Advances in Chemical Engineering and Advanced Materials IV


Book Description

Selected, peer reviewed papers from the 4th International Conference on Chemical Engineering and Advanced Materials (CEAM 2014), August 9-10, 2014, Shenzhen, China




Nanotechnology and Advanced Materials


Book Description

Selected, peer reviewed papers from the 2012 International Conference on Nanotechnology Technology and Advanced Materials (ICNTAM 2012), April 12-13, 2012, Hong Kong




Advanced Technologies in Manufacturing, Engineering and Materials


Book Description

Selected, peer reviewed papers from the 2013 International Forum on Mechanical and Material Engineering (IFMME 2013), June 13-14, Guangzhou, China




Advanced Bioelectronic Materials


Book Description

This book covers the recent advances in the development of bioelectronics systems and their potential application in future biomedical applications starting from system design to signal processing for physiological monitoring, to in situ biosensing. Advanced Bioelectronic Materials contributions from distinguished international scholars whose backgrounds mirror the multidisciplinary readership ranging from the biomedical sciences, biosensors and engineering communities with diverse backgrounds, interests and proficiency in academia and industry. The readers will benefit from the widespread coverage of the current literature, state-of-the-art overview of all facets of advanced bioelectronics materials ranging from real time monitoring, in situ diagnostics, in vivo imaging, image-guided therapeutics, biosensors, and translational biomedical devices and personalized monitoring.




Conventional and Powder Mixed Electro-Discharge Machining


Book Description

This book presents the evolution of the electro-discharge machining (EDM) process from conventional EDM to powder mixed EDM with emphases on biomedical applications. It discusses the theory behind each process and their applications in the field of biomedical research, and presents a brief background to various EDM processes, current research challenges, and detailed case studies of powder mixed EDM of various materials. It also includes a state-of-the-art review of the EDM process. Features: Focuses on biomedical implant and device manufacturing using commercialization of powder mixed electro-discharge machining (PM-EDM) technology Discusses surface modification of biomaterials through the PM-EDM process Reviews processing of the metallic biomaterials for biomedical applications Explores optimization of the process factors for achieving optimal responses using NSGA-II Includes comprehensive mechanism and application details of the PM-EDM process This book is aimed at graduate students and researchers in manufacturing, production, materials, and biomedical engineering.




19th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures - A, Volume 16, Issue 4


Book Description

This volume is part of the Ceramic Engineering and Science Proceeding (CESP) series. This series contains a collection of papers dealing with issues in both traditional ceramics (i.e., glass, whitewares, refractories, and porcelain enamel) and advanced ceramics. Topics covered in the area of advanced ceramic include bioceramics, nanomaterials, composites, solid oxide fuel cells, mechanical properties and structural design, advanced ceramic coatings, ceramic armor, porous ceramics, and more.




Advances in Materials Processing X


Book Description

Selected, peer reviewed papers from the 10th Asia-Pacific Conference on Materials Processing (APCMP 2012), June 14-17, 2012, Jinan, China




From Additive Manufacturing to 3D/4D Printing 3


Book Description

With a turnover of some 5-15 billion € / year, the additive manufacturing has industrial niches bearers thanks to processes and materials more and more optimized. While some niches still exist on the application of additive techniques in traditional fields (from jewelery to food for example), several trends emerge, using new concepts: collective production, realization of objects at once (without addition Of material), micro-fluidic, 4D printing exploiting programmable materials and materials, bio-printing, etc. There are both opportunities for new markets, promises not envisaged less than 10 years ago, but difficulties in reaching them.




Constrained Deformation of Materials


Book Description

"Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling" is an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical deformations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme. Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike.




Emerging Trends in Computing and Expert Technology


Book Description

This book presents high-quality research papers that demonstrate how emerging technologies in the field of intelligent systems can be used to effectively meet global needs. The respective papers highlight a wealth of innovations and experimental results, while also addressing proven IT governance, standards and practices, and new designs and tools that facilitate rapid information flows to the user. The book is divided into five major sections, namely: “Advances in High Performance Computing”, “Advances in Machine and Deep Learning”, “Advances in Networking and Communication”, “Advances in Circuits and Systems in Computing” and “Advances in Control and Soft Computing”.