Proceedings of the ... ASME Integrated Nanosystems Conference
Author :
Publisher :
Page : 132 pages
File Size : 23,56 MB
Release : 2005
Category : Nanostructured materials
ISBN :
Author :
Publisher :
Page : 132 pages
File Size : 23,56 MB
Release : 2005
Category : Nanostructured materials
ISBN :
Author : Akira Fujishima
Publisher : John Wiley & Sons
Page : 1098 pages
File Size : 12,23 MB
Release : 2023-05-03
Category : Technology & Engineering
ISBN : 3527824855
Handbook of Self-Cleaning Surfaces and Materials The first truly comprehensive work on this rapidly developing field in two volumes Self-cleaning surfaces are those that can be cleaned, for instance, by sun or rainwater, without human intervention. They are sometimes found in nature but developing man-made equivalents has been a major area of nanotechnology research in recent years. Self-cleaning tiles, glasses, paints, and textiles have been developed to date, and the number of applications for this technology is growing. Handbook of Self-Cleaning Surfaces and Materials provides a comprehensive overview of this field of study. It includes two volumes, with the first presenting the basic principles of the field and the second supplying specific examples and applications. It is a one-stop shop for anyone looking to familiarize themselves with this area of technological research, as well as for existing professionals who want a handy and thorough reference. Readers of the Handbook of Self-Cleaning Surfaces and Materials will also find: An editor and contributor team with decades of experience in both academic and industrial research Detailed treatment of subjects including TiO2 photocatalysis, hydrophobic self-cleaning surfaces, and more Figures throughout illustrating important concepts and chemical formulas Handbook of Self-Cleaning Surfaces and Materials is an essential resource for researchers and industry professionals in chemistry, surface physics, and materials science.
Author : Sujeet K. Sinha
Publisher : Springer Science & Business Media
Page : 276 pages
File Size : 27,66 MB
Release : 2013-08-27
Category : Technology & Engineering
ISBN : 3642369359
This book brings together recent developments in the areas of MEMS tribology, novel lubricants and coatings for nanotechnological applications, biomimetics in tribology and fundamentals of micro/nano-tribology. Tribology plays important roles in the functioning and durability of machines at small length scales because of the problems associated with strong surface adhesion, friction, wear etc. Recently, a number of studies have been conducted to understand tribological phenomena at nano/micro scales and many new tribological solutions for MEMS have been proposed.
Author :
Publisher :
Page : 216 pages
File Size : 17,9 MB
Release : 2007
Category : Microelectromechanical systems
ISBN :
Author : Yung-cheng Lee
Publisher : World Scientific
Page : 363 pages
File Size : 44,54 MB
Release : 2018-01-03
Category : Technology & Engineering
ISBN : 9813229373
MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
Author :
Publisher :
Page : 1016 pages
File Size : 34,11 MB
Release : 2007
Category : Technology & Engineering
ISBN :
Author :
Publisher :
Page : 768 pages
File Size : 48,26 MB
Release : 2006
Category : Science
ISBN : 9780791847602
Author : C.P. Wong
Publisher : Springer Science & Business Media
Page : 761 pages
File Size : 34,77 MB
Release : 2009-12-23
Category : Technology & Engineering
ISBN : 1441900403
Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.
Author : Fumihiko Kimura
Publisher : Springer Science & Business Media
Page : 345 pages
File Size : 31,67 MB
Release : 2006-10-19
Category : Technology & Engineering
ISBN : 1846285593
This collection of papers, presented at the 11th International Conference on Precision Engineering, offers a broader global perspective on the challenges and opportunities ahead. The discussion encompasses leading-edge technologies and forecasts future trends. Coverage includes advanced manufacturing systems; ultra-precision- and micro-machining; nanotechnology for fabrication and measurement; rapid prototyping and production technology; new materials and advanced processes; computer-aided production engineering; manufacturing process control; production planning and scheduling, and much more.
Author : C. P.(Ching-Ping) Wong
Publisher : Springer Nature
Page : 582 pages
File Size : 38,92 MB
Release : 2021-03-17
Category : Technology & Engineering
ISBN : 303049991X
This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces; Covers nano chemistry for bio sensor/bio material device packaging. This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.