Author : D. Harame
Publisher : The Electrochemical Society
Page : 1066 pages
File Size : 14,23 MB
Release : 2010-10
Category : Science
ISBN : 1566778255
Advanced semiconductor technology is depending on innovation and less on "classical" scaling. SiGe, Ge, and Related Compounds has become a key component in the arsenal in improving semiconductor performance. This symposium discusses the technology to form these materials, process them, FET devices incorporating them, Surfaces and Interfaces, Optoelectronic devices, and HBT devices.
Author :
Publisher :
Page : 1034 pages
File Size : 22,6 MB
Release : 2010
Category :
ISBN : 9781607681755
Author : Q. Liu
Publisher : The Electrochemical Society
Page : 450 pages
File Size : 14,12 MB
Release : 2018-09-21
Category : Science
ISBN : 1607688530
Author : D. Harame
Publisher : The Electrochemical Society
Page : 1042 pages
File Size : 35,22 MB
Release :
Category :
ISBN : 1607685434
Author : David Harame
Publisher : The Electrochemical Society
Page : 1136 pages
File Size : 16,8 MB
Release : 2008
Category : Electronic apparatus and appliances
ISBN : 1566776562
Advanced semiconductor technology is depending on innovation and less on "classical" scaling. SiGe, Ge, and Related Compounds have become a key component of the arsenal in improving semiconductor performance. This issue of ECS Transactions discusses the technology to form these materials, process them, FET devices incorporating them, Surfaces and Interfaces, Optoelectronic devices, and HBT devices.
Author : David Louis Harame
Publisher : The Electrochemical Society
Page : 1280 pages
File Size : 11,69 MB
Release : 2006
Category : Electronic apparatus and appliances
ISBN : 1566775078
The second International SiGe & Ge: Materials, Processing, and Devices Symposium was part of the 2006 ECS conference held in Cancun, Mexico from October 29-Nov 3, 2006. This meeting provided a forum for reviewing and discussing all materials and device related aspects of SiGe & Ge. The hardcover edition includes a bonus CD-ROM containing the PDF of the entire issue.
Author : Q. Liu
Publisher :
Page : 551 pages
File Size : 11,49 MB
Release : 2020
Category :
ISBN : 9781713819370
Author : Q. Liu
Publisher :
Page : 0 pages
File Size : 16,26 MB
Release : 2022
Category :
ISBN : 9781713863472
Author : David Louis Harame
Publisher :
Page : 801 pages
File Size : 31,75 MB
Release : 2016
Category :
ISBN : 9781607687252
Author : C. Claeys
Publisher : The Electrochemical Society
Page : 547 pages
File Size : 21,52 MB
Release : 2009-09
Category : Integrated circuits
ISBN : 1566777445
ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).
