Gas-pressure Bonding
Author : S. J. Paprocki
Publisher :
Page : 56 pages
File Size : 41,6 MB
Release : 1961
Category : Diffusion bonding (Metals)
ISBN :
Author : S. J. Paprocki
Publisher :
Page : 56 pages
File Size : 41,6 MB
Release : 1961
Category : Diffusion bonding (Metals)
ISBN :
Author : F. O. Bingman
Publisher :
Page : 132 pages
File Size : 36,12 MB
Release : 1963
Category : Nuclear fuel elements
ISBN :
Author : S. J. Paprocki
Publisher :
Page : 1 pages
File Size : 47,56 MB
Release : 1961
Category :
ISBN :
Open-ended Terms: Gas-pressure bonding. Solid-state-bonding by the gas-pressure-bonding process employs a gas at high pressure and elevated temperature in order to fabricate metallic or ceramic materials. The process has been used to produce metallurgical bonds between similar and dissimilar metals, ceramics, and cermet materials. It appears to be ideal for fabricating brittle materials or materials of widely differing properties. Consolidation of metallic and ceramic powders to densities approaching theoretical is readily accomplished by gaspressure bonding at temperatures well below those normally required in sintering operations, and the resulting grain growth is held to a minimum. Numerous configurations have been fabricated from Be and Nb by the gas-pressurebonding process. Examples are cited of typical nuclear fuel elements and various structural components of interest for aircraft and missile application. (Author).
Author :
Publisher :
Page : 244 pages
File Size : 22,44 MB
Release : 1959
Category : Nuclear fuels
ISBN :
Author : U. Gösele
Publisher : The Electrochemical Society
Page : 636 pages
File Size : 36,58 MB
Release : 1998
Category : Technology & Engineering
ISBN : 9781566771894
Author : Helmut Baumgart
Publisher : The Electrochemical Society
Page : 398 pages
File Size : 48,41 MB
Release : 2006
Category : Microelectromechanical systems
ISBN : 156677506X
This issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding Technology can be used to create novel composite materials systems and devices what would otherwise be unattainable. Wafer bonding today is rapidly expanding applications in such diverse fields as photonics, sensors, MEMS, X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI), and Nanotechnologies.
Author :
Publisher :
Page : 1094 pages
File Size : 25,30 MB
Release : 1961
Category : Nuclear reactors
ISBN :
Author :
Publisher :
Page : 74 pages
File Size : 19,95 MB
Release : 1964
Category : Aluminum-uranium alloys
ISBN :
Author : H. Baumgart
Publisher : The Electrochemical Society
Page : 310 pages
File Size : 41,88 MB
Release : 2002
Category : Technology & Engineering
ISBN : 9781566773607
Author :
Publisher :
Page : 524 pages
File Size : 26,81 MB
Release : 1991
Category : Semiconductor wafers
ISBN :