A Guide to Additive Manufacturing


Book Description

This open access book gives both a theoretical and practical overview of several important aspects of additive manufacturing (AM). It is written in an educative style to enable the reader to understand and apply the material. It begins with an introduction to AM technologies and the general workflow, as well as an overview of the current standards within AM. In the following chapter, a more in-depth description is given of design optimization and simulation for AM in polymers and metals, including practical guidelines for topology optimization and the use of lattice structures. Special attention is also given to the economics of AM and when the technology offers a benefit compared to conventional manufacturing processes. This is followed by a chapter with practical insights into how AM materials and processing parameters are developed for both material extrusion and powder bed fusion. The final chapter describes functionally graded AM in various materials and technologies. Throughout the book, a large number of industrial applications are described to exemplify the benefits of AM.




Proceedings of SIE 2023


Book Description

This book showcases the state of the art in the field of electronics, as presented by researchers and engineers at the 54th Annual Meeting of the Italian Electronics Society (SIE), held in Noto (SR), Italy, on September 6–8, 2023. It covers a broad range of aspects, including: integrated circuits and systems, micro- and nano-electronic devices, microwave electronics, sensors and microsystems, optoelectronics and photonics, power electronics, electronic systems and applications.




Principles of Electronic Materials and Devices


Book Description

Principles of Electronic Materials and Devices, Third Edition, is a greatly enhanced version of the highly successful text Principles of Electronic Materials and Devices, Second Edition. It is designed for a first course on electronic materials given in Materials Science and Engineering, Electrical Engineering, and Physics and Engineering Physics Departments at the undergraduate level. The third edition has numerous revisions that include more beautiful illustrations and photographs, additional sections, more solved problems, worked examples, and end-of-chapter problems with direct engineering applications. The revisions have improved the rigor without sacrificing the original semiquantitative approach that both the students and instructors liked and valued. Some of the new end-of-chapter problems have been especially selected to satisfy various professional engineering design requirements for accreditation across international borders. Advanced topics have been collected under Additional Topics, which are not necessary in a short introductory treatment.




More-than-Moore 2.5D and 3D SiP Integration


Book Description

This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.




SIE Exam Prep 2021 and 2022


Book Description

Test Prep Books' SIE Exam Prep 2021 and 2022: SIE Study Guide with Practice Test Questions for the FINRA Securities Industry Essentials Exam [4th Edition Book] Made by Test Prep Books experts for test takers trying to achieve a great score on the Series SIE exam. This comprehensive study guide includes: Quick Overview Find out what's inside this guide! Test-Taking Strategies Learn the best tips to help overcome your exam! Introduction Get a thorough breakdown of what the test is and what's on it! Knowledge of Capital Markets Understanding Products and Their Risks Trading, Customers Accounts, and Prohibited Activities Overview of Regulatory Framework Practice Questions Practice makes perfect! Detailed Answer Explanations Figure out where you went wrong and how to improve! Studying can be hard. We get it. That's why we created this guide with these great features and benefits: Comprehensive Review: Each section of the test has a comprehensive review created by Test Prep Books that goes into detail to cover all of the content likely to appear on the test. Practice Test Questions: We want to give you the best practice you can find. That's why the Test Prep Books practice questions are as close as you can get to the actual Series SIE test. Answer Explanations: Every single problem is followed by an answer explanation. We know it's frustrating to miss a question and not understand why. The answer explanations will help you learn from your mistakes. That way, you can avoid missing it again in the future. Test-Taking Strategies: A test taker has to understand the material that is being covered and be familiar with the latest test taking strategies. These strategies are necessary to properly use the time provided. They also help test takers complete the test without making any errors. Test Prep Books has provided the top test-taking tips. Customer Service: We love taking care of our test takers. We make sure that you interact with a real human being when you email your comments or concerns. Anyone planning to take this exam should take advantage of this Test Prep Books study guide. Purchase it today to receive access to: Series SIE review materials Series SIE practice questions Test-taking strategies




3D Image Processing


Book Description

Few fields have witnessed such impressive advances as the application of computer technology to radiology. The progress achieved has revolutionized diagnosis and greatly facilitated treatment selection and accurate planning of procedures. This book, written by leading experts from many different countries, provides a comprehensive and up-to-date overview of the role of 3D image processing. The first section covers a wide range of technical aspects in an informative way. This is followed by the main section, in which the principal clinical applications are described and discussed in depth. To complete the picture, the final section focuses on recent developments in functional imaging and computer-aided surgery. This book will prove invaluable to all who have an interest in this complex but vitally important field.




Design Tools and Methods in Industrial Engineering II


Book Description

This book gathers original papers reporting on innovative methods and tools in design, modelling, simulation and optimization, and their applications in engineering design, manufacturing and other relevant industrial sectors. Topics span from advances in geometric modelling, applications of virtual reality, innovative strategies for product development and additive manufacturing, human factors and user-centered design, engineering design education and applications of engineering design methods in medical rehabilitation and cultural heritage. Chapters are based on contributions to the Second International Conference on Design Tools and Methods in Industrial Engineering, ADM 2021, held on September 9–10, 2021, in Rome, Italy, and organized by the Italian Association of Design Methods and Tools for Industrial Engineering, and Dipartimento di Ingegneria Meccanica e Aerospaziale of Sapienza Università di Roma, Italy. All in all, this book provides academics and professionals with a timely overview and extensive information on trends and technologies in industrial design and manufacturing.




Light-Emitting Diodes (3rd Edition, 2018)


Book Description

The 1st edition of the book “Light-Emitting Diodes” was published in 2003. The 2nd edition was published in 2006. The current 3rd edition of the book, a substantial expansion of the second edition, has 37 Chapters and includes a thorough discussion of white light-emitting diodes (LEDs), phosphor materials used in white LEDs, an expanded discussion of the various efficiencies encountered in the context of LEDs, and packaging materials and device technology. The background of light, color science, and human vision is provided as well. In the current edition, the fully colored illustrations are highly beneficial given the prominent role of light and color in the field of LEDs. The book is intended to be a comprehensive discussion of LEDs, particularly the physics, chemistry, and engineering associated with LEDs. It is published in electronic format in order to make the book affordable and easily accessible to a wide readership.




Product Design and Development


Book Description

This text presents a set of product development techniques aimed at bringing together the marketing, design, and manufacturing functions of the enterprise. The integrative methods facilitate problem-solving and decision-making.




From Additive Manufacturing to 3D/4D Printing 1


Book Description

In 1984, additive manufacturing represented a new methodology for manipulating matter, consisting of harnessing materials and/or energy to create three-dimensional physical objects. Today, additive manufacturing technologies represent a market of around 5 billion euros per year, with an annual growth between 20 and 30%. Different processes, materials and dimensions (from nanometer to decameter) within additive manufacturing techniques have led to 70,000 publications on this topic and to several thousand patents with applications as wide-ranging as domestic uses. Volume 1 of this series of books presents these different technologies with illustrative industrial examples. In addition to the strengths of 3D methods, this book also covers their weaknesses and the developments envisaged in terms of incremental innovations to overcome them.