Author :
Publisher :
Page : pages
File Size : 20,62 MB
Release : 2013
Category : Electronic packaging
ISBN : 9781479907052
Author : Institute of Electrical and Electronics Engineers (New York, NY)
Publisher :
Page : 269 pages
File Size : 44,88 MB
Release : 2013-10-27
Category :
ISBN : 9781479907083
Author : IEEE Staff
Publisher :
Page : pages
File Size : 46,93 MB
Release : 2020-10-05
Category :
ISBN : 9781728161624
EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high speed designs EPEPS is jointly sponsored by the IEEE Electronics Packaging Society and IEEE Microwave Theory and Techniques Society
Author : Topical Meeting on Electrical Performance of Electronic Packaging
Publisher :
Page : 70 pages
File Size : 41,14 MB
Release : 2000
Category :
ISBN :
Author :
Publisher :
Page : 367 pages
File Size : 50,80 MB
Release : 2007
Category :
ISBN :
Author :
Publisher :
Page : 313 pages
File Size : 20,53 MB
Release : 2018
Category :
ISBN : 9781538651667
Author : IEEE Staff
Publisher :
Page : pages
File Size : 45,14 MB
Release : 2008
Category :
ISBN : 9781509075706
Author :
Publisher :
Page : 0 pages
File Size : 10,18 MB
Release : 2014
Category : Electronic packaging
ISBN : 9781479936410
Author :
Publisher :
Page : 245 pages
File Size : 42,72 MB
Release : 2014
Category : Electronic packaging
ISBN : 9781479936434
Author : IEEE Microwave Theory and Techniques Society
Publisher : IEEE
Page : 300 pages
File Size : 15,86 MB
Release : 1998
Category : Technology & Engineering
ISBN : 9780780349650
This volume covers the topics of this meeting, the general topic of which is electrical design, analysis, and characterization of electronic interconnections and packaging structures for performance-driven, high-speed/high complexity electronic systems.
