Index of Conference Proceedings


Book Description










Handbook of Photovoltaic Science and Engineering


Book Description

The most comprehensive, authoritative and widely cited reference on photovoltaic solar energy Fully revised and updated, the Handbook of Photovoltaic Science and Engineering, Second Edition incorporates the substantial technological advances and research developments in photovoltaics since its previous release. All topics relating to the photovoltaic (PV) industry are discussed with contributions by distinguished international experts in the field. Significant new coverage includes: three completely new chapters and six chapters with new authors device structures, processing, and manufacturing options for the three major thin film PV technologies high performance approaches for multijunction, concentrator, and space applications new types of organic polymer and dye-sensitized solar cells economic analysis of various policy options to stimulate PV growth including effect of public and private investment Detailed treatment covers: scientific basis of the photovoltaic effect and solar cell operation the production of solar silicon and of silicon-based solar cells and modules how choice of semiconductor materials and their production influence costs and performance making measurements on solar cells and modules and how to relate results under standardised test conditions to real outdoor performance photovoltaic system installation and operation of components such as inverters and batteries. architectural applications of building-integrated PV Each chapter is structured to be partially accessible to beginners while providing detailed information of the physics and technology for experts. Encompassing a review of past work and the fundamentals in solar electric science, this is a leading reference and invaluable resource for all practitioners, consultants, researchers and students in the PV industry.




Fundamentals of Microsystems Packaging


Book Description

LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing