High Purity Silicon VII


Book Description




High Purity Silicon 9


Book Description

This issue discusses the latest developments in the growth, characterization, device processing and applications of high-purity silicon in either bulk or epitaxial form. Information is given on the control and prevention of impurity incorporation, characterization and detection of defects and impurity states. Device and circuit aspects are also covered. Advanced substrates such as SOI, strained Si and germanium-on-insulator are discussed.




High Purity Silicon VIII


Book Description

"This Proceedings Volume includes papers that were presented at the Eighth Symposium on High Purity Silicon held in Honolulu, Hawaii at the 206th Meeting of the Electrochemical Society, October 3-8, 2004"--Pref.




High Purity Silicon 10


Book Description

The issue of the 10th High Purity Silicon symposium provides an overview of the latest developments in the growth, characterization, devices processing, and application of high purity silicon in either bulk or epitaxial form. The emphasis is on the control and prevention of impurity incorporation, characterization and detection of defects and impurity states in high purity and high resistivity silicon for superior device performances. Device and circuit aspects related to the application of devices fabricated on high resistivity silicon wafers will also be addressed. Special attention will be given to alternative and high-mobility substrates and their material and device aspects.







Phonon Scattering in Condensed Matter VII


Book Description

This volume contains the proceedings of the Seventh International Conference on Phonon Scattering in Condensed Matter held August 3-7, 1992, at Cornell University in Ithaca, NY, USA. The preceding conferences were held at: St. Maxime and Paris (France) 1972, Nottingham (UK) 1975, Providence (USA) 1979, Stuttgart (Germany) 1983, Urbana (USA) 1986, and Heidelberg (Germany) 1989. The Heidelberg conference was held jointly with the Third International Con ference on Phonon Physics. The next conference, to be held in August, 1995, in Sapporo, Japan, and hosted by Professor T. Nakayama and his colleagues, will also be such a joint conference. This conference was attended by 227 scientists from 27 countries, and covered all aspects of phonon scattering in condensed matter, ranging from the more traditional topics of thermal conductivity, Kapitza resistance, and ballistic phonon propagation to the recently added topics, such as electron-phonon interaction in high-T c superconductors, the use of phonons in particle detection, and phonons in confined geometries. The 207 papers arranged in 11 chapters in this volume are a cross section of the present activities in the quite obviously vibrant field of phonons and their interactions.




Silicon Materials Science and Technology X


Book Description

This was the tenth symposium of the International Symposium on Silcon Material Science and Technology, going back to 1969. This issue provides a unique historical record of the program and will aid in the understanding of silicon materials over the last 35 years.




Handbook of Silicon Based MEMS Materials and Technologies


Book Description

Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures. The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students. - Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits - Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structures - Reviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvements - Geared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors







ULSI Process Integration 7


Book Description