Feature Papers in Electronic Materials Section


Book Description

This book entitled "Feature Papers in Electronic Materials Section" is a collection of selected papers recently published on the journal Materials, focusing on the latest advances in electronic materials and devices in different fields (e.g., power- and high-frequency electronics, optoelectronic devices, detectors, etc.). In the first part of the book, many articles are dedicated to wide band gap semiconductors (e.g., SiC, GaN, Ga2O3, diamond), focusing on the current relevant materials and devices technology issues. The second part of the book is a miscellaneous of other electronics materials for various applications, including two-dimensional materials for optoelectronic and high-frequency devices. Finally, some recent advances in materials and flexible sensors for bioelectronics and medical applications are presented at the end of the book.




Feature Papers


Book Description

This book is a printed edition of the Special Issue "Feature Papers" that was published in Processes




Anniversary Feature Papers


Book Description

The Journal of Manufacturing and Materials Processing (JMMP) aims to provide an international forum for the documentation and dissemination of recent, original, and significant research studies in the analysis of processes, equipment, systems, and materials related to material heat treatment, solidification, deformation, addition, removal, welding, and accretion for the industrial fabrication and production of parts, components, and products. The JMMP was established in 2017 and has published more than 300 contributions. It has been listed in the ESCI, Inspec (IET), and Scopus (Elsevier). In celebration of the anniversary of the JMMP, the Editorial Office has put together this Special Issue, which includes several representative papers that reflect the vibrant growth and dynamic trend of research in this field.




Soft Material-Enabled Electronics for Medicine, Healthcare, and Human-Machine Interfaces


Book Description

Soft material-enabled electronics offer distinct advantage, over conventional rigid and bulky devices, for numerous wearable and implantable applications. Soft materials allow for seamless integration with skin and tissues due to enhanced mechanical flexibility and stretchability. Wearable devices, such as sensors, offer continuous, real-time monitoring of biosignals and movements, which can be applied in rehabilitation and diagnostics, among other applications. Soft implantable electronics offer similar functionalities, but with improved compatibility with human tissues. Biodegradable soft implantable electronics are also being developed for transient monitoring, such as in the weeks following surgery. To further advance soft electronics, materials, integration strategies, and fabrication techniques are being developed. This paper reviews recent progress in these areas, toward the development of soft material-enabled electronics for medicine, healthcare, and human-machine interfaces.




Feature Papers ”Age-Friendly Cities & Communities: State of the Art and Future Perspectives”


Book Description

The "Age-Friendly Cities & Communities: States of the Art and Future Perspectives" publication presents contemporary, innovative, and insightful narratives, debates, and frameworks based on an international collection of papers from scholars spanning the fields of gerontology, social sciences, architecture, computer science, and gerontechnology. This extensive collection of papers aims to move the narrative and debates forward in this interdisciplinary field of age-friendly cities and communities.




Flexible Electronics


Book Description

This excellent volume covers a range of materials used for flexible electronics, including semiconductors, dielectrics, and metals. The functional integration of these different materials is treated as well. Fundamental issues for both organic and inorganic materials systems are included. A corresponding overview of technological applications, based on each materials system, is presented to give both the non-specialist and the researcher in the field relevant information on the status of the flexible electronics area.




Electronic Properties of Materials


Book Description

The present book on electrical, optical, magnetic and thermal properties of materials is in many aspects different from other introductory texts in solid state physics. First of all, this book is written for engineers, particularly materials and electrical engineers who want to gain a fundamental under standing of semiconductor devices, magnetic materials, lasers, alloys, etc. Second, it stresses concepts rather than mathematical formalism, which should make the presentation relatively easy to understand. Thus, this book provides a thorough preparation for advanced texts, monographs, or special ized journal articles. Third, this book is not an encyclopedia. The selection oftopics is restricted to material which is considered to be essential and which can be covered in a 15-week semester course. For those professors who want to teach a two-semester course, supplemental topics can be found which deepen the understanding. (These sections are marked by an asterisk [*]. ) Fourth, the present text leaves the teaching of crystallography, X-ray diffrac tion, diffusion, lattice defects, etc. , to those courses which specialize in these subjects. As a rule, engineering students learn this material at the beginning of their upper division curriculum. The reader is, however, reminded of some of these topics whenever the need arises. Fifth, this book is distinctly divided into five self-contained parts which may be read independently.







Properties of Gallium Arsenide


Book Description

It was in 1986 that INSPEC (The Information Division of the Institution of Electrical Engineers) published the book Properties of Gallium Arsenide. Since then, major developments have taken place. This third edition is comprised of 150 specially commissioned articles contributed by experts from the USA, Europe and Japan.




Digital Twins


Book Description

The book series "Smart Computing Applications" provides a platform for researchers, academicians and practitioners to exchange ideas on recent theoretical and applied data science and computing technologies research, with a particular attention to the possible applications of such technologies in the industry, especially in the field of mechanical and industrial engineering. This series serves as a valuable resource for graduate, postgraduate, doctoral students, researchers, academicians and industry professionals.