Boundary-Scan Test


Book Description

The ever-increasing miniaturization of digital electronic components is hampering the conventional testing of Printed Circuit Boards (PCBs) by means of bed-of-nails fixtures. Basically this is caused by the very high scale of integration of ICs, through which packages with hundreds of pins at very small pitches of down to a fraction of a millimetre, have become available. As a consequence the trace distances between the copper tracks on a printed circuit board cmne down to the same value. Not only the required small physical dimensions of the test nails have made conventional testing unfeasible, but also the complexity to provide test signals for the many hundreds of test nails has grown out of limits. Therefore a new board test methodology had to be invented. Following the evolution in the IC test technology. Boundary-Scan testing hm; become the new approach to PCB testing. By taking precautions in the design of the IC (design for testability), testing on PCB level can be simplified 10 a great extent. This condition has been essential for the success of the introduction of Boundary-Sc,m Test (BST) at board level.




The Boundary — Scan Handbook


Book Description

In February of 1990, the balloting process for the IEEE proposed standard P1149.1 was completed creating IEEE Std 1149.1-1990. Later that summer, in record time, the standard won ratification as an ANSI standard as well. This completed over six years of intensive cooperative effort by a diverse group of people who share a vision on solving some of the severe testing problems that exist now and are steadily getting worse. Early in this process, someone asked me if 1 thought that the P1l49.l effort would ever bear fruit. 1 responded somewhat glibly that "it was anyone's guess". Well, it wasn't anyone's guess, but rather the faith of a few individuals in the proposition that many testing problems could be solved if a multifaceted industry could agree on a standard for all to follow. Four of these individuals stand out; they are Harry Bleeker, Colin Maunder, Rodham Tulloss, and Lee Whetsel. In that I am convinced that the 1149.1 standard is the most significant testing development in the last 20 years, I personally feel a debt of gratitude to them and all the people who labored on the various Working Groups in its creation.




Analog and Mixed-Signal Boundary-Scan


Book Description

This book contains more than the IEEE Standard 1149.4. It also contains the thoughts of those who developed the standard. Adam Osseiran has edited the original writings of Brian Wilkins, Colin Maunder, Rod Tulloss, Steve Sunter, Mani Soma, Keith Lofstrom and John McDermid, all of whom have personally contributed to this standard. To preserve the original spirit, only minor changes were made, and the reader will sense a chapter-to-chapter variation in the style of expression. This may appear awkward to some, although I found the Iack of monotonicity refreshing. A system consists of a specific organization of parts. The function of the system cannot be performed by an individual part or even a disorganized collection ofthe same parts. Testing has a system-like characteristic. Testing of a system does not follow directly from the testing of its parts, and a system built with testable parts can sometimes be impossible to test. Therefore, testability of the system must be organized. Some years ago, the IEEE published the boundary-scan Standard 1149.1. That Standard provided an architecture for digital VLSI chips. The chips designed with the 1149.1 architecture can be integrated into a testable system. However, many systems today contain both analog and digital chips. Even if all digital chips are compliant with the standard, the testability of a mixed-signal system cannot be guaranteed. The new Standard 1149.4, described in this book, extends the previous architecture to mixed-signal systems.




VLSI DESIGN


Book Description

VLSI DESIGN BOOK WAS Written BY Dr. Udutha Rajender,Mr.Srikanth Parikibandla,Dr.Arunkumar Madupu




A Treatise on Instrumentation Engineering


Book Description

This book covers the whole groundwork for a consummate course on Instrumentation Engineering. Dealing with all types of instruments, methods of instrumentation, signal processing as well as sensors of every kind ─ electrical, electronic, photonic and also mechanical. The book is provided with lucid explanations of the topics with a large number of illustrations. There are worked examples embedded in the chapters and there are meaningful exercises for testing one’s study. The several chapters cover the subject and that includes the computer based instrumentation interfaces also. As such, having all these together in one volume will go a long way to meet the requirements of the candidates learning this subject nowadays.




The Electronic Packaging Handbook


Book Description

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.




A Designer’s Guide to Built-In Self-Test


Book Description

A recent technological advance is the art of designing circuits to test themselves, referred to as a Built-In Self-Test. This book is written from a designer's perspective and describes the major BIST approaches that have been proposed and implemented, along with their advantages and limitations.




System Test and Diagnosis


Book Description

System Test and Diagnosis is the first book on test and diagnosis at the system level, defined as any aggregation of related elements that together form an entity of sufficient complexity for which it is impractical to treat all of the elements at the lowest level of detail. The ideas presented emphasize that it is possible to diagnose complex systems efficiently. Since the notion of system is hierarchical, these ideas are applicable to all levels. The philosophy is presented in the context of a model-based approach, using the information flow model, that focuses on the information provided by the tests rather than the functions embedded in the system. Detailed algorithms are offered for evaluating system testability, performing efficient diagnosis, verifying and validating the models, and constructing an architecture for system maintenance. Several advanced algorithms, not commonly available in existing diagnosis tools, are discussed, including reasoning with inexact or uncertain test data, breaking large problems into manageable smaller problems, diagnosing systems with time sensitive information and time dependent tests and learning from experience. The book is divided into three parts. The first part provides motivation for careful development of the subject and the second part provides the tools necessary for analyzing system testability and computing diagnostic strategies. The third part presents advanced topics in diagnosis. Several case studies are provided, including a single detailed case study. Smaller case studies describe experiences from actual applications of the methods discussed. The detailed case study walks the reader through a complete analysis of a system to illustrate the concepts and describe the analyses that are possible. All case studies are based upon real systems that have been modeled for the purposes of diagnosis. System Test and Diagnosis is the culmination of nearly twelve years of research into diagnosis modeling and its applications. It is designed as a primary reference for engineers and practitioners interested in system test and diagnosis.




Design for AT-Speed Test, Diagnosis and Measurement


Book Description

Design for AT-Speed Test, Diagnosis and Measurement is the first book to offer practical and proven design-for-testability (DFT) solutions to chip and system design engineers, test engineers and product managers at the silicon level as well as at the board and systems levels. Designers will see how the implementation of embedded test enables simplification of silicon debug and system bring-up. Test engineers will determine how embedded test provides a superior level of at-speed test, diagnosis and measurement without exceeding the capabilities of their equipment. Product managers will learn how the time, resources and costs associated with test development, manufacture cost and lifecycle maintenance of their products can be significantly reduced by designing embedded test in the product. A complete design flow and analysis of the impact of embedded test on a design makes this book a `must read' before any DFT is attempted.




VLSI Testing


Book Description

Hurst, an editor at the Microelectronics Journal, analyzes common problems that electronics engineers and circuit designers encounter while testing integrated circuits and the systems in which they are used, and explains a variety of solutions available for overcoming them in both digital and mixed circuits. Among his topics are faults in digital circuits, generating a digital test pattern, signatures and self-tests, structured design for testability, testing structured digital circuits and microprocessors, and financial aspects of testing. The self- contained reference is also suitable as a textbook in a formal course on the subject. Annotation copyrighted by Book News, Inc., Portland, OR