Cooling by Natural and Mixed Convection Inside Vented Enclosure


Book Description

This book provides a, student oriented investigation to numerical convective heat transfer analysis. basic ideas are discussed in detail and full devlopement of all importent results is provided. the assumptions on which studies of convective heat transfer problems are thoroughtly discussed. The book contains many worked examples that explained the numerical methods of cooling by natural and mixed convection. Highlights of the book include: 1. A literature review concerning different enclosures shows that some several works have considered the problem of natural and mixed convection . 2. Mathematical and numerical procedure for convective heat transfer 3. A detailed discussion of the numerical investigations of natural and mixed convetion. This book, which can use to support of courses on natural and mixed convection phenomena.










Cooling of Electronic Systems


Book Description

Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.




Advances in Applied Mechanics


Book Description

This book reports on advances in applied mechanics research and applications. It covers methods, modeling, and simulation tools for products design, material behavior analysis, and for optimizing production processes. It also reports on cutting-edge techniques for increasing performance of mechanical systems. The book gathers selected contributions to the 11th International Congress for Applied Mechanics (JET’2022), held on November 16-18, 2022, in Marrakech, Morocco. The congress was organized by the Franco-Maghreb Association of Mechanics and Materials (AF3M) with the close collaboration of the Moroccan Society of Mechanical Sciences (SMSM). Overall, this book gives a special emphasis to theoretical and practical advances in mechanics, supporting sustainable and environmentally friendly development. It covers applications in transportation, building engineering, bioengineering and manufacturing.




Electronics Cooling


Book Description

Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.




Experimental Heat Transfer, Fluid Mechanics and Thermodynamics 1993


Book Description

The papers contained in this volume reflect the ingenuity and originality of experimental work in the areas of fluid mechanics, heat transfer and thermodynamics. The contributors are drawn from 27 countries which indicates how well the worldwide scientific community is networked. The papers cover a broad spectrum from the experimental investigation of complex fundamental physical phenomena to the study of practical devices and applications. A uniform outline and method of presentation has been used for each paper.




Fluid Mechanics and Fluid Power – Contemporary Research


Book Description

This volume comprises the proceedings of the 42nd National and 5th International Conference on Fluid Mechanics and Fluid Power held at IIT Kanpur in December, 2014.The conference proceedings encapsulate the best deliberations held during the conference. The diversity of participation in the conference, from academia, industry and research laboratories reflects in the articles appearing in the volume. This contributed volume has articles from authors who have participated in the conference on thematic areas such as Fundamental Issues and Perspectives in Fluid Mechanics; Measurement Techniques and Instrumentation; Computational Fluid Dynamics; Instability, Transition and Turbulence; Turbomachinery; Multiphase Flows; Fluid‐Structure Interaction and Flow‐Induced Noise; Microfluidics; Bio‐inspired Fluid Mechanics; Internal Combustion Engines and Gas Turbines; and Specialized Topics. The contents of this volume will prove useful to researchers from industry and academia alike.