Defect-Oriented Testing for Nano-Metric CMOS VLSI Circuits


Book Description

The 2nd edition of defect oriented testing has been extensively updated. New chapters on Functional, Parametric Defect Models and Inductive fault Analysis and Yield Engineering have been added to provide a link between defect sources and yield. The chapter on RAM testing has been updated with focus on parametric and SRAM stability testing. Similarly, newer material has been incorporated in digital fault modeling and analog testing chapters. The strength of Defect Oriented Testing for nano-Metric CMOS VLSIs lies in its industrial relevance.




Microelectronics Failure Analysis


Book Description

For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron




IDDQ Testing of VLSI Circuits


Book Description

Power supply current monitoring to detect CMOS IC defects during production testing quietly laid down its roots in the mid-1970s. Both Sandia Labs and RCA in the United States and Philips Labs in the Netherlands practiced this procedure on their CMOS ICs. At that time, this practice stemmed simply from an intuitive sense that CMOS ICs showing abnormal quiescent power supply current (IDDQ) contained defects. Later, this intuition was supported by data and analysis in the 1980s by Levi (RACD, Malaiya and Su (SUNY-Binghamton), Soden and Hawkins (Sandia Labs and the University of New Mexico), Jacomino and co-workers (Laboratoire d'Automatique de Grenoble), and Maly and co-workers (Carnegie Mellon University). Interest in IDDQ testing has advanced beyond the data reported in the 1980s and is now focused on applications and evaluations involving larger volumes of ICs that improve quality beyond what can be achieved by previous conventional means. In the conventional style of testing one attempts to propagate the logic states of the suspended nodes to primary outputs. This is done for all or most nodes of the circuit. For sequential circuits, in particular, the complexity of finding suitable tests is very high. In comparison, the IDDQ test does not observe the logic states, but measures the integrated current that leaks through all gates. In other words, it is like measuring a patient's temperature to determine the state of health. Despite perceived advantages, during the years that followed its initial announcements, skepticism about the practicality of IDDQ testing prevailed. The idea, however, provided a great opportunity to researchers. New results on test generation, fault simulation, design for testability, built-in self-test, and diagnosis for this style of testing have since been reported. After a decade of research, we are definitely closer to practice.




CMOS Electronics


Book Description

CMOS manufacturing environments are surrounded with symptoms that can indicate serious test, design, or reliability problems, which, in turn, can affect the financial as well as the engineering bottom line. This book educates readers, including non-engineers involved in CMOS manufacture, to identify and remedy these causes. This book instills the electronic knowledge that affects not just design but other important areas of manufacturing such as test, reliability, failure analysis, yield-quality issues, and problems. Designed specifically for the many non-electronic engineers employed in the semiconductor industry who need to reliably manufacture chips at a high rate in large quantities, this is a practical guide to how CMOS electronics work, how failures occur, and how to diagnose and avoid them. Key features: Builds a grasp of the basic electronics of CMOS integrated circuits and then leads the reader further to understand the mechanisms of failure. Unique descriptions of circuit failure mechanisms, some found previously only in research papers and others new to this publication. Targeted to the CMOS industry (or students headed there) and not a generic introduction to the broader field of electronics. Examples, exercises, and problems are provided to support the self-instruction of the reader.




International Test Conference, 1993


Book Description

Annotation Proceedings of the 24th International Test Conference held in Baltimore, October 1993--the premier conference for the testing of electronic devices, assemblies, and systems, including design for testability and diagnostics. This year's leading edge topics are mixed-signal testing, multichip modules, systems test, automatic synthesis of test structures in design, boundary scan, and Iddq. Core topics represented included ATPG, modeling, test equipment hardware, delay fault testing, software testing, DFT, applied BIST, board testing, memory and microprocessor testing, test economics, and test quality and reliability. Annotation copyright by Book News, Inc., Portland, OR.




Essentials of Electronic Testing for Digital, Memory and Mixed-Signal VLSI Circuits


Book Description

The modern electronic testing has a forty year history. Test professionals hold some fairly large conferences and numerous workshops, have a journal, and there are over one hundred books on testing. Still, a full course on testing is offered only at a few universities, mostly by professors who have a research interest in this area. Apparently, most professors would not have taken a course on electronic testing when they were students. Other than the computer engineering curriculum being too crowded, the major reason cited for the absence of a course on electronic testing is the lack of a suitable textbook. For VLSI the foundation was provided by semiconductor device techn- ogy, circuit design, and electronic testing. In a computer engineering curriculum, therefore, it is necessary that foundations should be taught before applications. The field of VLSI has expanded to systems-on-a-chip, which include digital, memory, and mixed-signalsubsystems. To our knowledge this is the first textbook to cover all three types of electronic circuits. We have written this textbook for an undergraduate “foundations” course on electronic testing. Obviously, it is too voluminous for a one-semester course and a teacher will have to select from the topics. We did not restrict such freedom because the selection may depend upon the individual expertise and interests. Besides, there is merit in having a larger book that will retain its usefulness for the owner even after the completion of the course. With equal tenacity, we address the needs of three other groups of readers.




Asian Test Symposium


Book Description




Comparison of IDDQ and Single Stuck-at 0/1 Testing Costs


Book Description

Abstract: "Monitoring the quiescent power supply current (IDDQ) of CMOS circuits has been proposed for the detection of many common faults not modeled by the Single Line Stuck-at 0/1 Fault (SSF) model. This paper shows that a relatively small number of random vectors should provide good coverage of these faults. The results of fault simulation of the ISCAS combinational benchmark circuits are presented to demonstrate the comparative ease of IDDQ testing versus SSF testing."




18th IEEE VLSI Test Symposium


Book Description

Proceedings of a spring 2000 symposium, highlighting novel ideas and approaches to current and future problems related to testing of electronic circuits and systems. Themes are microprocessor test/validation, low power BIST and scan, technology trends, scan- related approaches, defect-driven techniques, and system-on-chip test techniques. Other subjects are analog test techniques, temperature and process drift issues, test compaction and design validation, analog BIST, and functional test and verification issues. Also covered are STIL extension, IDDQ test, and on-line testing and fault tolerance. Lacks a subject index. Annotation copyrighted by Book News, Inc., Portland, OR.




IEEE VLSI Test Symposium


Book Description