Author : M. Meyyappan
Publisher : Artech House Publishers
Page : 384 pages
File Size : 21,97 MB
Release : 1995
Category : Computers
ISBN :
This book provides you with in-depth coverage of the models, governing equations, and numerical techniques suitable for process simulation -- so you can give your designs the competitive edge. You will understand the basic principles of transport phenomena, gas phase, and surface reactions in electronics material processing, and learn practical numerical techniques used in process simulations.
Author : M. Meyyappan
Publisher : The Electrochemical Society
Page : 644 pages
File Size : 37,13 MB
Release : 1995
Category : Technology & Engineering
ISBN : 9781566770965
Author : Lars Mönch
Publisher : Springer Science & Business Media
Page : 298 pages
File Size : 47,4 MB
Release : 2012-09-12
Category : Business & Economics
ISBN : 1461444713
Over the last fifty-plus years, the increased complexity and speed of integrated circuits have radically changed our world. Today, semiconductor manufacturing is perhaps the most important segment of the global manufacturing sector. As the semiconductor industry has become more competitive, improving planning and control has become a key factor for business success. This book is devoted to production planning and control problems in semiconductor wafer fabrication facilities. It is the first book that takes a comprehensive look at the role of modeling, analysis, and related information systems for such manufacturing systems. The book provides an operations research- and computer science-based introduction into this important field of semiconductor manufacturing-related research.
Author : Yoshio Nishi
Publisher : CRC Press
Page : 3276 pages
File Size : 18,54 MB
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 1351829823
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Author : Roy Leventhal
Publisher : Springer Science & Business Media
Page : 769 pages
File Size : 34,56 MB
Release : 2007-01-10
Category : Technology & Engineering
ISBN : 0387241604
Discusses process variation, model accuracy, design flow and many other practical engineering, reliability and manufacturing issues Gives a good overview for a person who is not an expert in modeling and simulation, enabling them to extract the necessary information to competently use modeling and simulation programs Written for engineering students and product design engineers
Author : Dimitris Tsoukalas
Publisher : Springer Science & Business Media
Page : 463 pages
File Size : 47,66 MB
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 3709162440
This volume contains the Proceedings of the International Conference on Simulation of Semiconductor Devices and Processes, SISPAD 01, held on September 5–7, 2001, in Athens. The conference provided an open forum for the presentation of the latest results and trends in process and device simulation. The trend towards shrinking device dimensions and increasing complexity in process technology demands the continuous development of advanced models describing basic physical phenomena involved. New simulation tools are developed to complete the hierarchy in the Technology Computer Aided Design simulation chain between microscopic and macroscopic approaches. The conference program featured 8 invited papers, 60 papers for oral presentation and 34 papers for poster presentation, selected from a total of 165 abstracts from 30 countries around the world. These papers disclose new and interesting concepts for simulating processes and devices.
Author : Peter Sloot
Publisher : Springer Science & Business Media
Page : 1124 pages
File Size : 32,46 MB
Release : 2003-05-22
Category : Computers
ISBN : 3540401946
The four-volume set LNCS 2657, LNCS 2658, LNCS 2659, and LNCS 2660 constitutes the refereed proceedings of the Third International Conference on Computational Science, ICCS 2003, held concurrently in Melbourne, Australia and in St. Petersburg, Russia in June 2003. The four volumes present more than 460 reviewed contributed and invited papers and span the whole range of computational science, from foundational issues in computer science and algorithmic mathematics to advanced applications in virtually all application fields making use of computational techniques. These proceedings give a unique account of recent results in the field.
Author : Jarek Dabrowski
Publisher : Springer Science & Business Media
Page : 505 pages
File Size : 40,14 MB
Release : 2013-03-09
Category : Technology & Engineering
ISBN : 3662094320
Predictive Simulation of Semiconductor Processing enables researchers and developers to extend the scaling range of semiconductor devices beyond the parameter range of empirical research. It requires a thorough understanding of the basic mechanisms employed in device fabrication, such as diffusion, ion implantation, epitaxy, defect formation and annealing, and contamination. This book presents an in-depth discussion of our current understanding of key processes and identifies areas that require further work in order to achieve the goal of a comprehensive, predictive process simulation tool.
Author : M. Meyyappan
Publisher :
Page : 58 pages
File Size : 12,30 MB
Release : 1997
Category : Semiconductors
ISBN :
Author : T. J. Chung
Publisher : Cambridge University Press
Page : 1040 pages
File Size : 29,47 MB
Release : 2002-02-07
Category : Juvenile Nonfiction
ISBN : 9780521594165
Increasingly, computational fluid dynamics (CFD) techniques are being used to study and solve complex fluid flow and heat transfer problems. This comprehensive book ranges from elementary concepts for the beginner to state-of-the-art CFD for the practitioner. It begins with CFD preliminaries, in which the basic principles of finite difference (FD), finite element (FE), and finite volume (FV) methods are discussed and illustrated through examples, with step-by-step hand calculations. Then, FD and FE methods respectively are covered, including both historical developments and recent contributions. The next section is devoted to structured and unstructured grids, adaptive methods, computing techniques, and parallel processing. Finally, the author describes a variety of practical applications to problems in turbulence, reacting flows and combustion, acoustics, combined mode radiative heat transfer, multiphase flows, electromagnetic fields, and relativistic astrophysical flows. Students and practitioners - particularly in mechanical, aerospace, chemical, and civil engineering - will use this authoritative text to learn about and apply numerical techniques to the solution of fluid dynamics problems.
