Book Description
Microelectronic system interconnections provides a uniques approach to the subject.
Author : Stuart K. Tewksbury
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
Page : 536 pages
File Size : 32,4 MB
Release : 1994
Category : Technology & Engineering
ISBN :
Microelectronic system interconnections provides a uniques approach to the subject.
Author : G.G. Harman
Publisher : Springer Science & Business Media
Page : 295 pages
File Size : 47,86 MB
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9401151350
MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.
Author : Albert Heuberger
Publisher : Springer Science & Business Media
Page : 361 pages
File Size : 41,97 MB
Release : 2011-12-26
Category : Computers
ISBN : 3642230709
This book is dedicated to Prof. Dr. Heinz Gerhäuser on the occasion of his retirement both from the position of Executive Director of the Fraunhofer Institute for Integrated Circuits IIS and from the Endowed Chair of Information Technologies with a Focus on Communication Electronics (LIKE) at the Friedrich-Alexander-Universität Erlangen-Nürnberg. Heinz Gerhäuser's vision and entrepreneurial spirit have made the Fraunhofer IIS one of the most successful and renowned German research institutions. He has been Director of the Fraunhofer IIS since 1993, and under his leadership it has grown to become the largest of Germany's 60 Fraunhofer Institutes, a position it retains to this day, currently employing over 730 staff. Likely his most important scientific as well as application-related contribution was his pivotal role in the development of the mp3 format, which would later become a worldwide success. The contributions to this Festschrift were written by both Fraunhofer IIS staff and external project team members in appreciation of Prof. Dr. Gerhäuser's lifetime academic achievements and his inspiring leadership at the Fraunhofer IIS. The papers reflect the broad spectrum of the institute's research activities and are grouped into sections on circuits, information systems, visual computing, and audio and multimedia. They provide academic and industrial researchers in fields like signal processing, sensor networks, microelectronics, and integrated circuits with an up-to-date overview of research results that have a huge potential for cutting-edge industrial applications.
Author : Jerry Lyman
Publisher : McGraw-Hill Companies
Page : 338 pages
File Size : 37,27 MB
Release : 1980
Category : Technology & Engineering
ISBN :
Author : Moore School of Electrical Engineering
Publisher :
Page : 1794 pages
File Size : 12,42 MB
Release : 1949
Category : Calculators
ISBN :
Author : G.W.A. Dummer
Publisher : Elsevier
Page : 571 pages
File Size : 34,45 MB
Release : 2013-10-02
Category : Technology & Engineering
ISBN : 1483151425
Electronic Connection Techniques and Equipment 1968–69 presents the methods and equipment used in the wide field of electronic connections. This book describes all connection methods, including automated systems and microelectronic interconnections. This text covers all aspects of electronic connections, such as the system selection parameters and applications, as well as information on reliability. This book provides information on a wide range of methods and equipment in use and available in the United States of America and in the United Kingdom. Information is also included on welding, smoldering, wrapping, bonding, and crimping. The materials are extensively illustrated with diagrams and photographs describing system, equipment, application, and operation. This book is a valuable resource for readers who are interested in the connection and interconnection of electronic components, equipment, and devices.
Author :
Publisher :
Page : 694 pages
File Size : 12,7 MB
Release : 1991
Category : Optoelectronic devices
ISBN :
Author :
Publisher : The Electrochemical Society
Page : 574 pages
File Size : 29,33 MB
Release : 2005
Category : Electrochemistry
ISBN : 9781566774260
Author : Shahrzad Salemi
Publisher : RIAC
Page : 271 pages
File Size : 25,42 MB
Release : 2008
Category : Electronic apparatus and appliances
ISBN : 1933904291
Author : United States. Navy
Publisher : Lulu.com
Page : 308 pages
File Size : 18,12 MB
Release : 2018-09-16
Category : Fiction
ISBN : 0359093183
Module 14, Introduction to Microelectronics, covers microelectronics technology and miniature and microminiature circuit repair.The Navy Electricity and Electronics Training Series (NEETS) was developed for use by personnel in many electrical- and electronic-related Navy ratings. Written by, and with the advice of, senior technicians in these ratings, this series provides beginners with fundamental electrical and electronic concepts through self-study. The presentation of this series is not oriented to any specific rating structure, but is divided into modules containing related information organized into traditional paths of instruction.