Author : Shahrzad Salemi
Publisher : RIAC
Page : 271 pages
File Size : 35,67 MB
Release : 2008
Category : Electronic apparatus and appliances
ISBN : 1933904291
Author : Willem Dirk van Driel
Publisher : Springer Nature
Page : 552 pages
File Size : 37,64 MB
Release : 2022-01-31
Category : Technology & Engineering
ISBN : 3030815765
This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.
Author : Joseph B. Bernstein
Publisher : John Wiley & Sons
Page : 404 pages
File Size : 16,8 MB
Release : 2024-02-20
Category : Technology & Engineering
ISBN : 1394210930
RELIABILITY PREDICTION FOR MICROELECTRONICS Wiley Series in Quality & Reliability Engineering REVOLUTIONIZE YOUR APPROACH TO RELIABILITY ASSESSMENT WITH THIS GROUNDBREAKING BOOK Reliability evaluation is a critical aspect of engineering, without which safe performance within desired parameters over the lifespan of machines cannot be guaranteed. With microelectronics in particular, the challenges to evaluating reliability are considerable, and statistical methods for creating microelectronic reliability standards are complex. With nano-scale microelectronic devices increasingly prominent in modern life, it has never been more important to understand the tools available to evaluate reliability. Reliability Prediction for Microelectronics meets this need with a cluster of tools built around principles of reliability physics and the concept of remaining useful life (RUL). It takes as its core subject the ‘physics of failure’, combining a thorough understanding of conventional approaches to reliability evaluation with a keen knowledge of their blind spots. It equips engineers and researchers with the capacity to overcome decades of errant reliability physics and place their work on a sound engineering footing. Reliability Prediction for Microelectronics readers will also find: Focus on the tools required to perform reliability assessments in real operating conditions Detailed discussion of topics including failure foundation, reliability testing, acceleration factor calculation, and more New multi-physics of failure on DSM technologies, including TDDB, EM, HCI, and BTI Reliability Prediction for Microelectronics is ideal for reliability and quality engineers, design engineers, and advanced engineering students looking to understand this crucial area of product design and testing.
Author : Franklin Richard Nash, Ph.D.
Publisher : CRC Press
Page : 784 pages
File Size : 40,5 MB
Release : 2017-07-12
Category : Business & Economics
ISBN : 1498719201
This book provides engineers and scientists with a single source introduction to the concepts, models, and case studies for making credible reliability assessments. It satisfies the need for thorough discussions of several fundamental subjects. Section I contains a comprehensive overview of assessing and assuring reliability that is followed by discussions of: • Concept of randomness and its relationship to chaos • Uses and limitations of the binomial and Poisson distributions • Relationship of the chi-square method and Poisson curves • Derivations and applications of the exponential, Weibull, and lognormal models • Examination of the human mortality bathtub curve as a template for components Section II introduces the case study modeling of failure data and is followed by analyses of: • 5 sets of ideal Weibull, lognormal, and normal failure data • 83 sets of actual (real) failure data The intent of the modeling was to find the best descriptions of the failures using statistical life models, principally the Weibull, lognormal, and normal models, for characterizing the failure probability distributions of the times-, cycles-, and miles-to-failure during laboratory or field testing. The statistical model providing the preferred characterization was determined empirically by choosing the two-parameter model that gave the best straight-line fit in the failure probability plots using a combination of visual inspection and three statistical goodness-of-fit (GoF) tests. This book offers practical insight in dealing with single item reliability and illustrates the use of reliability methods to solve industry problems.
Author : Joseph Bernstein
Publisher : Academic Press
Page : 108 pages
File Size : 30,64 MB
Release : 2014-03-06
Category : Technology & Engineering
ISBN : 0128008199
This work will educate chip and system designers on a method for accurately predicting circuit and system reliability in order to estimate failures that will occur in the field as a function of operating conditions at the chip level. This book will combine the knowledge taught in many reliability publications and illustrate how to use the knowledge presented by the semiconductor manufacturing companies in combination with the HTOL end-of-life testing that is currently performed by the chip suppliers as part of their standard qualification procedure and make accurate reliability predictions. This book will allow chip designers to predict FIT and DPPM values as a function of operating conditions and chip temperature so that users ultimately will have control of reliability in their design so the reliability and performance will be considered concurrently with their design. - The ability to include reliability calculations and test results in their product design - The ability to use reliability data provided to them by their suppliers to make meaningful reliability predictions - Have accurate failure rate calculations for calculating warrantee period replacement costs
Author : Constantin Volosencu
Publisher : BoD – Books on Demand
Page : 398 pages
File Size : 43,60 MB
Release : 2017-12-20
Category : Technology & Engineering
ISBN : 9535137050
Researchers from the entire world write to figure out their newest results and to contribute new ideas or ways in the field of system reliability and maintenance. Their articles are grouped into four sections: reliability, reliability of electronic devices, power system reliability and feasibility and maintenance. The book is a valuable tool for professors, students and professionals, with its presentation of issues that may be taken as examples applicable to practical situations. Some examples defining the contents can be highlighted: system reliability analysis based on goal-oriented methodology; reliability design of water-dispensing systems; reliability evaluation of drivetrains for off-highway machines; extending the useful life of asset; network reliability for faster feasibility decision; analysis of standard reliability parameters of technical systems' parts; cannibalisation for improving system reliability; mathematical study on the multiple temperature operational life testing procedure, for electronic industry; reliability prediction of smart maximum power point converter in photovoltaic applications; reliability of die interconnections used in plastic discrete power packages; the effects of mechanical and electrical straining on performances of conventional thick-film resistors; software and hardware development in the electric power system; electric interruptions and loss of supply in power systems; feasibility of autonomous hybrid AC/DC microgrid system; predictive modelling of emergency services in electric power distribution systems; web-based decision-support system in the electric power distribution system; preventive maintenance of a repairable equipment operating in severe environment; and others.
Author : Cary Spitzer
Publisher : CRC Press
Page : 841 pages
File Size : 35,13 MB
Release : 2017-11-22
Category : Technology & Engineering
ISBN : 1351832875
A perennial bestseller, the Digital Avionics Handbook offers a comprehensive view of avionics. Complete with case studies of avionics architectures as well as examples of modern systems flying on current military and civil aircraft, this Third Edition includes: Ten brand-new chapters covering new topics and emerging trends Significant restructuring to deliver a more coherent and cohesive story Updates to all existing chapters to reflect the latest software and technologies Featuring discussions of new data bus and display concepts involving retina scanning, speech interaction, and synthetic vision, the Digital Avionics Handbook, Third Edition provides practicing and aspiring electrical, aerospace, avionics, and control systems engineers with a pragmatic look at the present state of the art of avionics.
Author : Mohammad Modarres
Publisher : CRC Press
Page : 644 pages
File Size : 39,95 MB
Release : 2016-11-25
Category : Technology & Engineering
ISBN : 149874589X
This undergraduate and graduate textbook provides a practical and comprehensive overview of reliability and risk analysis techniques. Written for engineering students and practicing engineers, the book is multi-disciplinary in scope. The new edition has new topics in classical confidence interval estimation; Bayesian uncertainty analysis; models for physics-of-failure approach to life estimation; extended discussions on the generalized renewal process and optimal maintenance; and further modifications, updates, and discussions. The book includes examples to clarify technical subjects and many end of chapter exercises. PowerPoint slides and a Solutions Manual are also available.
Author : Mohammad Modarres
Publisher : CRC Press
Page : 481 pages
File Size : 28,27 MB
Release : 2023-04-26
Category : Technology & Engineering
ISBN : 1000864103
Emphasises an introduction and explanation of the practical methods used in reliability, and risk studies with a discussion of their uses and limitations Offers basic and advanced methods in reliability analysis that are commonly used in daily practice Provides methods that address unique topics such as dependent failure analysis, importance analysis, and analysis of repairable systems Presents a comprehensive overview of modern probabilistic life assessment methods such as Bayesian estimation, system reliability analysis, and human reliability Includes many ends of chapter problems, a tools website with computational codes, along with a solutions manual to support course adoptions
Author : Philip Garrou
Publisher : John Wiley & Sons
Page : 798 pages
File Size : 49,8 MB
Release : 2011-09-22
Category : Technology & Engineering
ISBN : 352762306X
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
