Nanotechnology for Electronics, Photonics, and Renewable Energy


Book Description

Tutorial lectures given by world-renowned researchers have become one of the important traditions of the Nano and Giga Challenges (NGC) conference series. 1 Soon after preparations had begun for the rst forum, NGC2002, in Moscow, Russia, the organizers realized that publication of the lectures notes would be a va- able legacy of the meeting and a signi cant educational resource and knowledge base for students, young researchers, and senior experts. Our rst book was p- lished by Elsevier and received the same title as the meeting itself—Nano and Giga 2 Challenges in Microelectronics. Our second book, Nanotechnology for Electronic 3 4 Materials and Devices, based on the tutorial lectures at NGC2004 in Krakow, 5 Poland, the third book from NGC2007 in Phoenix, Arizona, and the current book 6 from joint NGC2009 and CSTC2009 meeting in Hamilton, Ontario, have been published in Springer’s Nanostructure Science and Technology series. Hosted by McMaster University, the meeting NGC/CSTC 2009 was held as a joint event of two conference series, Nano and Giga Challenges (Nano & Giga Forum) and Canadian Semiconductor Technology Conferences (CSTC), bringing together the networks and expertise of both professional forums. Informational (electronics and photonics), renewable energy (solar systems, fuel cells, and batteries), and sensor (nano and bio) technologies have reached a new stage in their development in terms of engineering limits to cost-effective impro- ment of current technological approaches. The latest miniaturization of electronic devices is approaching atomic dimensions.




Proceedings of the IEEE.


Book Description

Vols. 34- include section: Waves and electrons.




Science Abstracts


Book Description







Radiation Tolerant Electronics


Book Description

Research on radiation-tolerant electronics has increased rapidly over the past few years, resulting in many interesting approaches to modeling radiation effects and designing radiation-hardened integrated circuits and embedded systems. This research is strongly driven by the growing need for radiation-hardened electronics for space applications, high-energy physics experiments such as those on the Large Hadron Collider at CERN, and many terrestrial nuclear applications including nuclear energy and nuclear safety. With the progressive scaling of integrated circuit technologies and the growing complexity of electronic systems, their susceptibility to ionizing radiation has raised many exciting challenges, which are expected to drive research in the coming decade. In this book we highlight recent breakthroughs in the study of radiation effects in advanced semiconductor devices, as well as in high-performance analog, mixed signal, RF, and digital integrated circuits. We also focus on advances in embedded radiation hardening in both FPGA and microcontroller systems and apply radiation-hardened embedded systems for cryptography and image processing, targeting space applications.




Index to IEEE Publications


Book Description




Flexible Carbon-based Electronics


Book Description

This third volume in the Advanced Nanocarbon Materials series covers the topic of flexible electronics both from a materials and an applications perspective. Comprehensive in its scope, the monograph examines organic, inorganic and composite materials with a section devoted to carbon-based materials with a special focus on the generation and properties of 2D materials. It also presents carbon modifications and derivatives, such as carbon nanotubes, graphene oxide and diamonds. In terms of the topical applications covered these include, but are not limited to, flexible displays, organic electronics, transistors, integrated circuits, semiconductors and solar cells. These offer perspectives for today?s energy and healthcare challenges, such as electrochemical energy storage and wearable devices. Finally, a section on fundamental properties and characterization approaches of flexible electronics rounds off the book. Each contribution points out the importance of the structure-function relationship for the target-oriented fabrication of electronic devices, enabling the design of complex components.




Printed Organic and Molecular Electronics


Book Description

Printed Organic And Molecular Electronics was compiled to create a reference that included existing knowledge from the most renowned industry, academic, and government experts in the fields of organic semiconductor technology, graphic arts printing, micro-contact printing, and molecular electronics. It is divided into sections that consist of the most critical topics required for one to develop a strong understanding of the states of these technologies and the paths for taking them from R&D to the hands of consumers on a massive scale. As such, the book provides both theory as well as technology development results and trends.




Foundations for Microstrip Circuit Design


Book Description

Building on the success of the previous three editions, Foundations for Microstrip Circuit Design offers extensive new, updated and revised material based upon the latest research. Strongly design-oriented, this fourth edition provides the reader with a fundamental understanding of this fast expanding field making it a definitive source for professional engineers and researchers and an indispensable reference for senior students in electronic engineering. Topics new to this edition: microwave substrates, multilayer transmission line structures, modern EM tools and techniques, microstrip and planar transmision line design, transmission line theory, substrates for planar transmission lines, Vias, wirebonds, 3D integrated interposer structures, computer-aided design, microstrip and power-dependent effects, circuit models, microwave network analysis, microstrip passive elements, and slotline design fundamentals.




Compact Modeling


Book Description

Most of the recent texts on compact modeling are limited to a particular class of semiconductor devices and do not provide comprehensive coverage of the field. Having a single comprehensive reference for the compact models of most commonly used semiconductor devices (both active and passive) represents a significant advantage for the reader. Indeed, several kinds of semiconductor devices are routinely encountered in a single IC design or in a single modeling support group. Compact Modeling includes mostly the material that after several years of IC design applications has been found both theoretically sound and practically significant. Assigning the individual chapters to the groups responsible for the definitive work on the subject assures the highest possible degree of expertise on each of the covered models.