Advances in Imaging and Electron Physics


Book Description

Advances in Imaging and Electron Physics merges two long-running serials—Advances in Electronics and Electron Physics and Advances in Optical and Electron Microscopy. The series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies, microlithography, image science and digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains. - Contributions from leading authorities - Informs and updates on all the latest developments in the field




Immunogold-Silver Staining


Book Description

This book discusses the principles, methods, and applications of immunogold-silver staining (IGSS) to biomedical areas. It focuses on the latest advances in the dynamic and progressive field of IGSS.




3D Microelectronic Packaging


Book Description

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.




Cellular Electron Microscopy


Book Description

Recent advances in the imaging technique electron microscopy (EM) have improved the method, making it more reliable and rewarding, particularly in its description of three-dimensional detail. Cellular Electron Microscopy will help biologists from many disciplines understand modern EM and the value it might bring to their own work. The book's five sections deal with all major issues in EM of cells: specimen preparation, imaging in 3-D, imaging and understanding frozen-hydrated samples, labeling macromolecules, and analyzing EM data. Each chapter was written by scientists who are among the best in their field, and some chapters provide multiple points of view on the issues they discuss. Each section of the book is preceded by an introduction, which should help newcomers understand the subject. The book shows why many biologists believe that modern EM will forge the link between light microscopy of live cells and atomic resolution studies of isolated macromolecules, helping us toward the goal of an atomic resolution understanding of living systems. - Updates the numerous technological innovations that have improved the capabilities of electron microscopy - Provides timely coverage of the subject given the significant rise in the number of biologists using light microscopy to answer their questions and the natural limitations of this kind of imaging - Chapters include a balance of "how to", "so what" and "where next", providing the reader with both practical information, which is necessary to use these methods, and a sense of where the field is going




Interfacial Engineering for Optimized Properties: Volume 458


Book Description

The study of interfaces is one of the oldest areas of research in materials science. The presence of grain boundaries in materials has long been recognized, as has its crucial role in determining mechanical properties. Another long-recognized concept is that the properties of a surface are quite different from those of the bulk. In recent years, researchers have been able to study these interfaces, both internal and external, with a detail not before possible. These advances have stemmed from the ability to obtain atomic resolution images of interfaces, to measure accurate chemical compositions of interfaces, and to model these interfaces and their properties. This volume goes a step further, beyond structural and chemical studies, to explore how all of this information can be used to engineer interfaces for improved properties and overall improved material performance. Significant attention is given to the crystallographic nature of grain boundaries and interfaces, and the relationship between this nature and the performance of a material. The versatility of electron back-scattering pattern analysis (EBSP) in solving a number of interface-related problems is also featured.




Interfaces in High-Tc Superconducting Systems


Book Description

Because the new high-temperature superconductors cannot be grown as large single crystals, interfaces and junctions play an important role in their properties. The chapters in this book, each by leading researchers in the field, examine the state of our understanding of such interfaces. Chapters cover such topics as studies of YCBO films by transmission-electron, scanning-tunneling, and atomic-force microscopy; microstructure, interfacial interactions, and twin boundary structures in YCBO films; grain-boundary Josephson junctions; and overlayer formation.




Transmission Electron Microscopy


Book Description

This text is a companion volume to Transmission Electron Microscopy: A Textbook for Materials Science by Williams and Carter. The aim is to extend the discussion of certain topics that are either rapidly changing at this time or that would benefit from more detailed discussion than space allowed in the primary text. World-renowned researchers have contributed chapters in their area of expertise, and the editors have carefully prepared these chapters to provide a uniform tone and treatment for this exciting material. The book features an unparalleled collection of color figures showcasing the quality and variety of chemical data that can be obtained from today’s instruments, as well as key pitfalls to avoid. As with the previous TEM text, each chapter contains two sets of questions, one for self assessment and a second more suitable for homework assignments. Throughout the book, the style follows that of Williams & Carter even when the subject matter becomes challenging—the aim is always to make the topic understandable by first-year graduate students and others who are working in the field of Materials Science Topics covered include sources, in-situ experiments, electron diffraction, Digital Micrograph, waves and holography, focal-series reconstruction and direct methods, STEM and tomography, energy-filtered TEM (EFTEM) imaging, and spectrum imaging. The range and depth of material makes this companion volume essential reading for the budding microscopist and a key reference for practicing researchers using these and related techniques.




Materials for Advanced Packaging


Book Description

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.




Fracture of Nano and Engineering Materials and Structures


Book Description

The 16th European Conference of Fracture (ECF16) was held in Greece, July, 2006. It focused on all aspects of structural integrity with the objective of improving the safety and performance of engineering structures, components, systems and their associated materials. Emphasis was given to the failure of nanostructured materials and nanostructures including micro- and nano-electromechanical systems (MEMS and NEMS).




NAA-SR.


Book Description