Handbook of Package Engineering, Third Edition


Book Description

Now in its third edition, the Handbook of Package Engineering is still considered the standard industry reference on packaging materials and engineering. This text is a useful source of information for anyone involved in packaging. Designed as a refresher on packaging fundamentals, this complete guide also provides information on recent changes in the materials and structures of packaging. It reviews the essentials of production - packaging operations, line layout, and the machines that are required in order to perform basic packaging functions. It introduces the increasing web of laws and regulations controlling virtually all packaged products.




Handbook of Package Engineering


Book Description




Handbook of Electronic Package Design


Book Description

Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development




Food and Package Engineering


Book Description

For the first time, engineering for the packaging industry – and for the biggest packaging user, food processing – is presented in a way that clearly demonstrates its interconnected, globally integrated nature. Food and Package Engineering is a groundbreaking work that serves as a comprehensive guide to the complexities and the potential of the industry. Packaging draws on nearly every aspect of science, technology, business, social science, and engineering. Rather than present a traditionally linear view of these topics, the author takes a "Packaging Cycle" approach by guiding readers through the life of the package from raw materials and conversion, operations, distribution, retail, all the way to recycling or disposal by the consumer. Food and Package Engineering includes many essential topics usually not addressed in other food engineering or packaging texts, including: Raw materials production and conversion Inventory management and production scheduling Regulations, security and food safety Recycling and landfill issues Transportation systems and distribution packaging Evaluation of developing technologies The comprehensive approach of this volume provides a framework to discuss critical interrelated topics such as economics, politics, and natural resources. Intended for readers with varying levels of experience, Food and Package Engineering provides multi-level accessibility to each topic, allowing both students and professionals to find useful information and develop technical expertise. Rather than being a simple exposition of technical knowledge, the book provides both real-world examples and challenging problems that require consideration at several different levels. Extensively illustrated and meticulously researched, Food and Package Engineering offers both a technical and a real-world perspective of the field. The text serves the student or industry professional at any level or background as an outstanding learning and reference work for their professional preparation and practice.




Area Array Packaging Handbook


Book Description

*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)




The Electronic Packaging Handbook


Book Description

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.




Microelectronics Packaging Handbook


Book Description

Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.




The Packaging Development Process


Book Description

The Packaging Development Process: A Guide for Engineers and Project Managers presents the techniques necessary for creating, testing, and launching packaging, in one convenient reference book. It does so by explaining each step of how a packaging project evolves from the business plan to product launch, with an emphasis on the financial and human resources necessary to move the project forward. Included are extended case studies and detailed flow charts. The case studies create an interesting, informative and understandable read, while the flow charts explain concepts. The text is intended to give package engineers and managers the tools they need to realize new package ideas and to revamp existing packaging in the framework of business teams.




Cartons, Crates and Corrugated Board, Second Edition


Book Description

New expanded second edition with key technical, regulatory and marketing developments from the past 10 years in the packaging industryCovers the materials, processes, and design of virtually all paper and fiberboard packaging for end-products, displays, storage and distributionNew information on European and global standards, selection criteria for paperboard, as well as emerging sustainability initiativesExplains recent tests, measurements and costs with ready-to-use calculations Ten years ago, the first edition of Cartons, Crates and Corrugated Board quickly became the standard reference book for wood- and paper-based packaging. Endorsed by TAPPI and other professional societies and used as a textbook worldwide, the book has now been extensively revised and updated by a team formed by the original authors and two additional authors. While preserving the critical performance and design data of the previous edition, this second expanded edition offers new information on the technologies, tests and regulations impacting the paper and corrugated industries worldwide, with a special focus on Europe and Japan. New information has been added on tests and novel designs for folded cartons, as well as expanded discussions of paperboard selection for specific applications, emerging barrier packaging, food contact and migration, and the dynamics and opportunities of corrugated in distribution systems. Recent developments on recycling and sustainability are also highlighted.




A Handbook of Food Packaging


Book Description

This is the second edition of a successful title first published in 1983 and now therefore a decade out of date. The authors consider the development of the right package for a particular food in a particular market, from the point of view of the food technologist, the packaging engineer and those concerned with marketing. While the original format has been retained, the contents have been thoroughly revised to take account of the considerable advances made in recent years in the techniques of food processing, packaging and distribution. While efficient packaging is even more a necessity for every kind of food, whether fresh or processed, and is an essential link between the food producer and the consumer, the emphasis on its several functions has changed. Its basic function is to identify the product and ensure that it travels safely through the distribution system to the consumer. Packaging designed and constructed solely for this purpose adds little or nothing to the value of the product, merely preserving farm or processor freshness or preventing physical damage, and cost effectiveness is the sole criterion for success. If, however, the packaging facilitates the use of the product, is reusable or has an after-use, some extra value can be added to justify the extra cost and promote sales. Many examples of packaging providing such extra value can be cited over the last decade.