Book Description

An atomic layer deposition (ALD) technique for applying very thin platinum coatings onto nickel substrates is presented. In this research, a removable nickel rotating disk electrode was used as the substrate for a process involving MeCpPtMe3 and H2, both of which were in the gas phase when exposed to the substrate. The substrate was exposed to the two aforementioned compounds sequentially. Ultra pure N2 was used to remove each component before introducing the next one into the chamber. This process of alternately exposing the nickel disk to MeCpPtMe3 and H2 (with N2 in between) was repeated for specified numbers of times in order to produce films of various thicknesses. Electrochemical properties of the coatings were tested using rotating disk electrode geometry. On several occasions, the total amount of Pt applied was determined in order to assess the economic feasibility of potential scale up.