Book Description
Special topic volume with invited peer reviewed papers only.
Author : Rafal Abdank-Kozubski
Publisher : Trans Tech Publications Ltd
Page : 226 pages
File Size : 50,34 MB
Release : 2014-09-26
Category : Technology & Engineering
ISBN : 3038266493
Special topic volume with invited peer reviewed papers only.
Author : Aloke Paul
Publisher : Springer
Page : 543 pages
File Size : 47,70 MB
Release : 2014-07-16
Category : Science
ISBN : 331907461X
In this book basic and some more advanced thermodynamics and phase as well as stability diagrams relevant for diffusion studies are introduced. Following, Fick’s laws of diffusion, atomic mechanisms, interdiffusion, intrinsic diffusion, tracer diffusion and the Kirkendall effect are discussed. Short circuit diffusion is explained in detail with an emphasis on grain boundary diffusion. Recent advances in the area of interdiffusion will be introduced. Interdiffusion in multi-component systems is also explained. Many practical examples will be given, such that researches working in this area can learn the practical evaluation of various diffusion parameters from experimental results. Large number of illustrations and experimental results are used to explain the subject. This book will be appealing for students, academicians, engineers and researchers in academic institutions, industry research and development laboratories.
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Page : 1102 pages
File Size : 26,78 MB
Release : 1991
Category : Aeronautics
ISBN :
Author : Riccardo Ferro
Publisher :
Page : 596 pages
File Size : 36,55 MB
Release : 1995
Category : Alloys
ISBN :
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Publisher :
Page : 1362 pages
File Size : 33,56 MB
Release : 1986
Category : Aeronautics
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Page : 260 pages
File Size : 13,21 MB
Release : 1977
Category :
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Author : Karl J. Puttlitz
Publisher : CRC Press
Page : 1044 pages
File Size : 11,41 MB
Release : 2004-02-27
Category : Technology & Engineering
ISBN : 0203021487
This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif
Author : Louis Schlapbach
Publisher : Springer Science & Business Media
Page : 336 pages
File Size : 27,43 MB
Release : 2006-01-21
Category : Technology & Engineering
ISBN : 3540464336
The topic of hydrogen in an on metals and alloys is important in a number ofdisciplines including solid-state physics, materials science, physical chemistry, and energy technology. This volume treats the dynamics of hydrogen in intermetallic compounds, surface properties, kinetics, and applications of metal hydrides in energy technology. In addition, selected experimental methods are described. The introductory chapter will enable non-specialists to gain an overall picture of the field and to appreciate the relevant scientific issue. The companion volume, Hydrogene in Intermetallic Compounds I, was published as Vol. 63 of Topics in Applied Physics.
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Page : 260 pages
File Size : 37,64 MB
Release : 1977
Category :
ISBN :
Author : Rafał Kozubski
Publisher :
Page : 770 pages
File Size : 33,72 MB
Release : 1998
Category : Intermetallic compounds
ISBN :