Ceramic Materials and Multilayer Electronic Devices


Book Description

This volume contains a collection of 40 papers from two symposia: Advanced Dielectric Materials and Multilayer Electronic Devices and High Strain Piezoelectric Materials, Devices and Applications. Topics include fundamental and historical perspectives of dielectric materials; relaxor materials and devices; high strain piezoelectric devices; advanced aspects of powder preparation, characterization, and properties; thin films; materials for low and high frequency applications; processing-structure-property-relationships; and future applications. Proceedings of the symposium held at the 105th Annual Meeting of The American Ceramic Society, April 27-30, 2003, in Nashville, Tennessee; Ceramic Transactions, Volume 150.




Ceramic Materials for Electronics


Book Description

The Third Edition of Ceramic Materials for Electronics studies a wide range of ceramic materials, including insulators, conductors, piezoelectrics, and ferroelectrics, through detailed discussion of their properties, characterization, fabrication, and applications in electronics. The author summarizes the latest trends and advancements in the field, and explores important topics such as ceramic thin film, functional device technology, and thick film technology. Edited by a leading expert on the subject, this new edition includes more than 150 pages of new information; restructured reference materials, figures, and tables; as well as additional device application-oriented segments.




Developments in Dielectric Materials and Electronic Devices


Book Description

Papers in this volume include topics such as materials synthesis and processing; relaxors; novel compositions; material design; materials for multilayer electronic devices; processing-microstructure-property relationship; applications; environmental issues; and economic/cost analysis of tomorrow's electronic devices. Includes 38 papers.




Sintering of Advanced Materials


Book Description

Sintering is a method for manufacturing components from ceramic or metal powders by heating the powder until the particles adhere to form the component required. The resulting products are characterised by an enhanced density and strength, and are used in a wide range of industries. Sintering of advanced materials: fundamentals and processes reviews important developments in this technology and its applicationsPart one discusses the fundamentals of sintering with chapters on topics such as the thermodynamics of sintering, kinetics and mechanisms of densification, the kinetics of microstructural change and liquid phase sintering. Part two reviews advanced sintering processes including atmospheric sintering, vacuum sintering, microwave sintering, field/current assisted sintering and photonic sintering. Finally, Part three covers sintering of aluminium, titanium and their alloys, refractory metals, ultrahard materials, thin films, ultrafine and nanosized particles for advanced materials.With its distinguished editor and international team of contributors, Sintering of advanced materials: fundamentals and processes reviews the latest advances in sintering and is a standard reference for researchers and engineers involved in the processing of ceramics, powder metallurgy, net-shape manufacturing and those using advanced materials in such sectors as electronics, automotive and aerospace engineering. - Explores the thermodynamics of sintering including sinter bonding and densification - Chapters review a variety of sintering methods including atmosphere, vacuum, liquid phase and microwave sintering - Discusses sintering of a variety of materials featuring refractory metals, super hard materials and functionally graded materials




Multilayered Low Temperature Cofired Ceramics (LTCC) Technology


Book Description

The only book to concentrate solely on low temperature cofired ceramics, an attractive technology for electronic components and substrates that are compact, light, and offer high-speed and functionality for portable electronic devices.




Advances in Electronic and Electrochemical Ceramics


Book Description

This proceedings contains papers presented at the Electronics inExtreme Environments, International Fuel Cells and Related Systems,and Advanced Dielectrics for Wireless Communicationssymposia.







Morphotropic Phase Boundary Perovskites, High Strain Piezoelectrics, and Dielectric Ceramics


Book Description

Proceedings of the Symposium on Dielectric Materials and Multilayer Electronic Devices and the Symposium on Morphotropic Phase Boundary Phenomena and Perovskite Materials, held April 28 - May 1, 2002, in St. Louis, Missouri, during the 104th Annual Meeting of the American Ceramic Society, and the Focused Session on High Strain Piezoelectrics, held April 22-25, 2001, in Indianapolis, Indiana, during the 103rd Annual Meeting of the American Ceramic Society.







Advances in Multifunctional Materials and Systems


Book Description

The symposia Advances in Electroceramics and Microwave Materials and Their Applications were held during the 8th Pacific Rim Conference on Ceramic and Glass Technology (PACRIM 8) from May 31-June 5, 2009 in Vancouver, Canada. This issue contains 17 peer-reviewed papers (invited and contributed) from these two symposia. The book is logically organized and carefully selected articles give insight into multifunctional materials and systems and incorporates the latest developments related to multifunctional materials and systems including electroceramics and microwave materials.