CVD-XII
Author : Klavs F. Jensen
Publisher :
Page : 460 pages
File Size : 21,43 MB
Release : 1993
Category : Technology & Engineering
ISBN :
Author : Klavs F. Jensen
Publisher :
Page : 460 pages
File Size : 21,43 MB
Release : 1993
Category : Technology & Engineering
ISBN :
Author :
Publisher :
Page : 856 pages
File Size : 44,4 MB
Release : 1996
Category : Conference proceedings
ISBN :
Author :
Publisher :
Page : 680 pages
File Size : 22,82 MB
Release : 1992
Category : Plasma engineering
ISBN :
Author :
Publisher :
Page : 770 pages
File Size : 32,84 MB
Release : 1991
Category : Compound semiconductors
ISBN :
Author :
Publisher : Academic Press
Page : 425 pages
File Size : 36,11 MB
Release : 1993-08-10
Category : Technology & Engineering
ISBN : 0080864368
Semiconductors and Semimetals
Author :
Publisher :
Page : 2332 pages
File Size : 27,15 MB
Release : 1993
Category : Electric engineering
ISBN :
Author : Eli Kapon
Publisher : Academic Press
Page : 400 pages
File Size : 33,8 MB
Release : 1999-01-14
Category : Science
ISBN : 9780123976314
Judging from the impact it has on our everyday lives, the semiconductor laser has emerged as perhaps the most important laser device currently in use. This volume presents information on recent advances in materials and structures.
Author : Peter Ramm
Publisher : John Wiley & Sons
Page : 435 pages
File Size : 30,25 MB
Release : 2012-02-13
Category : Technology & Engineering
ISBN : 3527326464
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Author : Peter Wellmann
Publisher : John Wiley & Sons
Page : 743 pages
File Size : 49,76 MB
Release : 2022-01-10
Category : Technology & Engineering
ISBN : 3527346716
Wide Bandgap Semiconductors for Power Electronic A guide to the field of wide bandgap semiconductor technology Wide Bandgap Semiconductors for Power Electronics is a comprehensive and authoritative guide to wide bandgap materials silicon carbide, gallium nitride, diamond and gallium(III) oxide. With contributions from an international panel of experts, the book offers detailed coverage of the growth of these materials, their characterization, and how they are used in a variety of power electronics devices such as transistors and diodes and in the areas of quantum information and hybrid electric vehicles. The book is filled with the most recent developments in the burgeoning field of wide bandgap semiconductor technology and includes information from cutting-edge semiconductor companies as well as material from leading universities and research institutions. By taking both scholarly and industrial perspectives, the book is designed to be a useful resource for scientists, academics, and corporate researchers and developers. This important book: Presents a review of wide bandgap materials and recent developments Links the high potential of wide bandgap semiconductors with the technological implementation capabilities Offers a unique combination of academic and industrial perspectives Meets the demand for a resource that addresses wide bandgap materials in a comprehensive manner Written for materials scientists, semiconductor physicists, electrical engineers, Wide Bandgap Semiconductors for Power Electronics provides a state of the art guide to the technology and application of SiC and related wide bandgap materials.
Author : Herb Goronkin
Publisher : CRC Press
Page : 946 pages
File Size : 47,43 MB
Release : 1995-01-01
Category : Technology & Engineering
ISBN : 9780750302265
Compound Semiconductors 1994 provides a comprehensive overview of research and applications of gallium arsenide, indium phosphide, silicon carbide, and other compound semiconducting materials. Contributed by leading experts, the book discusses growth, characterization, processing techniques, device applications, high-power, high-temperature semiconductor devices, visible emitters and optoelectronic integrated circuits (OEICs), heterojunction transistors, nanoelectronics, and nanophotonics, and simulation and modeling. The book is an essential reference for researchers working on the fabrication of semiconductors, characterization of materials, and their applications for devices, such as lasers, photodiodes, sensors, and transistors, particularly in the high-speed telecommunications industries.