Comprehensive Structural Integrity


Book Description

The aim of this major reference work is to provide a first point of entry to the literature for the researchers in any field relating to structural integrity in the form of a definitive research/reference tool which links the various sub-disciplines that comprise the whole of structural integrity. Special emphasis will be given to the interaction between mechanics and materials and structural integrity applications. Because of the interdisciplinary and applied nature of the work, it will be of interest to mechanical engineers and materials scientists from both academic and industrial backgrounds including bioengineering, interface engineering and nanotechnology. The scope of this work encompasses, but is not restricted to: fracture mechanics, fatigue, creep, materials, dynamics, environmental degradation, numerical methods, failure mechanisms and damage mechanics, interfacial fracture and nano-technology, structural analysis, surface behaviour and heart valves. The structures under consideration include: pressure vessels and piping, off-shore structures, gas installations and pipelines, chemical plants, aircraft, railways, bridges, plates and shells, electronic circuits, interfaces, nanotechnology, artificial organs, biomaterial prostheses, cast structures, mining... and more. Case studies will form an integral part of the work.







Electromigration in Metals


Book Description

Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.




Structural Health Monitoring Damage Detection Systems for Aerospace


Book Description

This open access book presents established methods of structural health monitoring (SHM) and discusses their technological merit in the current aerospace environment. While the aerospace industry aims for weight reduction to improve fuel efficiency, reduce environmental impact, and to decrease maintenance time and operating costs, aircraft structures are often designed and built heavier than required in order to accommodate unpredictable failure. A way to overcome this approach is the use of SHM systems to detect the presence of defects. This book covers all major contemporary aerospace-relevant SHM methods, from the basics of each method to the various defect types that SHM is required to detect to discussion of signal processing developments alongside considerations of aerospace safety requirements. It will be of interest to professionals in industry and academic researchers alike, as well as engineering students. This article/publication is based upon work from COST Action CA18203 (ODIN - http://odin-cost.com/), supported by COST (European Cooperation in Science and Technology). COST (European Cooperation in Science and Technology) is a funding agency for research and innovation networks. Our Actions help connect research initiatives across Europe and enable scientists to grow their ideas by sharing them with their peers. This boosts their research, career and innovation.




Micromechanics and Nanoscale Effects


Book Description

This volume consists of the state-of-the-art reports on new developments in micromechanics and the modeling of nanoscale effects, and is a companion book to the recent Kluwer volume on nanomechanics and mul- scale modeling (it is entitled Trends in Nanoscale Mechanics). The two volumes grew out of a series of discussions held at NASA Langley Research Center (LaRC), lectures and other events shared by many researchers from the national research laboratories and academia. The key events include the 2001 Summer Series of Round-Table Discussions on Nanotechnology at ICASE Institute (NASA LaRC) organized by Drs. V. M. Harik and M. D. Salas and the 2002 NASA LaRC Workshop on Multi-scale Modeling. The goal of these interactions was to foster collaborations between academic researchers and the ICASE Institute (NASA LaRC), a universi- based institute, which has pioneered world-class computational, theoretical and experimental research in the disciplines that are important to NASA. Editors gratefully acknowledge help of Ms. E. Todd (ICASE, NASA LaRC), the ICASE Director M. D. Salas and all reviewers, in particular, Dr. B. Diskin (ICASE/NIA, NASA LaRC), Prof. R. Haftka (University of Florida), Dr. V. M. Harik (ICASE/Swales Aerospace, NASA LaRC), Prof.




More-than-Moore Devices and Integration for Semiconductors


Book Description

This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems. Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems; Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources; Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.




Integrated Interconnect Technologies for 3D Nanoelectronic Systems


Book Description

This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.







Thin Films On Silicon: Electronic And Photonic Applications


Book Description

This volume provides a broad overview of the fundamental materials science of thin films that use silicon as an active substrate or passive template, with an emphasis on opportunities and challenges for practical applications in electronics and photonics. It covers three materials classes on silicon: Semiconductors such as undoped and doped Si and SiGe, SiC, GaN, and III-V arsenides and phosphides; dielectrics including silicon nitride and high-k, low-k, and electro-optically active oxides; and metals, in particular silicide alloys. The impact of film growth and integration on physical, electrical, and optical properties, and ultimately device performance, is highlighted.




Reviews in Computational Chemistry, Volume 26


Book Description

Computational chemistry is increasingly used in conjunction with organic, inorganic, medicinal, biological, physical, and analytical chemistry, biotechnology, materials science, and chemical physics. This series is essential in keeping those individuals involved in these fields abreast of recent developments in computational chemistry.