High Temperature Fatigue Crack Growth Behavior of Alloy 10


Book Description

Methods to improve the high temperature, dwell crack growth resistance of Alloy 10, a high strength, nickel-base disk alloy, were studied. Two approaches, heat treat variations and composition modifications, were investigated. Under the heat treat approach, solution temperature, cooling rates, and stabilization, were studied. It was found that higher solution temperatures, which promote coarser grain sizes, coupled with a 1550 F stabilization treatment were found to significantly reduce dwell crack growth rates at 1300 F Changes in the niobium and tantalum content were found to have a much smaller impact on crack growth behavior. Lowering the niobium:tantalum ratio did improve crack growth resistance and this effect was most pronounced for coarse grain microstructures. Based on these findings, a coarse grain microstructure for Alloy 10 appears to be the best option for improving dwell crack growth resistance, especially in the rim of a disk where temperatures can reach or exceed 1300 T. Further, the use of advanced processing technologies, which can produce a coarse grain rim and fine grain bore, would be the preferred option for Alloy 10 to obtain the optimal balance between tensile, creep, and crack growth requirements for small gas turbine engines. Gayda, John Glenn Research Center NASA/TM-2001-210814, E-12729, NAS 1.15:210814



















Fatigue and Fracture Mechanics


Book Description










The Effect of Temperature Upon the Fatigue Crack Propagation Behavior of Alloy 625


Book Description

Fatigue crack propagation of annealed Alloy 625 was studied in air at 24--649 C. Crack growth rates tend to increase with temperature. Two heats were studied; differences in behavior between them suggest a heat-to-heat variability. Characterization of stress ratio (R=K{sub min}/K{sub max}) effects was also done at 538 C.