Polycrystalline Thin Films : Structure, Texture, Properties, and Applications
Author :
Publisher :
Page : 830 pages
File Size : 18,41 MB
Release : 1995
Category : Thin films
ISBN :
Author :
Publisher :
Page : 830 pages
File Size : 18,41 MB
Release : 1995
Category : Thin films
ISBN :
Author : D. M. Mattox
Publisher : Cambridge University Press
Page : 947 pages
File Size : 49,5 MB
Release : 2014-09-19
Category : Technology & Engineering
ISBN : 0080946585
This book covers all aspects of physical vapor deposition (PVD) process technology from the characterizing and preparing the substrate material, through deposition processing and film characterization, to post-deposition processing. The emphasis of the book is on the aspects of the process flow that are critical to economical deposition of films that can meet the required performance specifications. The book covers subjects seldom treated in the literature: substrate characterization, adhesion, cleaning and the processing. The book also covers the widely discussed subjects of vacuum technology and the fundamentals of individual deposition processes. However, the author uniquely relates these topics to the practical issues that arise in PVD processing, such as contamination control and film growth effects, which are also rarely discussed in the literature. In bringing these subjects together in one book, the reader can understand the interrelationship between various aspects of the film deposition processing and the resulting film properties. The author draws upon his long experience with developing PVD processes and troubleshooting the processes in the manufacturing environment, to provide useful hints for not only avoiding problems, but also for solving problems when they arise. He uses actual experiences, called ""war stories"", to emphasize certain points. Special formatting of the text allows a reader who is already knowledgeable in the subject to scan through a section and find discussions that are of particular interest. The author has tried to make the subject index as useful as possible so that the reader can rapidly go to sections of particular interest. Extensive references allow the reader to pursue subjects in greater detail if desired. The book is intended to be both an introduction for those who are new to the field and a valuable resource to those already in the field. The discussion of transferring technology between R&D and manufacturing provided in Appendix 1, will be of special interest to the manager or engineer responsible for moving a PVD product and process from R&D into production. Appendix 2 has an extensive listing of periodical publications and professional societies that relate to PVD processing. The extensive Glossary of Terms and Acronyms provided in Appendix 3 will be of particular use to students and to those not fully conversant with the terminology of PVD processing or with the English language.
Author : Yue Kuo
Publisher : The Electrochemical Society
Page : 428 pages
File Size : 10,1 MB
Release : 1995
Category : Technology & Engineering
ISBN : 9781566770941
Author : F. C. Matacotta
Publisher : World Scientific
Page : 369 pages
File Size : 37,93 MB
Release : 1995
Category : Science
ISBN : 9810221932
This book brings together detailed discussions by leading experts on the various innovative aspects of thin films growth, deposition and characterization techniques, and new thin film materials and devices. It addresses through the different viewpoints of the contributors, the major problem of thin films science - the relation between the energy of the condensing species and the resulting properties of the films. Some of the issues considered include energetic condensation, bombardment stabilization, pulsed electron beam ablation, orientation and self-organization of organic, ferroelectric and nanoparticle thin films. Several chapters focus on applications such as the recent developments in organic optoelectronics, large area electronic technology and superconducting thin film devices.
Author : Gan-Moog Chow
Publisher : Springer Science & Business Media
Page : 379 pages
File Size : 50,56 MB
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9401140529
Nanostructured films and coatings possess unique properties due to both size and interface effects. They find many applications in areas such as electronics, catalysis, protection, data storage, optics and sensors. The focus of the present book is on synthesis and processing; advanced characterization techniques; properties (including mechanical, chemical, electronic, thermal, catalytic, and magnetic); modelling of interlayer and intralayer interfaces; and applications.
Author : Pedro Barquinha
Publisher : John Wiley & Sons
Page : 348 pages
File Size : 26,90 MB
Release : 2012-03-15
Category : Technology & Engineering
ISBN : 1119967740
Transparent electronics is emerging as one of the most promising technologies for the next generation of electronic products, away from the traditional silicon technology. It is essential for touch display panels, solar cells, LEDs and antistatic coatings. The book describes the concept of transparent electronics, passive and active oxide semiconductors, multicomponent dielectrics and their importance for a new era of novel electronic materials and products. This is followed by a short history of transistors, and how oxides have revolutionized this field. It concludes with a glance at low-cost, disposable and lightweight devices for the next generation of ergonomic and functional discrete devices. Chapters cover: Properties and applications of n-type oxide semiconductors P-type conductors and semiconductors, including copper oxide and tin monoxide Low-temperature processed dielectrics n and p-type thin film transistors (TFTs) – structure, physics and brief history Paper electronics – Paper transistors, paper memories and paper batteries Applications of oxide TFTs – transparent circuits, active matrices for displays and biosensors Written by a team of renowned world experts, Transparent Oxide Electronics: From Materials to Devices gives an overview of the world of transparent electronics, and showcases groundbreaking work on paper transistors
Author :
Publisher : The Electrochemical Society
Page : 406 pages
File Size : 35,95 MB
Release : 2005
Category :
ISBN : 9781566774512
Author :
Publisher :
Page : 974 pages
File Size : 48,10 MB
Release : 1999
Category : Aeronautics
ISBN :
Author : Peter M. Burgess
Publisher : Elsevier
Page : 327 pages
File Size : 38,57 MB
Release : 2011-05-31
Category : Science
ISBN : 0857093835
Superplasticity is a state in which solid crystalline materials, such as some fine-grained metals, are deformed well beyond their usual breaking point. The phenomenon is of importance in processes such as superplastic forming which allows the manufacture of complex, high-quality components in such areas as aerospace and biomedical engineering.Superplasticity and grain boundaries in ultrafine-grained materials discusses a number of problems associated with grain boundaries in metallic polycrystalline materials. The role of grain boundaries in processes such as grain boundary diffusion, relaxation and grain growth is investigated. The authors explore the formation and evolution of the microstructure, texture and ensembles of grain boundaries in materials produced by severe plastic deformation.Written by two leading experts in the field, Superplasticity and grain boundaries in ultrafine-grained materials significantly advances our understanding of this important phenomenon and will be an important reference work for metallurgists and those involved in superplastic forming processes. - Discusses significant problems associated with grain boundaries in polycrystals incorporating structural superplasticity and grain boundary sliding - Assesses the role of grain boundaries in processes such as grain boundary diffusion, relaxation and grain growth - Explores the formation and evolution of the microstructure, texture and ensembles of grain boundaries in materials produced by severe plastic deformation
Author : Tomi Laurila
Publisher : Springer Science & Business Media
Page : 221 pages
File Size : 40,67 MB
Release : 2012-01-13
Category : Technology & Engineering
ISBN : 1447124693
Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.