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Power Integrity for Nanoscale Integrated Systems

Author : Masanori Hashimoto

Publisher : McGraw Hill Professional

Page : 417 pages

File Size : 45,8 MB

Release : 2014-03-07

Category : Technology & Engineering

ISBN : 0071787771

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Book Description

Proven methods for noise-tolerant nanoscale integrated circuit design This leading-edge guide discusses the impact of power integrity from a design perspective, emphasizing phenomena and problems induced by power integrity degradation and the latest design trends, including low-power design. Power Integrity for Nanoscale Integrated Systems describes how these problems can be forecast early in the design process and the countermeasures that can be used to address them, such as the inclusion of inductance and accurate modeling for PI analysis, as well as robust circuit design. Detailed examples and a case study on the IBM POWER7+ processor illustrate real-world applications of the techniques presented in this practical resource. Coverage includes: Significance of power integrity for integrated circuits Supply and substrate noise impact on circuits Clock generation and distribution with power integrity Signal and power integrity design for I/O circuits Power integrity degradation and modeling Lumped, distributed, and 3D modeling for power integrity Chip temperature and PI impact Low-power techniques and PI impact Power integrity case study using the IBM POWER7+ processor chip Carbon nanotube interconnects for power delivery



Power Integrity for Nanoscale Integrated Systems

Author : Raj Nair

Publisher : McGraw-Hill Education

Page : 0 pages

File Size : 11,73 MB

Release : 2014-03-19

Category : Technology & Engineering

ISBN : 9780071787765

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Book Description

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.Proven methods for noise-tolerant nanoscale integrated circuit design This leading-edge guide discusses the impact of power integrity from a design perspective, emphasizing phenomena and problems induced by power integrity degradation and the latest design trends, including low-power design. Power Integrity for Nanoscale Integrated Systems describes how these problems can be forecast early in the design process and the countermeasures that can be used to address them, such as the inclusion of inductance and accurate modeling for PI analysis, as well as robust circuit design. Detailed examples and a case study on the IBM POWER7+ processor illustrate real-world applications of the techniques presented in this practical resource. Coverage includes: Significance of power integrity for integrated circuits Supply and substrate noise impact on circuits Clock generation and distribution with power integrity Signal and power integrity design for I/O circuits Power integrity degradation and modeling Lumped, distributed, and 3D modeling for power integrity Chip temperature and PI impact Low-power techniques and PI impact Power integrity case study using the IBM POWER7+ processor chip Carbon nanotube interconnects for power delivery



e-Learning, e-Education, and Online Training

Author : Guanglu Sun

Publisher : Springer Nature

Page : 449 pages

File Size : 19,66 MB

Release : 2019-11-18

Category : Education

ISBN : 3030350959

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Book Description

This book constitutes the proceedings of the 5th International Conference on e-Learning, e-Education, and Online Training, eLEOT 2019, held in Kunming, China, in August 2019. The 46 revised full papers presented were carefully reviewed and selected from 99 submissions. They focus on most recent and innovative trends in this broad area, ranging from distance education to collaborative learning, from interactive learning environments to the modelling of STEM (Science, Technology, Mathematics, Engineering) curricula.



Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

Author : Yue Ma

Publisher : CRC Press

Page : 279 pages

File Size : 41,13 MB

Release : 2019-03-08

Category : Computers

ISBN : 0429680066

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Book Description

As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.



Electrical Modeling and Design for 3D System Integration

Author : Er-Ping Li

Publisher : John Wiley & Sons

Page : 394 pages

File Size : 50,29 MB

Release : 2012-04-10

Category : Technology & Engineering

ISBN : 0470623462

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Book Description

New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.



Circuits at the Nanoscale

Author : Krzysztof Iniewski

Publisher : CRC Press

Page : 669 pages

File Size : 42,48 MB

Release : 2018-10-08

Category : Technology & Engineering

ISBN : 1351834657

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Book Description

Circuits for Emerging Technologies Beyond CMOS New exciting opportunities are abounding in the field of body area networks, wireless communications, data networking, and optical imaging. In response to these developments, top-notch international experts in industry and academia present Circuits at the Nanoscale: Communications, Imaging, and Sensing. This volume, unique in both its scope and its focus, addresses the state-of-the-art in integrated circuit design in the context of emerging systems. A must for anyone serious about circuit design for future technologies, this book discusses emerging materials that can take system performance beyond standard CMOS. These include Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP). Three-dimensional CMOS integration and co-integration with Microelectromechanical (MEMS) technology and radiation sensors are described as well. Topics in the book are divided into comprehensive sections on emerging design techniques, mixed-signal CMOS circuits, circuits for communications, and circuits for imaging and sensing. Dr. Krzysztof Iniewski is a director at CMOS Emerging Technologies, Inc., a consulting company in Vancouver, British Columbia. His current research interests are in VLSI ciruits for medical applications. He has published over 100 research papers in international journals and conferences, and he holds 18 international patents granted in the United States, Canada, France, Germany, and Japan. In this volume, he has assembled the contributions of over 60 world-reknown experts who are at the top of their field in the world of circuit design, advancing the bank of knowledge for all who work in this exciting and burgeoning area.



Peterson's Graduate Programs in Engineering & Applied Sciences, Aerospace/Aeronautical Engineering, Agricultural Engineering & Bioengineering, and Architectural Engineering 2011

Author : Peterson's

Publisher : Peterson's

Page : 288 pages

File Size : 25,98 MB

Release : 2011-05-01

Category : Study Aids

ISBN : 0768934796

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Book Description

Peterson's Graduate Programs in Engineering & Applied Sciences, Aerospace/Aeronautical Engineering, Agricultural Engineering & Bioengineering, and Architectural Engineering contains a wealth of information on colleges and universities that offer graduate work these exciting fields. The institutions listed include those in the United States and Canada, as well as international institutions that are accredited by U.S. accrediting bodies. Up-to-date information, collected through Peterson's Annual Survey of Graduate and Professional Institutions, provides valuable information on degree offerings, professional accreditation, jointly offered degrees, part-time and evening/weekend programs, postbaccalaureate distance degrees, faculty, students, degree requirements, entrance requirements, expenses, financial support, faculty research, and unit head and application contact information. Readers will find helpful links to in-depth descriptions that offer additional detailed information about a specific program or department, faculty members and their research, and much more. In addition, there are valuable articles on financial assistance, the graduate admissions process, advice for international and minority students, and facts about accreditation, with a current list of accrediting agencies.



Nano and Molecular Electronics Handbook

Author : Sergey Edward Lyshevski

Publisher : CRC Press

Page : 912 pages

File Size : 15,86 MB

Release : 2018-10-03

Category : Technology & Engineering

ISBN : 1420008145

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Book Description

There are fundamental and technological limits of conventional microfabrication and microelectronics. Scaling down conventional devices and attempts to develop novel topologies and architectures will soon be ineffective or unachievable at the device and system levels to ensure desired performance. Forward-looking experts continue to search for new paradigms to carry the field beyond the age of microelectronics, and molecular electronics is one of the most promising candidates. The Nano and Molecular Electronics Handbook surveys the current state of this exciting, emerging field and looks toward future developments and opportunities. Molecular and Nano Electronics Explained Explore the fundamentals of device physics, synthesis, and design of molecular processing platforms and molecular integrated circuits within three-dimensional topologies, organizations, and architectures as well as bottom-up fabrication utilizing quantum effects and unique phenomena. Technology in Progress Stay current with the latest results and practical solutions realized for nanoscale and molecular electronics as well as biomolecular electronics and memories. Learn design concepts, device-level modeling, simulation methods, and fabrication technologies used for today's applications and beyond. Reports from the Front Lines of Research Expert innovators discuss the results of cutting-edge research and provide informed and insightful commentary on where this new paradigm will lead. The Nano and Molecular Electronics Handbook ranks among the most complete and authoritative guides to the past, present, and future of this revolutionary area of theory and technology.



Graduate Programs in Engineering & Applied Sciences 2011 (Grad 5)

Author : Peterson's

Publisher : Peterson's

Page : 2072 pages

File Size : 48,2 MB

Release : 2011-05-01

Category : Education

ISBN : 076893091X

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Book Description

Peterson's Graduate Programs in Engineering & Applied Sciences contains a wealth of information on colleges and universities that offer graduate degrees in the fields of Aerospace/Aeronautical Engineering; Agricultural Engineering & Bioengineering; Architectural Engineering, Biomedical Engineering & Biotechnology; Chemical Engineering; Civil & Environmental Engineering; Computer Science & Information Technology; Electrical & Computer Engineering; Energy & Power engineering; Engineering Design; Engineering Physics; Geological, Mineral/Mining, and Petroleum Engineering; Industrial Engineering; Management of Engineering & Technology; Materials Sciences & Engineering; Mechanical Engineering & Mechanics; Ocean Engineering; Paper & Textile Engineering; and Telecommunications. Up-to-date data, collected through Peterson's Annual Survey of Graduate and Professional Institutions, provides valuable information on degree offerings, professional accreditation, jointly offered degrees, part-time and evening/weekend programs, postbaccalaureate distance degrees, faculty, students, degree requirements, entrance requirements, expenses, financial support, faculty research, and unit head and application contact information. As an added bonus, readers will find a helpful "See Close-Up" link to in-depth program descriptions written by some of these institutions. These Close-Ups offer detailed information about the specific program or department, faculty members and their research, and links to the program Web site. In addition, there are valuable articles on financial assistance and support at the graduate level and the graduate admissions process, with special advice for international and minority students. Another article discusses important facts about accreditation and provides a current list of accrediting agencies.



Intelligent System and Computing

Author : Yang Yi

Publisher : BoD – Books on Demand

Page : 296 pages

File Size : 26,99 MB

Release : 2020-04-29

Category : Computers

ISBN : 1838805222

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Book Description

The book “Intelligent System and Computing” reports the theory, mathematical models, algorithms, design methods, and applications of intelligent systems and computing. It covers various disciplines including computer and information science, electrical and computer engineering, natural sciences, economics, and neuroscience. The broad-ranging discussion covers the key disciplines in computational science and artificial intelligence as well as advances in neuromorphic computing, deep learning, the Internet of Things, computer vision, and many others. This volume provides both academics and professionals with a comprehensive overview of the field and presents areas for future research.