Book Description

Low power CMOS and embedded memory, Foundry technology, RF & THz process, device and integration technology, Standalone memory DRAM, FLASH, emerging memory technology, Advanced process modules e g gate stack, junction, strain channel engineering, low R contact, low C spacer ILD, interconnect technology, ALE and selective deposition, etc , Nanopatterning Multiple patterning, Directed Self Assembly, EUV, etc , Power and analog IC device and technology, Advanced CMOS process and devices Ge, SiGe, III V, FinFET, GAA nanowires nanosheets, Low dimensional materials and devices experiments and simulations, Material, process and device modeling, TFT and organic electronics, MEMS, imagers and sensors, Advanced manufacturing technology, metrology and yield, Reliability physics, characterization and test, Advanced packaging and 2 5D 3D Integration, Photonics and Beyond CMOS Technology, Energy harvesting technology, Wearable and loE enabling technologies, Neuromorphic devices and materials