Author : Yoshihiko Imanaka
Publisher : Springer Science & Business Media
Page : 252 pages
File Size : 30,68 MB
Release : 2006-05-28
Category : Technology & Engineering
ISBN : 0387233148
The only book to concentrate solely on low temperature cofired ceramics, an attractive technology for electronic components and substrates that are compact, light, and offer high-speed and functionality for portable electronic devices.
Author : Duixian Liu
Publisher : John Wiley & Sons
Page : 416 pages
File Size : 28,18 MB
Release : 2020-03-31
Category : Technology & Engineering
ISBN : 1119556635
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Author : Mailadil T. Sebastian
Publisher : John Wiley & Sons
Page : 997 pages
File Size : 48,7 MB
Release : 2017-03-02
Category : Technology & Engineering
ISBN : 1119208564
Die jüngsten Fortschritte im Bereich der drahtlosen Telekommunikation und dem Internet der Dinge sorgen bei drahtlosen Systemen, beim Satellitenfernsehen und bei intelligenten Transportsystemen der 5. Generation für eine höhere Nachfrage nach dielektrischen Materialien und modernen Fertigungstechniken. Diese Materialien bieten ausgezeichnete elektrische, dielektrische und thermische Eigenschaften und verfügen über enormes Potenzial, vor allem bei der drahtlosen Kommunikation, bei flexibler Elektronik und gedruckter Elektronik. Microwave Materials and Applications erläutert die herkömmlichen Methoden zur Messung der dielektrischen Eigenschaften im Mikrowellenbereich, die verschiedenen Ansätze zur Lösung von Problemen der Materialchemie und von Kristallstrukturen, in den Bereichen Doping, Substitution und Aufbau von Verbundwerkstoffen. Besonderer Schwerpunkt liegt auf Verarbeitungstechniken, Einflüssen der Morphologie und der Anwendung von Materialien in der Mikrowellentechnik. Gleichzeitig werden viele der jüngsten Forschungserkenntnisse bei Mikrowellen-Dielektrika und -Anwendungen zusammengefasst. Die verschiedenen Kapitel untersuchen: Oxidkeramiken für dielektrische Resonatoren und Substrate, HTCC-, LTCC- und ULTCC-Bänder für Substrate, Polymer-Keramik-Verbundstoffe für Leiterplatten, Elastomer-Keramik-Verbundstoffe für flexible Elektronik, dielektrische Tinten, Materialien für die EMV-Abschirmung, Mikrowellen-Ferrite. Ein umfassender Anhang präsentiert die grundlegenden Eigenschaften von mehr als 4000 verlustarmen dielektrischen Keramiken, deren Zusammensetzung, kristalline Struktur und dielektrischen Eigenschaften für Mikrowellenanwendungen. Microwave Materials and Applications wirft einen Blick auf sämtliche Aspekte von Mikrowellenmaterialien und -anwendungen, ein nützliches Handbuch für Wissenschaftler, Unternehmen, Ingenieure und Studenten, die sich mit heutigen und neuen Anwendungen in den Bereichen drahtlose Kommunikation und Unterhaltungselektronik beschäftigen.
Author : Fred D. Barlow, III
Publisher : CRC Press
Page : 472 pages
File Size : 16,48 MB
Release : 2007-01-24
Category : Technology & Engineering
ISBN : 9780849335570
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Author : Narottam P. Bansal
Publisher : John Wiley & Sons
Page : 598 pages
File Size : 46,29 MB
Release : 2012-04-17
Category : Technology & Engineering
ISBN : 0470553448
Examines the latest processing and fabrication methods There is increasing interest in the application of advanced ceramic materials in diverse areas such as transportation, energy, environmental protection and remediation, communications, health, and aerospace. This book guides readers through a broad selection of key processing techniques for ceramics and their composites, enabling them to manufacture ceramic products and components with the properties needed for various industrial applications. With chapters contributed by internationally recognized experts in the field of ceramics, the book includes traditional fabrication routes as well as new and emerging approaches in order to meet the increasing demand for more reliable ceramic materials. Ceramics and Composites Processing Methods is divided into three sections: * Densification, covering the fundamentals and practice of sintering, pulsed electric current sintering, and viscous phase silicate processing * Chemical Methods, examining colloidal methods, sol-gel, gel casting, polymer processing, chemical vapor deposition, chemical vapor infiltration, reactive melt infiltration, and combustion synthesis * Physical Methods, including directional solidification, solid free-form fabrication, microwave processing, electrophoretic deposition, and plasma spraying Each chapter focuses on a particular processing method or approach. Collectively, these chapters offer readers comprehensive, state-of-the-science information on the many approaches, techniques, and methods for the processing and fabrication of advanced ceramics and ceramic composites. With its coverage of the latest processing methods, Ceramics and Composites Processing Methods is recommended for researchers and students in ceramics, materials science, structural materials, biomedical engineering, and nanotechnology.
Author : Bhutani, Akanksha
Publisher : KIT Scientific Publishing
Page : 254 pages
File Size : 12,10 MB
Release : 2019-10-17
Category : Technology & Engineering
ISBN : 3731509458
Author : Ralf Riedel
Publisher : John Wiley & Sons
Page : 554 pages
File Size : 18,2 MB
Release : 2011-12-15
Category : Technology & Engineering
ISBN : 3527631968
Although ceramics have been known to mankind literally for millennia, research has never ceased. Apart from the classic uses as a bulk material in pottery, construction, and decoration, the latter half of the twentieth century saw an explosive growth of application fields, such as electrical and thermal insulators, wear-resistant bearings, surface coatings, lightweight armour, or aerospace materials. In addition to plain, hard solids, modern ceramics come in many new guises such as fabrics, ultrathin films, microstructures and hybrid composites. Built on the solid foundations laid down by the 20-volume series Materials Science and Technology, Ceramics Science and Technology picks out this exciting material class and illuminates it from all sides. Materials scientists, engineers, chemists, biochemists, physicists and medical researchers alike will find this work a treasure trove for a wide range of ceramics knowledge from theory and fundamentals to practical approaches and problem solutions.
Author : Vesna Crnojević-Bengin
Publisher : Cambridge University Press
Page : 331 pages
File Size : 23,77 MB
Release : 2015-06-11
Category : Technology & Engineering
ISBN : 1107081971
The first of its kind, this comprehensive work details the theory and practical design of new multi-band filters.
Author : Fred D. Barlow, III
Publisher : CRC Press
Page : 456 pages
File Size : 35,48 MB
Release : 2018-10-03
Category : Technology & Engineering
ISBN : 1420018965
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Author : Ferran Martín
Publisher : John Wiley & Sons
Page : 962 pages
File Size : 46,42 MB
Release : 2018-02-26
Category : Technology & Engineering
ISBN : 1119238234
This book presents and discusses strategies for the design and implementation of common-mode suppressed balanced microwave filters, including, narrowband, wideband, and ultra-wideband filters This book examines differential-mode, or balanced, microwave filters by discussing several implementations of practical realizations of these passive components. Topics covered include selective mode suppression, designs based on distributed and semi-lumped approaches, multilayer technologies, defect ground structures, coupled resonators, metamaterials, interference techniques, and substrate integrated waveguides, among others. Divided into five parts, Balanced Microwave Filters begins with an introduction that presents the fundamentals of balanced lines, circuits, and networks. Part 2 covers balanced transmission lines with common-mode noise suppression, including several types of common-mode filters and the application of such filters to enhance common-mode suppression in balanced bandpass filters. Next, Part 3 examines wideband and ultra-wideband (UWB) balanced bandpass filters with intrinsic common-mode suppression. Narrowband and dual-band balanced bandpass filters with intrinsic common-mode suppression are discussed in Part 4. Finally, Part 5 covers other balanced circuits, such as balanced power dividers and combiners, and differential-mode equalizers with common-mode filtering. In addition, the book: Explores a research topic of increasing interest due to the growing demand of balanced transmission lines and circuits in modern communication systems Includes contributions from prominent worldwide experts in the field Provides readers with the necessary knowledge to analyze and synthesize balanced filters and circuits Balanced Microwave Filters is an important text for R&D engineers, professionals, and specialists working on the topic of microwave filters. Post graduate students and Masters students in the field of microwave engineering and wireless communications, especially those involved in courses related to microwave filters, and balanced filters and circuits will also find it to be a vital resource.
