion materials in an easy to read condensed format. The development of these negative thermal expansion materials has advanced rapidly during the past fifteen years. This is the most up-to-date summary of the current range of negative thermal expansion materials and of the associated mechanisms.
Author : Takeshi Egami
Publisher : Elsevier
Page : 424 pages
File Size : 35,24 MB
Release : 2003-10-02
Category : Science
ISBN : 0080426980
Table of contents
Author : D.J. Fisher
Publisher : Materials Research Forum LLC
Page : 179 pages
File Size : 15,74 MB
Release : 2018-01-15
Category : Technology & Engineering
ISBN : 1945291494
In everyday life, minute thermally-induced elongations are essentially invisible to the naked eye; but even minute expansions can fatally degrade device processing and performance in – for example – the semiconductor industry. Materials which, astonishingly, contract upon heating offer the great advantage of being able to tune the overall thermal expansion of composite materials or to act as thermal-expansion compensators. The development of these negative thermal expansion materials has advanced rapidly during the past fifteen years, and a wide variety of materials of differing types has now been identified, as well as a number of intriguing mechanisms which help to avoid the apparent inviolable tendency of size to increase with temperature. The present work is the most up-to-date summary of the current range of negative thermal expansion materials and of the associated mechanisms. Negative Thermal Expansion Materials, Thermomiotic Behavior, Thermal Stress-Fracture, Thermal Expansion of Composites, Thin-Film Design, Metamaterials
Author : Teik-Cheng Lim
Publisher : Springer Nature
Page : 702 pages
File Size : 11,44 MB
Release : 2020-07-23
Category : Technology & Engineering
ISBN : 9811564469
This book discusses bulk solids that derive their mechanical properties not from those of their base materials, but from their designed microstructures. Focusing on the negative mechanical properties, it addresses topics that reveal the counter-intuitive nature of solids, specifically the negativity of properties that are commonly positive, such as negative bulk modulus, negative compressibility, negative hygroexpansion, negative thermal expansion, negative stiffness phase, and negative Poisson’s ratio. These topics are significant not only due to the curiosity they have sparked, but also because of the possibility of designing materials and structures that can behave in ways that are not normally expected in conventional solids, and as such, of materials that can outperform solids and structures made from conventional materials. The book includes illustrations to facilitate learning, and, where appropriate, reference tables. The presentation is didactic, starting with simple cases, followed by increasingly complex ones. It provides a solid foundation for graduate students, and a valuable resource for practicing materials engineers seeking to develop novel materials through the judicious design of microstructures and their corresponding mechanisms.
Author : Guglielmo Ventura
Publisher : Springer
Page : 220 pages
File Size : 12,19 MB
Release : 2014-06-23
Category : Science
ISBN : 940178969X
The minimum temperature in the natural universe is 2.7 K. Laboratory refrigerators can reach temperatures in the microkelvin range. Modern industrial refrigerators cool foods at 200 K, whereas space mission payloads must be capable of working at temperatures as low as 20 K. Superconducting magnets used for NMR work at 4.2 K. Hence the properties of materials must be accurately known also at cryogenic temperatures. This book provides a guide for engineers, physicists, chemists, technicians who wish to approach the field of low-temperature material properties. The focus is on the thermal properties and a large spectrum of experimental cases is reported. The book presents updated tables of low-temperature data on materials and a thorough bibliography supplements any further research. Key Features include: ° Detailed technical description of experiments ° Description of the newest cryogenic apparatus ° Offers data on cryogenic properties of the latest new materials ° Current reference review
Author : Mahmood M. Shokrieh
Publisher : Woodhead Publishing
Page : 407 pages
File Size : 28,26 MB
Release : 2014-02-14
Category : Technology & Engineering
ISBN : 0857098594
Residual stresses are a common phenomenon in composite materials. They can either add to or significantly reduce material strength. Because of the increasing demand for high-strength, light-weight materials such as composites and their wide range of applications in the aerospace and automotive industries, in civil infrastructure and in sporting applications, it is critical that the residual stresses of composite materials are understood and measured correctly.The first part of this important book reviews destructive and non-destructive testing (NDT) techniques for measuring residual stresses. Various mathematical (analytical and numerical) methods for calculation of residual stresses in composite materials are also presented. Chapters in the first section of the book discuss the simulated hole drilling method, the slitting/crack compliance method, measuring residual stresses in homogeneous and composite glass materials using photoelastic techniques, and modeling residual stresses in composite materials. The second part of the book discusses residual stresses in polymer matrix, metal-matrix and a range of other types of composites. Moreover, the addition of nanoparticles to the matrix of polymeric composites as a new technique for reduction of residual stresses is discussed.Residual stresses in composite materials provides a comprehensive overview of this important topic, and is an invaluable reference text for both academics and professionals working in the mechanical engineering, civil engineering, aerospace, automotive, marine and sporting industries. - Reviews destructive and non-destructive testing (NDT) techniques for measuring residual stresses - Discusses residual stresses in polymer matrix, metal-matrix and other types of composite - Considers the addition of nanoparticles to the matrix of polymeric composites as a new technique for reduction of residual stresses
Author : T.H.K. Barron
Publisher : Springer Science & Business Media
Page : 342 pages
File Size : 22,33 MB
Release : 2012-12-06
Category : Science
ISBN : 1461546958
The birth of this monograph is partly due to the persistent efforts of the General Editor, Dr. Klaus Timmerhaus, to persuade the authors that they encapsulate their forty or fifty years of struggle with the thermal properties of materials into a book before they either expired or became totally senile. We recognize his wisdom in wanting a monograph which includes the closely linked properties of heat capacity and thermal expansion, to which we have added a little 'cement' in the form of elastic moduli. There seems to be a dearth of practitioners in these areas, particularly among physics postgraduate students, sometimes temporarily alleviated when a new generation of exciting materials are found, be they heavy fermion compounds, high temperature superconductors, or fullerenes. And yet the needs of the space industry, telecommunications, energy conservation, astronomy, medical imaging, etc. , place demands for more data and understanding of these properties for all classes of materials - metals, polymers, glasses, ceramics, and mixtures thereof. There have been many useful books, including Specific Heats at Low Tempera tures by E. S. Raja Gopal (1966) in this Plenum Cryogenic Monograph Series, but few if any that covered these related topics in one book in a fashion designed to help the cryogenic engineer and cryophysicist. We hope that the introductory chapter will widen the horizons of many without a solid state background but with a general interest in physics and materials.
Author : Fran Cverna
Publisher : ASM International
Page : 564 pages
File Size : 46,4 MB
Release : 2002-01-01
Category : Technology & Engineering
ISBN : 0871707683
A quick and easy to use source for qualified thermal properties of metals and alloys. The data tables are arranged by material hierarchy, with summary tables sorted by property value. Values are given for a range of high and low temperatures. Short technical discussions at the beginning of each chapter are designed to refresh the reader's understanding of the properties and units covered in that section
Author : Robert Joseph Corruccini
Publisher :
Page : 34 pages
File Size : 37,26 MB
Release : 1961
Category : Science
ISBN :
Author : N.M. Ravindra
Publisher : Morgan & Claypool Publishers
Page : 160 pages
File Size : 16,89 MB
Release : 2017-08-21
Category : Science
ISBN : 1681741768
Optical properties, particularly in the infrared range of wavelengths, continue to be of enormous interest to both material scientists and device engineers. The need for the development of standards for data of optical properties in the infrared range of wavelengths is very timely considering the on-going transition of nano-technology from fundamental R&D to manufacturing. Radiative properties play a critical role in the processing, process control and manufacturing of semiconductor materials, devices, circuits and systems. The design and implementation of real-time process control methods in manufacturing requires the knowledge of the radiative properties of materials. Sensors and imagers operate on the basis of the radiative properties of materials. This book reviews the optical properties of various semiconductors in the infrared range of wavelengths. Theoretical and experimental studies of the radiative properties of semiconductors are presented. Previous studies, potential applications and future developments are outlined. In Chapter 1, an introduction to the radiative properties is presented. Examples of instrumentation for measurements of the radiative properties is described in Chapter 2. In Chapters 3-11, case studies of the radiative properties of several semiconductors are elucidated. The modeling and applications of these properties are explained in Chapters 12 and 13, respectively. In Chapter 14, examples of the global infrastructure for these measurements are illustrated.
