Electron Microscopy


Book Description

Derived from the successful three-volume Handbook of Microscopy, this book provides a broad survey of the physical fundamentals and principles of all modern techniques of electron microscopy. This reference work on the method most often used for the characterization of surfaces offers a competent comparison of the feasibilities of the latest developments in this field of research. Topics include: * Stationary Beam Methods: Transmission Electron Microscopy/ Electron Energy Loss Spectroscopy/ Convergent Electron Beam Diffraction/ Low Energy Electron Microscopy/ Electron Holographic Methods * Scanning Beam Methods: Scanning Transmission Electron Microscopy/ Scanning Auger and XPS Microscopy/ Scanning Microanalysis/ Imaging Secondary Ion Mass Spectrometry * Magnetic Microscopy: Scanning Electron Microscopy with Polarization Analysis/ Spin Polarized Low Energy Electron Microscopy Materials scientists as well as any surface scientist will find this book an invaluable source of information for the principles of electron microscopy.




The Growth of Electron Microscopy


Book Description

As a complement to The Beginnings of Electron Microscopy, Advances in Imaging and Electron Physics is pleased to present Volume 96, The Growth of Electron Microscopy. This comprehensive collection of articles surveys the accomplishments of various national groups that comprise the International Federation of Societies of Electron Microscopy (IFSEM).




X-Ray Microscopy II


Book Description

This volume is based on papers presented at the International Symposium on X-Ray Microscopy held at Brookhaven National Laboratory, Upton NY, August 31-September 4, 1987. Previous recent symposia on the sub ject were held in New York in 1979, Gottingen in 1983 and Taipei in 1986. Developments in x-ray microscopy continue at a rapid pace, with im portant advances in all major areas: x-ray sources, optics and components, and microscopes and imaging systems. Taken as a whole, the work pre sented here emphasizes three major directions: (a) improvements in the capability and image-quality of x-ray microscopy, expressed principally in systems attached to large, high-brightness x-ray sources; (b) greater access to x-ray microscopy, expressed chiefly in systems employing small, often pulsed, x-ray sources; and (c) increased rate of exploration of applications of x-ray microscopy. The number of papers presented at the symposium has roughly dou bled compared with that of its predecessors. While we are delighted at this growth as a manifestation of vitality and rapid growth of the field, we did have to ask the authors to limit the length of their papers and to submit them in camera-ready form. We thank the authors for their con tributions and for their efforts in adhering to the guidelines on manuscript preparation.




Index of NLM Serial Titles


Book Description

A keyword listing of serial titles currently received by the National Library of Medicine.




In-situ Electron Microscopy


Book Description

Adopting a didactical approach from fundamentals to actual experiments and applications, this handbook and ready reference covers real-time observations using modern scanning electron microscopy and transmission electron microscopy, while also providing information on the required stages and samples. The text begins with introductory material and the basics, before describing advancements and applications in dynamic transmission electron microscopy and reflection electron microscopy. Subsequently, the techniques needed to determine growth processes, chemical reactions and oxidation, irradiation effects, mechanical, magnetic, and ferroelectric properties as well as cathodoluminiscence and electromigration are discussed.




Failure Analysis of Integrated Circuits


Book Description

This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.










ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis


Book Description

The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.