Author : C. V. Thompson
Publisher :
Page : 352 pages
File Size : 34,6 MB
Release : 1992-09-30
Category : Technology & Engineering
ISBN :
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : C. V. Thompson
Publisher : Cambridge University Press
Page : 344 pages
File Size : 21,51 MB
Release : 2014-06-05
Category : Technology & Engineering
ISBN : 9781107409682
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author :
Publisher :
Page : 336 pages
File Size : 50,31 MB
Release : 1999
Category : Microelectronics
ISBN :
Author : Paul S. Ho
Publisher : Cambridge University Press
Page : 433 pages
File Size : 30,91 MB
Release : 2022-05-12
Category : Science
ISBN : 1107032385
Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.
Author : Anthony S. Oates
Publisher :
Page : 552 pages
File Size : 28,74 MB
Release : 1995-10-24
Category : Technology & Engineering
ISBN :
This long-standing proceedings series is highly regarded as a premier forum for the discussion of microelectronics reliability issues. In this fifth book, emphasis is on the fundamental understanding of failure phenomena in thin-film materials. Special attention is given to electromigration and mechanical stress effects. The reliability of thin dielectrics and hot carrier degradation of transistors are also featured. Topics include: modeling and simulation of failure mechanisms; reliability issues for submicron IC technologies and packaging; stresses in thin films/lines; gate oxides; barrier layers; electromigration mechanisms; reliability issues for Cu metallizations; electromigration and microstructure; electromigration and stress voiding in circuit interconnects; and resistance measurements of electromigration damage.
Author : Kenneth P. Rodbell
Publisher :
Page : 520 pages
File Size : 43,35 MB
Release : 1993-08-31
Category : Technology & Engineering
ISBN :
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Ilhan A. Aksay
Publisher :
Page : 472 pages
File Size : 41,11 MB
Release : 1992-09-22
Category : Technology & Engineering
ISBN :
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author :
Publisher :
Page : 762 pages
File Size : 18,13 MB
Release : 1992
Category : Microelectronics
ISBN :
Author : Jeremy Broughton
Publisher :
Page : 696 pages
File Size : 33,39 MB
Release : 1993-05-07
Category : Technology & Engineering
ISBN :
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : James E. Mark
Publisher :
Page : 432 pages
File Size : 33,6 MB
Release : 1992-09-23
Category : Technology & Engineering
ISBN :
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
