Thermal System Design and Simulation


Book Description

Thermal System Design and Simulation covers the fundamental analyses of thermal energy systems that enable users to effectively formulate their own simulation and optimal design procedures. This reference provides thorough guidance on how to formulate optimal design constraints and develop strategies to solve them with minimal computational effort. The book uniquely illustrates the methodology of combining information flow diagrams to simplify system simulation procedures needed in optimal design. It also includes a comprehensive presentation on dynamics of thermal systems and the control systems needed to ensure safe operation at varying loads. Designed to give readers the skills to develop their own customized software for simulating and designing thermal systems, this book is relevant for anyone interested in obtaining an advanced knowledge of thermal system analysis and design. - Contains detailed models of simulation for equipment in the most commonly used thermal engineering systems - Features illustrations for the methodology of using information flow diagrams to simplify system simulation procedures - Includes comprehensive global case studies of simulation and optimization of thermal systems




Design and Thermal Performance


Book Description

The Chinese constitute the third major community in the world to have lived continuously below ground for many millennia. With case studies representing different geographical and cultural environments, this work shows how Chinese below-ground dwellings provide a comfortable ambient environment with low construction costs.




Materials for Energy Efficiency and Thermal Comfort in Buildings


Book Description

Almost half of the total energy produced in the developed world is inefficiently used to heat, cool, ventilate and control humidity in buildings, to meet the increasingly high thermal comfort levels demanded by occupants. The utilisation of advanced materials and passive technologies in buildings would substantially reduce the energy demand and improve the environmental impact and carbon footprint of building stock worldwide.Materials for energy efficiency and thermal comfort in buildings critically reviews the advanced building materials applicable for improving the built environment. Part one reviews both fundamental building physics and occupant comfort in buildings, from heat and mass transport, hygrothermal behaviour, and ventilation, on to thermal comfort and health and safety requirements.Part two details the development of advanced materials and sustainable technologies for application in buildings, beginning with a review of lifecycle assessment and environmental profiling of materials. The section moves on to review thermal insulation materials, materials for heat and moisture control, and heat energy storage and passive cooling technologies. Part two concludes with coverage of modern methods of construction, roofing design and technology, and benchmarking of façades for optimised building thermal performance.Finally, Part three reviews the application of advanced materials, design and technologies in a range of existing and new building types, including domestic, commercial and high-performance buildings, and buildings in hot and tropical climates.This book is of particular use to, mechanical, electrical and HVAC engineers, architects and low-energy building practitioners worldwide, as well as to academics and researchers in the fields of building physics, civil and building engineering, and materials science. - Explores improving energy efficiency and thermal comfort through material selection and sustainable technologies - Documents the development of advanced materials and sustainable technologies for applications in building design and construction - Examines fundamental building physics and occupant comfort in buildings featuring heat and mass transport, hygrothermal behaviour and ventilation




Advanced Thermal Design of Electronic Equipment


Book Description

With today's high density, high performance electronic systems, packaging and more specifically thermal engineering has become the critical factor that limits on-time product introduction and reliability in the field. This book serves as a reference for engineers who must predict the thermal performance of a company's latest product as well as the technicians who must quickly solve the problem of an overheating chip in a product that is already on the shelves.




Handbook of Applied Thermal Design


Book Description

Gives a foundation to the four principle facets of thermal design: heat transfer analysis, materials performance, heating and cooling technology, and instrumentation and control. The focus is on providing practical thermal design and development guidance across the spectrum of problem analysis, material applications, equipment specification, and sensor and control selection.







Thermal Design of Electronic Equipment


Book Description

In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.




Plate Heat Exchangers


Book Description

Plate-and-frame heat exchangers (PHEs) are used in many different processes at a broad range of temperatures and with a variety of substances. Research into PHEs has increased considerably in recent years and this is a compilation of knowledge on the subject. Containing invited contributions from prominent and active investigators in the area, it should enable graduate students, researchers, and research and development engineers in industry to achieve a better understanding of transport processes. Some guidelines for design and development are also included.




The Art of Software Thermal Management for Embedded Systems


Book Description

This book introduces Software Thermal Management (STM) as a means of reducing power consumption in a computing system in order to manage heat, improve component reliability and increase system safety. Readers will benefit from this pragmatic guide to the field of STM for embedded systems and its catalog of software power management techniques. Since thermal management is a key bottleneck in embedded systems design, this book focuses on root cause of heat in embedded systems: power. Since software has an enormous impact on power consumption in an embedded system, this book urges software engineers to manage heat effectively by understanding, categorizing and developing new ways to reduce static and dynamic power consumption. Whereas most books on thermal management describe mechanisms to remove heat, this book focuses on ways for software engineers to avoid generating heat in the first place.




Heat Pipe Design and Technology


Book Description

This book provides a practical study of modern heat pipe engineering, discussing how it can be optimized for use on a wider scale. An introduction to operational and design principles, this book offers a review of heat and mass transfer theory relevant to performance, leading into and exploration of the use of heat pipes, particularly in high-heat flux applications and in situations in which there is any combination of non-uniform heat loading, limited airflow over the heat generating components, and space or weight constraints. Key implementation challenges are tackled, including load-balancing, materials characteristics, operating temperature ranges, thermal resistance, and operating orientation. With its presentation of mathematical models to calculate heat transfer limitations and temperature gradient of both high- and low-temperature heat pipes, the book compares calculated results with the available experimental data. It also includes a series of computer programs developed by the author to support presented data, aid design, and predict performance.