Handbook of Integrated Circuit Industry


Book Description

Written by hundreds experts who have made contributions to both enterprise and academics research, these excellent reference books provide all necessary knowledge of the whole industrial chain of integrated circuits, and cover topics related to the technology evolution trends, fabrication, applications, new materials, equipment, economy, investment, and industrial developments of integrated circuits. Especially, the coverage is broad in scope and deep enough for all kind of readers being interested in integrated circuit industry. Remarkable data collection, update marketing evaluation, enough working knowledge of integrated circuit fabrication, clear and accessible category of integrated circuit products, and good equipment insight explanation, etc. can make general readers build up a clear overview about the whole integrated circuit industry. This encyclopedia is designed as a reference book for scientists and engineers actively involved in integrated circuit research and development field. In addition, this book provides enough guide lines and knowledges to benefit enterprisers being interested in integrated circuit industry.




Integrated Circuit Fabrication


Book Description

Master fundamental technologies for modern semiconductor integrated circuits with this definitive textbook. It includes an early introduction of a state-of-the-art CMOS process flow, exposes students to big-picture thinking from the outset, and encourages a practical integration mindset. Extensive use of process and TCAD simulation, using industry tools such as Silvaco Athena and Victory Process, provides students with deeper insight into physical principles, and prepares them for applying these tools in a real-world setting. Accessible framing assumes only a basic background in chemistry, physics and mathematics, providing a gentle introduction for students from a wide range of backgrounds; and over 450 figures (many in color), and more than 280 end-of-chapter problems, will support and cement student understanding. Accompanied by lecture slides and solutions for instructors, this is the ideal introduction to semiconductor technology for senior undergraduate and graduate students in electrical engineering, materials science and physics, and for semiconductor engineering professionals seeking an authoritative introductory reference.




Semiconductors


Book Description

Because of the continuous evolution of integrated circuit manufacturing (ICM) and design for manufacturability (DfM), most books on the subject are obsolete before they even go to press. That’s why the field requires a reference that takes the focus off of numbers and concentrates more on larger economic concepts than on technical details. Semiconductors: Integrated Circuit Design for Manufacturability covers the gradual evolution of integrated circuit design (ICD) as a basis to propose strategies for improving return-on-investment (ROI) for ICD in manufacturing. Where most books put the spotlight on detailed engineering enhancements and their implications for device functionality, in contrast, this one offers, among other things, crucial, valuable historical background and roadmapping, all illustrated with examples. Presents actual test cases that illustrate product challenges, examine possible solution strategies, and demonstrate how to select and implement the right one This book shows that DfM is a powerful generic engineering concept with potential extending beyond its usual application in automated layout enhancements centered on proximity correction and pattern density. This material explores the concept of ICD for production by breaking down its major steps: product definition, design, layout, and manufacturing. Averting extended discussion of technology, techniques, or specific device dimensions, the author also avoids the clumsy chapter architecture that can hinder other books on this subject. The result is an extremely functional, systematic presentation that simplifies existing approaches to DfM, outlining a clear set of criteria to help readers assess reliability, functionality, and yield. With careful consideration of the economic and technical trade-offs involved in ICD for manufacturing, this reference addresses techniques for physical, electrical, and logical design, keeping coverage fresh and concise for the designers, manufacturers, and researchers defining product architecture and research programs.




A Study of Integrated Semiconductor Thin-Film Sensors on Sio2/Si Substrate


Book Description

This dissertation, "A study of integrated semiconductor thin-film sensors on sio2/si substrate" by Bin, Li, 李斌, was obtained from The University of Hong Kong (Pokfulam, Hong Kong) and is being sold pursuant to Creative Commons: Attribution 3.0 Hong Kong License. The content of this dissertation has not been altered in any way. We have altered the formatting in order to facilitate the ease of printing and reading of the dissertation. All rights not granted by the above license are retained by the author. Abstract: Abstract of thesis entitled A STUDY OF INTERGATED SEMICONDUCTOR THIN-FILM SENSORS ON SiO /Si SUBSTRATE submitted by Bin Li for the degree of Doctor of Philosophy at the University of Hong Kong in April 2001 With the development of the information technology, the need for miniaturized, intelligent and programmable sensors is rapidly increasing. To meet this trend, developing thin-film sensors on silicon substrate is of great importance. In this thesis, two areas are focused on. One is spreading-resistance temperature (SRT) sensor on silicon on insulator (SOI), while the other is the multi-function thin-film microsensor on SiO /Si substrate. Based on the principle of minority-carrier exclusion effect, SRT sensor on bulk Si is intensively studied. Optimizations of structural parameters and processing conditions on thermal characteristics of SRT sensors are carried out. With appropriately small electrode and high substrate doping, bulk SRT sensor can function at temperatures up to 400 C at a low current of 2 mA. ii SRT sensor on SOI is then investigated with emphasis on its resistance versus temperature (R-T), low-temperature and AC characteristics. Moreover, the effect of Si- film thickness on the maximum operating temperature (T ) is simulated and verified by max experiment results. When the silicon film is sufficiently thin, i.e. 0.1 μm, T can be max significantly raised up to 550 C, even at a very low bias current of 1 μA. Measurements under low-temperature or AC condition reveal that SRT sensor behaves like a conventional resistor. A new microsensor consisting of a thin-film resistor and a metal-insulator- semiconductor (MIS) capacitor is developed by depositing perovskite-type thin film on SiO /Si substrate. SrNb Ti O, Ba La TiO and Ba La Nb Ti O chosen as the 2 x 1-x 3 1-x x 3 1-x x y 1-y 3 sensing film present reasonable multi-function sensitivities to light, heat and humidity. Differences in the sensing properties of the films are related to their chemical compositions and grain boundaries. It is hoped that by varying the chemical composition, processing conditions of the film, better performance could be obtained. Finally, the effects of device structure on the sensitivities of perovskite thin-film microsensors are discussed. A new physical model is proposed for humidity-sensitive MIS capacitor with a metal-perovskite-SiO -Si structure. Based on this model, it is deduced that higher sensitivity of thinner film is due to higher porosity of the film. However, thinner film results in lower sensitivity to illumination due to poorer absorption, iii while the film thickness only has minor effects on the thermal sensitivity. The effects of SiO thickness are studied and experimental results demonstrate that an optimal value of 250 A gives rise to good multi-function sensitivities. The dependence of electrical properties of photoresistor on device dimension is investigated. Devices with smaller electrode spacings show reasonably linear I-V characteristics. Moreover, heat treatment in O for an optimal time can increase the photo sensitivity by suppressing dark current. In conclusion, SOI SRT sensors and perovskite-oxide thin-film microsensors are promising candidates for integrated sensor applications.




The Semiconductor Industry


Book Description




Three-Dimensional Integrated Circuit Design


Book Description

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization







Integrated Circuit Manufacturability


Book Description

"INTEGRATED CIRCUIT MANUFACTURABILITY provides comprehensive coverage of the process and design variables that determine the ease and feasibility of fabrication (or manufacturability) of contemporary VLSI systems and circuits. This book progresses from semiconductor processing to electrical design to system architecture. The material provides a theoretical background as well as case studies, examining the entire design for the manufacturing path from circuit to silicon. Each chapter includes tutorial and practical applications coverage. INTEGRATED CIRCUIT MANUFACTURABILITY illustrates the implications of manufacturability at every level of abstraction, including the effects of defects on the layout, their mapping to electrical faults, and the corresponding approaches to detect such faults. The reader will be introduced to key practical issues normally applied in industry and usually required by quality, product, and design engineering departments in today's design practices: * Yield management strategies * Effects of spot defects * Inductive fault analysis and testing * Fault-tolerant architectures and MCM testing strategies. This book will serve design and product engineers both from academia and industry. It can also be used as a reference or textbook for introductory graduate-level courses on manufacturing."




Integrated Circuit Design for Radiation Environments


Book Description

A practical guide to the effects of radiation on semiconductor components of electronic systems, and techniques for the designing, laying out, and testing of hardened integrated circuits This book teaches the fundamentals of radiation environments and their effects on electronic components, as well as how to design, lay out, and test cost-effective hardened semiconductor chips not only for today’s space systems but for commercial terrestrial applications as well. It provides a historical perspective, the fundamental science of radiation, and the basics of semiconductors, as well as radiation-induced failure mechanisms in semiconductor chips. Integrated Circuits Design for Radiation Environments starts by introducing readers to semiconductors and radiation environments (including space, atmospheric, and terrestrial environments) followed by circuit design and layout. The book introduces radiation effects phenomena including single-event effects, total ionizing dose damage and displacement damage) and shows how technological solutions can address both phenomena. Describes the fundamentals of radiation environments and their effects on electronic components Teaches readers how to design, lay out and test cost-effective hardened semiconductor chips for space systems and commercial terrestrial applications Covers natural and man-made radiation environments, space systems and commercial terrestrial applications Provides up-to-date coverage of state-of-the-art of radiation hardening technology in one concise volume Includes questions and answers for the reader to test their knowledge Integrated Circuits Design for Radiation Environments will appeal to researchers and product developers in the semiconductor, space, and defense industries, as well as electronic engineers in the medical field. The book is also helpful for system, layout, process, device, reliability, applications, ESD, latchup and circuit design semiconductor engineers, along with anyone involved in micro-electronics used in harsh environments.