2001 International Workshop on System-Level Interconnect Prediction


Book Description

"The SLIP workshop is a forum for the exchange of ideas at the interface between interconnect technology and physical design ... This year, in recognition of the highly diverse backgrounds and motivations of the attendees, SLIP 2001 has been organized around three mini-tutorials: a review of wire distribution models, a look under the hood of a variety of system level interconnect modeling programs, and back end of line yield modeling. These tutorials set the scene for the paper sessions that follow."--Forward.




Multi-Net Optimization of VLSI Interconnect


Book Description

This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.







Unconventional Models of Computation


Book Description

This book constitutes the refereed proceedings of the Third International Conference on Unconventional Models of Computation, UMC 2002, held in Kobe, Japan in October 2002.The 18 revised full papers presented together with eight invited full papers were carefully reviewed and selected from 36 submissions. All major areas of unconventinal computing models are covered, especially quantum computing, DNA computing, membrane computing, cellular computing, and possibilities to break Turing's barrier. The authors address theoretical aspects, practical implementations, as well as philosophical reflections.




On-Chip Communication Architectures


Book Description

Over the past decade, system-on-chip (SoC) designs have evolved to address the ever increasing complexity of applications, fueled by the era of digital convergence. Improvements in process technology have effectively shrunk board-level components so they can be integrated on a single chip. New on-chip communication architectures have been designed to support all inter-component communication in a SoC design. These communication architecture fabrics have a critical impact on the power consumption, performance, cost and design cycle time of modern SoC designs. As application complexity strains the communication backbone of SoC designs, academic and industrial R&D efforts and dollars are increasingly focused on communication architecture design. On-Chip Communication Architecures is a comprehensive reference on concepts, research and trends in on-chip communication architecture design. It will provide readers with a comprehensive survey, not available elsewhere, of all current standards for on-chip communication architectures. - A definitive guide to on-chip communication architectures, explaining key concepts, surveying research efforts and predicting future trends - Detailed analysis of all popular standards for on-chip communication architectures - Comprehensive survey of all research on communication architectures, covering a wide range of topics relevant to this area, spanning the past several years, and up to date with the most current research efforts - Future trends that with have a significant impact on research and design of communication architectures over the next several years




Handbook of Algorithms for Physical Design Automation


Book Description

The physical design flow of any project depends upon the size of the design, the technology, the number of designers, the clock frequency, and the time to do the design. As technology advances and design-styles change, physical design flows are constantly reinvented as traditional phases are removed and new ones are added to accommodate changes in technology. Handbook of Algorithms for Physical Design Automation provides a detailed overview of VLSI physical design automation, emphasizing state-of-the-art techniques, trends and improvements that have emerged during the previous decade. After a brief introduction to the modern physical design problem, basic algorithmic techniques, and partitioning, the book discusses significant advances in floorplanning representations and describes recent formulations of the floorplanning problem. The text also addresses issues of placement, net layout and optimization, routing multiple signal nets, manufacturability, physical synthesis, special nets, and designing for specialized technologies. It includes a personal perspective from Ralph Otten as he looks back on the major technical milestones in the history of physical design automation. Although several books on this topic are currently available, most are either too broad or out of date. Alternatively, proceedings and journal articles are valuable resources for researchers in this area, but the material is widely dispersed in the literature. This handbook pulls together a broad variety of perspectives on the most challenging problems in the field, and focuses on emerging problems and research results.




3D IC Stacking Technology


Book Description

The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology




Field-Programmable Logic and Applications: Reconfigurable Computing Is Going Mainstream


Book Description

This book constitutes the refereed proceedings of the 12th International Conference on Field-Programmable Logic and Applications, FPL 2002, held in Montpellier, France, in September 2002. The 104 revised regular papers and 27 poster papers presented together with three invited contributions were carefully reviewed and selected from 214 submissions. The papers are organized in topical sections on rapid prototyping, FPGA synthesis, custom computing engines, DSP applications, reconfigurable fabrics, dynamic reconfiguration, routing and placement, power estimation, synthesis issues, communication applications, new technologies, reconfigurable architectures, multimedia applications, FPGA-based arithmetic, reconfigurable processors, testing and fault-tolerance, crypto applications, multitasking, compilation techniques, etc.




Three-Dimensional Integrated Circuit Design


Book Description

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization




Fundamentals of Electromigration-Aware Integrated Circuit Design


Book Description

The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.