Three Dimensional System Integration


Book Description

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.




Clocking in Modern VLSI Systems


Book Description

. . . ????????????????????????????????? ????????????? ????????????,????? ???? ??????????? ???????????????????? ???. THUCYDIDIS HISTORIAE IV:108 C. Hude ed. , Teubner, Lipsiae MCMXIII ???????????,????? ??,? ????????????????? ???????????????????? ?????? ?????? ?????? ??? ????????? ??? ?’ ?????????? ??’ ?????????? ? ??????? ??? ????????????? ???????. ???????????????????:108 ???????????? ?????????????????????? ?. ?????????????. ????????????,????? It being the fashion of men, what they wish to be true to admit even upon an ungrounded hope, and what they wish not, with a magistral kind of arguing to reject. Thucydides (the Peloponnesian War Part I), IV:108 Thomas Hobbes Trans. , Sir W. Molesworth ed. In The English Works of Thomas Hobbes of Malmesbury, Vol. VIII I have been introduced to clock design very early in my professional career when I was tapped right out of school to design and implement the clock generation and distribution of the Alpha 21364 microprocessor. Traditionally, Alpha processors - hibited highly innovative clocking systems, always worthy of ISSCC/JSSC publi- tions and for a while Alpha processors were leading the industry in terms of clock performance. I had huge shoes to ?ll. Obviously, I was overwhelmed, confused and highly con?dent that I would drag the entire project down.




Integrated Circuit and System Design. Power and Timing Modeling, Optimization, and Simulation


Book Description

This book constitutes the refereed proceedings of the 20th International Conference on Integrated Circuit and System Design, PATMOS 2010, held in Grenoble, France, in September 2010. The 24 revised full papers presented and the 9 extended abstracts were carefully reviewed and are organized in topical sections on design flows; circuit techniques; low power circuits; self-timed circuits; process variation; high-level modeling of poweraware heterogeneous designs in SystemC-AMS; and minalogic.




Carbon Nanotubes and Their Applications


Book Description

This book overviews the current status of research and development activities of CNTs in nanodevices, nanomaterials, or nanofabrication. This book presents 15 state-of-the-art review articles that cover CNT synthesis technologies for growing highly orientated CNTs, chirality-pure CNTs and CNTs at a large throughput and low cost, CNT assembly techniques, CNT sorting and separation processes, CNT functionalization engineering for more functionalities, CNT fundamental properties and their practical/potential electrical, electronic, optical, mechanical, chemical and biological applications.




Design and Implementation of Fully-Integrated Inductive DC-DC Converters in Standard CMOS


Book Description

CMOS DC-DC Converters aims to provide a comprehensive dissertation on the matter of monolithic inductive Direct-Current to Direct-Current (DC-DC) converters. For this purpose seven chapters are defined which will allow the designer to gain specific knowledge on the design and implementation of monolithic inductive DC-DC converters, starting from the very basics.




VLSI


Book Description

Recently the world celebrated the 60th anniversary of the invention of the first transistor. The first integrated circuit (IC) was built a decade later, with the first microprocessor designed in the early 1970s. Today, ICs are a part of nearly every aspect of our daily lives. They help us live longer and more comfortably, and do more, faster. All this is possible because of the relentless search for new materials, circuit designs, and ideas happening on a daily basis at industrial and academic institutions around the globe. Showcasing the latest advances in very-large-scale integrated (VLSI) circuits, VLSI: Circuits for Emerging Applications provides a balanced view of industrial and academic developments beyond silicon and complementary metal–oxide–semiconductor (CMOS) technology. From quantum-dot cellular automata (QCA) to chips for cochlear implants, this must-have resource: Investigates the trend of combining multiple cores in a single chip to boost performance of the overall system Describes a novel approach to enable physically unclonable functions (PUFs) using intrinsic features of a VLSI chip Examines the VLSI implementations of major symmetric and asymmetric key cryptographic algorithms, hash functions, and digital signatures Discusses nonvolatile memories such as resistive random-access memory (Re-RAM), magneto-resistive RAM (MRAM), and floating-body RAM (FB-RAM) Explores organic transistors, soft errors, photonics, nanoelectromechanical (NEM) relays, reversible computation, bioinformatics, asynchronous logic, and more VLSI: Circuits for Emerging Applications presents cutting-edge research, design architectures, materials, and uses for VLSI circuits, offering valuable insight into the current state of the art of micro- and nanoelectronics.




Embedded Systems Design with FPGAs


Book Description

This book presents the methodologies and for embedded systems design, using field programmable gate array (FPGA) devices, for the most modern applications. Coverage includes state-of-the-art research from academia and industry on a wide range of topics, including applications, advanced electronic design automation (EDA), novel system architectures, embedded processors, arithmetic, and dynamic reconfiguration.




3D Integration for NoC-based SoC Architectures


Book Description

This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.




Intelligent Computing


Book Description

This book is a collection of extremely well-articulated, insightful and unique state-ofthe-art papers presented at the Computing Conference which took place in London on June 22–23, 2023. A total of 539 papers were received out of which 193 were selected for presenting after double-blind peer-review. The book covers a wide range of scientific topics including IoT, Artificial Intelligence, Computing, Data Science, Networking, Data security and Privacy, etc. The conference was successful in reaping the advantages of both online and offline modes. The goal of this conference is to give a platform to researchers with fundamental contributions and to be a premier venue for academic and industry practitioners to share new ideas and development experiences. We hope that readers find this book interesting and valuable. We also expect that the conference and its publications will be a trigger for further related research and technology improvements in this important subject.




Handbook of 3D Integration, Volume 4


Book Description

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.