2022 International Conference on IC Design and Technology (ICICDT)


Book Description

Design and technology co optimization provide key advantage in the highly competitive market today However, integrated circuit (IC) engineering traditionally separates design and technology and the two don t use the same language, let alone understand each other This is not a winning approach moving forward Savvy IC engineers require a deeper understanding of the interdependencies between design and technology options to expand the product optimization window ICICDT is, by design, a forum for engineers, researchers, graduate students and professors, to cross the design technology boundary by bringing design, technology, and process experts together Its unique format of each paper has a short presentation and a poster is designed to encourage asking questions and sharing knowledge on a one to one basis during the poster session










2023 International Conference on IC Design and Technology (ICICDT)


Book Description

Design and technology co optimization (DTCO) play a critical role in the era of big data with an explosion of new applications such as artificial intelligence (AI) and 5G To meet the insatiable appetite for speed and power efficiency in data computing and transmission, separating design and technology as is the way in traditional integrated circuit (IC) engineering faces tremendous challenges The ever increasing complexity and variabilityrequire close interaction and collaboration for best optimization and trade off by design, device, process and materials Savvy IC engineers also require a deeper understanding of the interdependencies between design and technology options to expand the product optimization window ICICDT is, by design, a forum for engineers, researchers, graduate students, and professors, to cross the design technology boundary by bringing design, technology, and process experts together




2021 International Conference on IC Design and Technology (ICICDT)


Book Description

Design and technology co optimization provide key advantage in the highly competitive market today However, integrated circuit (IC) engineering traditionally separates design and technology and the two don t use the same language, let alone understand each other This is not a winning approach moving forward Savvy IC engineers require a deeper understanding of the interdependencies between design and technology options to expand the product optimization window ICICDT is, by design, a forum for engineers, researchers, graduate students and professors, to cross the design technology boundary by bringing design, technology, and process experts together Its unique format of each paper has a short presentation and a workshop session poster is designed to encourage interaction asking questions and sharing knowledge on a one to one basis during the workshop poster session




2017 IEEE International Conference on IC Design and Technology (ICICDT)


Book Description

Advanced materials and processing technologies Advanced transistor and interconnect structures Three dimensional (3D) integration Variation tolerant designs Process and design techniques for soft errors, plasma induced damage, and reliability Advanced memory devices and circuits RF, analog, mixed signal, and I O circuits for future technology generations Simulation and modeling of advanced processes, devices, and circuits EDA and design optimizations across system, circuit, and or device levels for high performance, energy efficiency, yield, and or reliability Design for manufacturing, yield, and test System on Chip (SoC) and system in package (SiP) design integration Power semiconductor technologies and circuits Emerging technologies and circuits




Proceeding of 2022 International Conference on Wireless Communications, Networking and Applications (WCNA 2022)


Book Description

This proceedings includes original, unpublished, peer-reviewed research papers from the International Conference on Wireless Communications, Networking and Applications (WCNA2022), held in Wuhan, Hubei, China, from December 16 to 18, 2022. The topics covered include but are not limited to wireless communications, networking and applications. The papers showcased here share the latest findings on methodologies, algorithms and applications in communication and network, making the book a valuable asset for professors, researchers, engineers, and university students alike.