Catalog of Copyright Entries. Third Series


Book Description

Includes Part 1, Number 1: Books and Pamphlets, Including Serials and Contributions to Periodicals (January - June)







WADC Technical Report


Book Description




Handbook Reliability Engineering


Book Description










Reliability Assessments


Book Description

This book provides engineers and scientists with a single source introduction to the concepts, models, and case studies for making credible reliability assessments. It satisfies the need for thorough discussions of several fundamental subjects. Section I contains a comprehensive overview of assessing and assuring reliability that is followed by discussions of: • Concept of randomness and its relationship to chaos • Uses and limitations of the binomial and Poisson distributions • Relationship of the chi-square method and Poisson curves • Derivations and applications of the exponential, Weibull, and lognormal models • Examination of the human mortality bathtub curve as a template for components Section II introduces the case study modeling of failure data and is followed by analyses of: • 5 sets of ideal Weibull, lognormal, and normal failure data • 83 sets of actual (real) failure data The intent of the modeling was to find the best descriptions of the failures using statistical life models, principally the Weibull, lognormal, and normal models, for characterizing the failure probability distributions of the times-, cycles-, and miles-to-failure during laboratory or field testing. The statistical model providing the preferred characterization was determined empirically by choosing the two-parameter model that gave the best straight-line fit in the failure probability plots using a combination of visual inspection and three statistical goodness-of-fit (GoF) tests. This book offers practical insight in dealing with single item reliability and illustrates the use of reliability methods to solve industry problems.







Preindications of Failure in Electronic Components


Book Description

This report discusses state-of-the-art information and techniques concerned with indications of potential degradation and catastrophic failure in electronic components. The objective of this survey is to present a comprehensive description of past, present, and future planned work on preindicators of failure for certain electronic components. This study is intended to provide basic information for future development in automatic checkout equipment. The following electronic parts were covered in the survey: semiconductors (transistors, diodes, and microcircuits), resistors, capacitors, inductors, computer cores, other items used in a computer, and vacuum tubes. Such items as wire, insulation, lamps, relays, and rotary devices were not considered. Precursors of failure have been investigated for electronic components but few have been identified at the present time. Most of these investigations were undertaken as part of programs directed at physics of failure, screening, or accelerated testing. The results of this study show that predictors of failure for semiconductors (transistors, diodes, and microcircuits) have received more attention than other types of parts. Current noise (l/f noise) and infrared emission profiles show promise as precursors that would apply to all types of semiconductors. Apparently computer cores and inductors are the least considered. (Author).