Handbook of Semiconductor Manufacturing Technology


Book Description

Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.




Smart Adaptive Systems on Silicon


Book Description

Intelligent/smart systems have become common practice in many engineering applications. On the other hand, current low cost standard CMOS technology (and future foreseeable developments) makes available enormous potentialities. The next breakthrough will be the design and development of "smart adaptive systems on silicon" i.e. very power and highly size efficient complete systems (i.e. sensing, computing and "actuating" actions) with intelligence on board on a single silicon die. Smart adaptive systems on silicon will be able to "adapt" autonomously to the changing environment and will be able to implement "intelligent" behaviour and both perceptual and cognitive tasks. At last, they will communicate through wireless channels, they will be battery supplied or remote powered (via inductive coupling) and they will be ubiquitous in our every day life. Although many books deal with research and engineering topics (i.e. algorithms, technology, implementations, etc.) few of them try to bridge the gap between them and to address the issues related to feasibility, reliability and applications. Smart Adaptive Systems on Silicon, though not exhaustive, tries to fill this gap and to give answers mainly to the feasibility and reliability issues. Smart Adaptive Systems on Silicon mainly focuses on the analog and mixed mode implementation on silicon because this approach is amenable of achieving impressive energy and size efficiency. Moreover, analog systems can be more easily interfaced with sensing and actuating devices.




Semiconductor Memories and Systems


Book Description

Semiconductor Memories and Systems provides a comprehensive overview of the current state of semiconductor memory at the technology and system levels. After an introduction on market trends and memory applications, the book focuses on mainstream technologies, illustrating their current status, challenges and opportunities, with special attention paid to scalability paths. Technologies discussed include static random access memory (SRAM), dynamic random access memory (DRAM), non-volatile memory (NVM), and NAND flash memory. Embedded memory and requirements and system level needs for storage class memory are also addressed. Each chapter covers physical operating mechanisms, fabrication technologies, and the main challenges to scalability.Finally, the work reviews the emerging trends for storage class memory, mainly focusing on the advantages and opportunities of phase change based memory technologies. - Features contributions from experts from leading companies in semiconductor memory - Discusses physical operating mechanisms, fabrication technologies and paths to scalability for current and emerging semiconductor memories - Reviews primary memory technologies, including SRAM, DRAM, NVM and NAND flash memory - Includes emerging storage class memory technologies such as phase change memory




2009 International Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors


Book Description

This issue of ECS Transactions includes 33 papers that were presented at the Second International Conference on Semiconductor Technology for Ultra Large Integrated Circuits and Thin Film Transistors (ULSIC vs. TFT II), held in the Xi¿an Garden Hotel, Xian, China, July 5-10, 2009. This symposium was sponsored by the Engineering Conferences International.




The First Outstanding 50 Years of “Università Politecnica delle Marche”


Book Description

The book describes the significant multidisciplinary research findings at the Università Politecnica delle Marche and the expected future advances. It addresses some of the most dramatic challenges posed by today’s fast-growing, global society and the changes it has caused. It also discusses solutions to improve the wellbeing of human beings. The book covers the main research achievements in the different disciplines of the physical sciences and engineering, as well as several research lines developed at the university’s Faculty of Engineering in the fields of electronic and information engineering, telecommunications, biomedical engineering, mechanical engineering, manufacturing technologies, energy, advanced materials, chemistry, physics of matter, mathematical sciences, geotechnical engineering, circular economy, urban planning, construction engineering, infrastructures and environment protection, technologies and digitization of the built environment and cultural heritage. It highlights the international relevance and multidisciplinarity of research at the university as well as the planned research lines for the next years.




Eighth International Work-Conference on Artificial and Natural Neural Networks


Book Description

We present in this volume the collection of finally accepted papers of the eighth edition of the “IWANN” conference (“International Work-Conference on Artificial Neural Networks”). This biennial meeting focuses on the foundations, theory, models and applications of systems inspired by nature (neural networks, fuzzy logic and evolutionary systems). Since the first edition of IWANN in Granada (LNCS 540, 1991), the Artificial Neural Network (ANN) community, and the domain itself, have matured and evolved. Under the ANN banner we find a very heterogeneous scenario with a main interest and objective: to better understand nature and beings for the correct elaboration of theories, models and new algorithms. For scientists, engineers and professionals working in the area, this is a very good way to get solid and competitive applications. We are facing a real revolution with the emergence of embedded intelligence in many artificial systems (systems covering diverse fields: industry, domotics, leisure, healthcare, ... ). So we are convinced that an enormous amount of work must be, and should be, still done. Many pieces of the puzzle must be built and placed into their proper positions, offering us new and solid theories and models (necessary tools) for the application and praxis of these current paradigms. The above-mentioned concepts were the main reason for the subtitle of the IWANN 2005 edition: “Computational Intelligence and Bioinspired Systems.” The call for papers was launched several months ago, addressing the following topics: 1. Mathematical and theoretical methods in computational intelligence.




Inside NAND Flash Memories


Book Description

Digital photography, MP3, digital video, etc. make extensive use of NAND-based Flash cards as storage media. To realize how much NAND Flash memories pervade every aspect of our life, just imagine how our recent habits would change if the NAND memories suddenly disappeared. To take a picture it would be necessary to find a film (as well as a traditional camera...), disks or even magnetic tapes would be used to record a video or to listen a song, and a cellular phone would return to be a simple mean of communication rather than a multimedia console. The development of NAND Flash memories will not be set down on the mere evolution of personal entertainment systems since a new killer application can trigger a further success: the replacement of Hard Disk Drives (HDDs) with Solid State Drives (SSDs). SSD is made up by a microcontroller and several NANDs. As NAND is the technology driver for IC circuits, Flash designers and technologists have to deal with a lot of challenges. Therefore, SSD (system) developers must understand Flash technology in order to exploit its benefits and countermeasure its weaknesses. Inside NAND Flash Memories is a comprehensive guide of the NAND world: from circuits design (analog and digital) to Flash reliability (including radiation effects), from testing issues to high-performance (DDR) interface, from error correction codes to NAND applications like Flash cards and SSDs.




Extreme Environment Electronics


Book Description

Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.




Low Power VCO Design in CMOS


Book Description

This work covers the design of CMOS fully integrated low power low phase noise voltage controlled oscillators for telecommunication or datacommuni- tion systems. The need for low power is obvious, as mobile wireless telecommunications are battery operated. As wireless telecommunication systems use oscillators in frequency synthesizers for frequency translation, the selectivity and signal to noise ratio of receivers and transmitters depend heavily on the low phase noise performance of the implemented oscillators. Datacommunication s- tems need low jitter, the time-domain equivalent of low phase noise, clocks for data detection and recovery. The power consumption is less critical. The need for multi-band and multi-mode systems pushes the high-integration of telecommunication systems. This is o?ered by sub-micron CMOS feat- ing digital ?exibility. The recent crisis in telecommunication clearly shows that mobile hand-sets became mass-market high-volume consumer products, where low-cost is of prime importance. This need for low-cost products - livens tremendously research towards CMOS alternatives for the bipolar or BiCMOS solutions in use today.