2014 IEEE International Reliability Physics Symposium (IRPS 2014)
Author :
Publisher :
Page : pages
File Size : 21,49 MB
Release : 2014
Category : Electronic apparatus and appliances
ISBN : 9781479933167
Author :
Publisher :
Page : pages
File Size : 21,49 MB
Release : 2014
Category : Electronic apparatus and appliances
ISBN : 9781479933167
Author : Eitan N. Shauly
Publisher : CRC Press
Page : 831 pages
File Size : 37,43 MB
Release : 2022-11-30
Category : Technology & Engineering
ISBN : 1000631354
Nowadays over 50% of integrated circuits are fabricated at wafer foundries. This book presents a foundry-integrated perspective of the field and is a comprehensive and up-to-date manual designed to serve process, device, layout, and design engineers. It comprises chapters carefully selected to cover topics relevant for them to deal with their work. The book provides an insight into the different types of design rules (DRs) and considerations for setting new DRs. It discusses isolation, gate patterning, S/D contacts, metal lines, MOL, air gaps, and so on. It explains in detail the layout rules needed to support advanced planarization processes, different types of dummies, and related utilities as well as presents a large set of guidelines and layout-aware modeling for RF CMOS and analog modules. It also discusses the layout DRs for different mobility enhancement techniques and their related modeling, listing many of the dedicated rules for static random-access memory (SRAM), embedded polyfuse (ePF), and LogicNVM. The book also provides the setting and calibration of the process parameters set and describes the 28~20 nm planar MOSFET process flow for low-power and high-performance mobile applications in a step-by-step manner. It includes FEOL and BEOL physical and environmental tests for qualifications together with automotive qualification and design for automotive (DfA). Written for the professionals, the book belongs to the bookshelf of microelectronic discipline experts.
Author : Sheldon Tan
Publisher : Springer Nature
Page : 487 pages
File Size : 12,85 MB
Release : 2019-09-12
Category : Technology & Engineering
ISBN : 3030261727
This book provides readers with a detailed reference regarding two of the most important long-term reliability and aging effects on nanometer integrated systems, electromigrations (EM) for interconnect and biased temperature instability (BTI) for CMOS devices. The authors discuss in detail recent developments in the modeling, analysis and optimization of the reliability effects from EM and BTI induced failures at the circuit, architecture and system levels of abstraction. Readers will benefit from a focus on topics such as recently developed, physics-based EM modeling, EM modeling for multi-segment wires, new EM-aware power grid analysis, and system level EM-induced reliability optimization and management techniques. Reviews classic Electromigration (EM) models, as well as existing EM failure models and discusses the limitations of those models; Introduces a dynamic EM model to address transient stress evolution, in which wires are stressed under time-varying current flows, and the EM recovery effects. Also includes new, parameterized equivalent DC current based EM models to address the recovery and transient effects; Presents a cross-layer approach to transistor aging modeling, analysis and mitigation, spanning multiple abstraction levels; Equips readers for EM-induced dynamic reliability management and energy or lifetime optimization techniques, for many-core dark silicon microprocessors, embedded systems, lower power many-core processors and datacenters.
Author : Fausto Pedro García Márquez
Publisher : BoD – Books on Demand
Page : 236 pages
File Size : 32,57 MB
Release : 2018-06-06
Category : Technology & Engineering
ISBN : 1789232589
The new technology and system communication advances are being employed in any system, being more complex. The system dependability considers the technical complexity, size, and interdependency of the system. The stochastic characteristic together with the complexity of the systems as dependability requires to be under control the Reliability, Availability, Maintainability, and Safety (RAMS). The dependability contemplates, therefore, the faults/failures, downtimes, stoppages, worker errors, etc. Dependability also refers to emergent properties, i.e., properties generated indirectly from other systems by the system analyzed. Dependability, understood as general description of system performance, requires advanced analytics that are considered in this book. Dependability management and engineering are covered with case studies and best practices. The diversity of the issues will be covered from algorithms, mathematical models, and software engineering, by design methodologies and technical or practical solutions. This book intends to provide the reader with a comprehensive overview of the current state of the art, case studies, hardware and software solutions, analytics, and data science in dependability engineering.
Author : Gracieli Posser
Publisher : Springer
Page : 134 pages
File Size : 12,65 MB
Release : 2016-11-26
Category : Technology & Engineering
ISBN : 3319488996
This book describes new and effective methodologies for modeling, analyzing and mitigating cell-internal signal electromigration in nanoCMOS, with significant circuit lifetime improvements and no impact on performance, area and power. The authors are the first to analyze and propose a solution for the electromigration effects inside logic cells of a circuit. They show in this book that an interconnect inside a cell can fail reducing considerably the circuit lifetime and they demonstrate a methodology to optimize the lifetime of circuits, by placing the output, Vdd and Vss pin of the cells in the less critical regions, where the electromigration effects are reduced. Readers will be enabled to apply this methodology only for the critical cells in the circuit, avoiding impact in the circuit delay, area and performance, thus increasing the lifetime of the circuit without loss in other characteristics.
Author : ASM International
Publisher : ASM International
Page : 666 pages
File Size : 24,40 MB
Release : 2017-12-01
Category : Technology & Engineering
ISBN : 1627081518
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Author : Robert Puers
Publisher : John Wiley & Sons
Page : 713 pages
File Size : 49,56 MB
Release : 2017-04-11
Category : Technology & Engineering
ISBN : 3527800735
Offering first-hand insights by top scientists and industry experts at the forefront of R&D into nanoelectronics, this book neatly links the underlying technological principles with present and future applications. A brief introduction is followed by an overview of present and emerging logic devices, memories and power technologies. Specific chapters are dedicated to the enabling factors, such as new materials, characterization techniques, smart manufacturing and advanced circuit design. The second part of the book provides detailed coverage of the current state and showcases real future applications in a wide range of fields: safety, transport, medicine, environment, manufacturing, and social life, including an analysis of emerging trends in the internet of things and cyber-physical systems. A survey of main economic factors and trends concludes the book. Highlighting the importance of nanoelectronics in the core fields of communication and information technology, this is essential reading for materials scientists, electronics and electrical engineers, as well as those working in the semiconductor and sensor industries.
Author : Qiaohong Zu
Publisher : Springer
Page : 996 pages
File Size : 35,78 MB
Release : 2016-04-30
Category : Computers
ISBN : 3319318543
This book constitutes revised selected papers from the thoroughly refereed proceedings of the Second International Human Centered Computing Conference, HCC 2016, that consolidated and further develops the successful ICPCA/SWS conferences on Pervasive Computing and the Networked World, and which was held in Colombo, Sri Lanka, in January 2016. The 58 full papers and 30 short papers presented in this volume together with one keynote talk were carefully reviewed and selected from 211 submissions. These proceedings present research papers investigating into a variety of aspects towards human centric intelligent societies. They cover the categories: infrastructure and devices; service and solution; data and knowledge; and community.
Author : Cor Claeys
Publisher : Springer
Page : 464 pages
File Size : 49,82 MB
Release : 2018-08-13
Category : Technology & Engineering
ISBN : 3319939254
This book provides a unique review of various aspects of metallic contamination in Si and Ge-based semiconductors. It discusses all of the important metals including their origin during crystal and/or device manufacturing, their fundamental properties, their characterization techniques and their impact on electrical devices’ performance. Several control and possible gettering approaches are addressed. The book offers a valuable reference guide for all researchers and engineers studying advanced and state-of-the-art micro- and nano-electronic semiconductor devices and circuits. Adopting an interdisciplinary approach, it combines perspectives from e.g. material science, defect engineering, device processing, defect and device characterization, and device physics and engineering.
Author : Willem Dirk van Driel
Publisher : Springer Nature
Page : 552 pages
File Size : 35,85 MB
Release : 2022-01-31
Category : Technology & Engineering
ISBN : 3030815765
This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.