Three-Dimensional Integrated Circuit Design


Book Description

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization




Design of 3D Integrated Circuits and Systems


Book Description

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.




Handbook of Magnetic Materials


Book Description

Volume 19 of the Handbook of Magnetic Materials, as the preceding volumes, has a dual purpose. As a textbook it is intended to help those who wish to be introduced to a given topic in the field of magnetism without the need to read the vast amount of literature published. As a work of reference it is intended for scientists active in magnetism research. To this dual purpose, Volume 19 is composed of topical review articles written by leading authorities. In each of these articles an extensive description is given in graphical as well as in tabular form, much emphasis being placed on the discussion of the experimental material in the framework of physics, chemistry and material science. It provides readers with novel trends and achievements in magnetism. Composed of topical review articles written by leading authorities Intended to be of assistance to those who wish to be introduced to a given topic in the field of magnetism As a work of reference it is intended for scientists active in magnetism research Provide the readership with novel trends and achievements in magnetism




Low Power RF Circuit Design in Standard CMOS Technology


Book Description

Low Power Consumption is one of the critical issues in the performance of small battery-powered handheld devices. Mobile terminals feature an ever increasing number of wireless communication alternatives including GPS, Bluetooth, GSM, 3G, WiFi or DVB-H. Considering that the total power available for each terminal is limited by the relatively slow increase in battery performance expected in the near future, the need for efficient circuits is now critical. This book presents the basic techniques available to design low power RF CMOS analogue circuits. It gives circuit designers a complete guide of alternatives to optimize power consumption and explains the application of these rules in the most common RF building blocks: LNA, mixers and PLLs. It is set out using practical examples and offers a unique perspective as it targets designers working within the standard CMOS process and all the limitations inherent in these technologies.




High Performance Logic And Circuits For High-speed Electronic Systems


Book Description

In this volume, we have put together papers spanning a broad range — from the area of modeling of strain and misfit dislocation densities, microwave absorption characteristics of nanocomposites, to X-ray diffraction studies.Specific topics in this volume include:In summary, papers selected in this volume cover various aspects of high performance logic and circuits for high-speed electronic systems.




Handbook of Mobile Broadcasting


Book Description

Operators are introducing mobile television and digital video content services globally. The Handbook of Mobile Broadcasting addresses all aspects of these services, providing a comprehensive reference on DVB-H, DMB, ISDB-T, and MediaFLO. Featuring contributions from experts in the field, the text presents technical standards and distribution proto




Mobile and Wireless Communications


Book Description

Mobile and wireless communications applications have a clear impact on improving the humanity wellbeing. From cell phones to wireless internet to home and office devices, most of the applications are converted from wired into wireless communication. Smart and advanced wireless communication environments represent the future technology and evolutionary development step in homes, hospitals, industrial, vehicular and transportation systems. A very appealing research area in these environments has been the wireless ad hoc, sensor and mesh networks. These networks rely on ultra low powered processing nodes that sense surrounding environment temperature, pressure, humidity, motion or chemical hazards, etc. Moreover, the radio frequency (RF) transceiver nodes of such networks require the design of transmitter and receiver equipped with high performance building blocks including antennas, power and low noise amplifiers, mixers and voltage controlled oscillators. Nowadays, the researchers are facing several challenges to design such building blocks while complying with ultra low power consumption, small area and high performance constraints. CMOS technology represents an excellent candidate to facilitate the integration of the whole transceiver on a single chip. However, several challenges have to be tackled while designing and using nanoscale CMOS technologies and require innovative idea from researchers and circuits designers. While major researchers and applications have been focusing on RF wireless communication, optical wireless communication based system has started to draw some attention from researchers for a terrestrial system as well as for aerial and satellite terminals. This renewed interested in optical wireless communications is driven by several advantages such as no licensing requirements policy, no RF radiation hazards, and no need to dig up roads besides its large bandwidth and low power consumption. This second part of the book, Mobile and Wireless Communications: Key Technologies and Future Applications, covers the recent development in ad hoc and sensor networks, the implementation of state of the art of wireless transceivers building blocks and recent development on optical wireless communication systems. We hope that this book will be useful for students, researchers and practitioners in their research studies.




Integrated Circuit and System Design: Power and Timing Modeling, Optimization and Simulation


Book Description

This book constitutes the thoroughly refereed post-conference proceedings of 19th International Workshop on Power and Timing Modeling, Optimization and Simulation, PATMOS 2009, featuring Integrated Circuit and System Design, held in Delft, The Netherlands during September 9-11, 2009. The 26 revised full papers and 10 revised poster papers presented were carefully reviewed and selected from numerous submissions. The papers are organized in topical sections on variability & statistical timing, circuit level techniques, power management, low power circuits & technology, system level techniques, power & timing optimization techniques, self-timed circuits, low power circuit analysis & optimization, and low power design studies.




Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications


Book Description

In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.




Physical Design for 3D Integrated Circuits


Book Description

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.