Proceedings of the 8th Brazilian Technology Symposium (BTSym’22)


Book Description

This book presents the proceedings of the 8th Brazilian Technology Symposium (BTSym'22). The book discusses current technological issues on Systems Engineering, Mathematics, and Physical Sciences, such as the Transmission Line, Protein-Modified Mortars, Electromagnetic Properties, Clock Domains, Chebyshev Polynomials, Satellite Control Systems, Hough Transform, Watershed Transform, Blood Smear Images, Toxoplasma Gondi, Operation System Developments, MIMO Systems, Geothermal-Photovoltaic Energy Systems, Mineral Flotation Application, CMOS Techniques, Frameworks Developments, Physiological Parameters Applications, Brain–Computer Interface, Artificial Neural Networks, Computational Vision, Security Applications, FPGA Applications, IoT, Residential Automation, Data Acquisition, Industry 4.0, Cyber-Physical Systems, Digital Image Processing, Patters Recognition, Machine Learning, Photocatalytic Process, Physical-Chemical Analysis, Smoothing Filters, Frequency Synthesizers, Voltage Controlled Ring Oscillator, Difference Amplifier, Photocatalysis, and Photodegradation, and current technological issues on Human, Smart, and Sustainable Future of Cities, such as the Digital Transformation, Data Science, Hydrothermal Dispatch, Project Knowledge Transfer, Immunization Programs, Efficiency and Predictive Methods, PMBOK Applications, Logistics Process, IoT, Data Acquisition, Industry 4.0, Cyber-Physical Systems, Fingerspelling Recognition, Cognitive Ergonomics, Ecosystem Services, Environmental, Ecosystem Services valuation, Solid Waste, and University Extension.




Reliability Wearout Mechanisms in Advanced CMOS Technologies


Book Description

This invaluable resource tells the complete story of failure mechanisms—from basic concepts to the tools necessary to conduct reliability tests and analyze the results. Both a text and a reference work for this important area of semiconductor technology, it assumes no reliability education or experience. It also offers the first reference book with all relevant physics, equations, and step-by-step procedures for CMOS technology reliability in one place. Practical appendices provide basic experimental procedures that include experiment design, performing stressing in the laboratory, data analysis, reliability projections, and interpreting projections.




Reliability Prediction for Microelectronics


Book Description

RELIABILITY PREDICTION FOR MICROELECTRONICS Wiley Series in Quality & Reliability Engineering REVOLUTIONIZE YOUR APPROACH TO RELIABILITY ASSESSMENT WITH THIS GROUNDBREAKING BOOK Reliability evaluation is a critical aspect of engineering, without which safe performance within desired parameters over the lifespan of machines cannot be guaranteed. With microelectronics in particular, the challenges to evaluating reliability are considerable, and statistical methods for creating microelectronic reliability standards are complex. With nano-scale microelectronic devices increasingly prominent in modern life, it has never been more important to understand the tools available to evaluate reliability. Reliability Prediction for Microelectronics meets this need with a cluster of tools built around principles of reliability physics and the concept of remaining useful life (RUL). It takes as its core subject the ‘physics of failure’, combining a thorough understanding of conventional approaches to reliability evaluation with a keen knowledge of their blind spots. It equips engineers and researchers with the capacity to overcome decades of errant reliability physics and place their work on a sound engineering footing. Reliability Prediction for Microelectronics readers will also find: Focus on the tools required to perform reliability assessments in real operating conditions Detailed discussion of topics including failure foundation, reliability testing, acceleration factor calculation, and more New multi-physics of failure on DSM technologies, including TDDB, EM, HCI, and BTI Reliability Prediction for Microelectronics is ideal for reliability and quality engineers, design engineers, and advanced engineering students looking to understand this crucial area of product design and testing.




VLSI Design and Test


Book Description

This book constitutes the proceedings of the 26th International Symposium on VLSI Design and Test, VDAT 2022, which took place in Jammu, India, in July 2022. The 32 regular papers and 16 short papers presented in this volume were carefully reviewed and selected from 220 submissions. They were organized in topical sections as follows: Devices and Technology; Sensors; Analog/Mixed Signal; Digital Design; Emerging Technologies and Memory; System Design.







GaN Technology


Book Description




Computational Science and Its Applications – ICCSA 2021


Book Description

​​The ten-volume set LNCS 12949 – 12958 constitutes the proceedings of the 21st International Conference on Computational Science and Its Applications, ICCSA 2021, which was held in Cagliari, Italy, during September 13 – 16, 2021. The event was organized in a hybrid mode due to the Covid-19 pandemic.The 466 full and 18 short papers presented in these proceedings were carefully reviewed and selected from 1588 submissions. The books cover such topics as multicore architectures, blockchain, mobile and wireless security, sensor networks, open source software, collaborative and social computing systems and tools, cryptography, applied mathematics human computer interaction, software design engineering, and others. Part IX of the set includes the proceedings of the following events: ​​13th International Symposium on Software Engineering Processes and Applications (SEPA 2021); International Workshop on Sustainability Performance Assessment: models, approaches and applications toward interdisciplinary and integrated solutions (SPA 2021).




Advances in Electrical and Computer Technologies


Book Description

This book comprises select proceedings of the International Conference on Advances in Electrical and Computer Technologies 2021 (ICAECT 2021). The papers presented in this book are peer-reviewed and cover the latest research in electrical, electronics, communication, and computer engineering. Topics covered include smart grids, soft computing techniques in power systems, smart energy management systems, power electronics, feedback control systems, biomedical engineering, geographic information systems, grid computing, data mining, image and signal processing, video processing, computer vision, pattern recognition, cloud computing, pervasive computing, intelligent systems, artificial intelligence, neural network and fuzzy logic, broadband communication, mobile and optical communication, network security, VLSI, embedded systems, optical networks, and wireless communication. The book is useful for students and researchers working in the different overlapping areas of electrical, electronics, and communication engineering.




Thermal Management of Gallium Nitride Electronics


Book Description

Thermal Management of Gallium Nitride Electronics outlines the technical approaches undertaken by leaders in the community, the challenges they have faced, and the resulting advances in the field. This book serves as a one-stop reference for compound semiconductor device researchers tasked with solving this engineering challenge for future material systems based on ultra-wide bandgap semiconductors. A number of perspectives are included, such as the growth methods of nanocrystalline diamond, the materials integration of polycrystalline diamond through wafer bonding, and the new physics of thermal transport across heterogeneous interfaces. Over the past 10 years, the book's authors have performed pioneering experiments in the integration of nanocrystalline diamond capping layers into the fabrication process of compound semiconductor devices. Significant research efforts of integrating diamond and GaN have been reported by a number of groups since then, thus resulting in active thermal management options that do not necessarily lead to performance derating to avoid self-heating during radio frequency or power switching operation of these devices. Self-heating refers to the increased channel temperature caused by increased energy transfer from electrons to the lattice at high power. This book chronicles those breakthroughs. - Includes the fundamentals of thermal management of wide-bandgap semiconductors, with historical context, a review of common heating issues, thermal transport physics, and characterization methods - Reviews the latest strategies to overcome heating issues through materials modeling, growth and device design strategies - Touches on emerging, real-world applications for thermal management strategies in power electronics




Semiconductor Memories and Systems


Book Description

Semiconductor Memories and Systems provides a comprehensive overview of the current state of semiconductor memory at the technology and system levels. After an introduction on market trends and memory applications, the book focuses on mainstream technologies, illustrating their current status, challenges and opportunities, with special attention paid to scalability paths. Technologies discussed include static random access memory (SRAM), dynamic random access memory (DRAM), non-volatile memory (NVM), and NAND flash memory. Embedded memory and requirements and system level needs for storage class memory are also addressed. Each chapter covers physical operating mechanisms, fabrication technologies, and the main challenges to scalability.Finally, the work reviews the emerging trends for storage class memory, mainly focusing on the advantages and opportunities of phase change based memory technologies. - Features contributions from experts from leading companies in semiconductor memory - Discusses physical operating mechanisms, fabrication technologies and paths to scalability for current and emerging semiconductor memories - Reviews primary memory technologies, including SRAM, DRAM, NVM and NAND flash memory - Includes emerging storage class memory technologies such as phase change memory